• 디자인학연구
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• 제9권
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• pp.1101-1114
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• 1994

As of today-half a century has passed after 1945, the liberation from Japanese imperialism-it's significant to introspect our culture. On the one hand our culture has succeeded due to the peculiar history, but on the other hand it hasn't. So to speak, it has gained in Quantity but lost in Quality. There are keen, international competition and exchange in the modern culture. So the Qualitive success of modern design depends on if it had an original character or not. According to Korean rapid industrialization, technological extence, and economic growth, the export has increased greatly, but package design hasn't been match for them. Korean expoters have been meeting with cutthroat competition in world market. Under these circumstances it's very important that we have a real understand and interest in our culture, we strengthen the competitive power of home products with good package design. This is our age of not home market but world market. We live in an age when design wins, so that we have to develop the good design native to Korea. Many designers have proposed their opinions with the characteristic designs, but it has been only a fragmentary and passive method. We must seek for the new method more positively. The effective and proper method resolves itself into the following four points. First, to understand Korean history and culture. Second, to have the exact grip of this economic situation. Third, to promote the national emotion. Fourth, in conclusion, to accord the package design with them. We cannot put off this task to overcome the cultural subordination, to place Korea on a firm cultural basis in the world, and to contribute to the cultural exchange of package design. First, to understand Korean history and culture. Second, to have the exact grip of this economic situation. Third, to promote the national emotion. Fourth, in conclusion, to accord the package design with them. We cannot put off this task to overcome the cultural subordination, to place Korea on a firm cultural basis in the world, and to contribute to the cultural exchange of package design.

• 디지털융복합연구
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• 제15권9호
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• pp.479-486
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• 2017

이 연구는 코즈 브랜딩의 개념이 적용된 화장품의 패키지 디자인을 통해 소비자의 선호도와 가치관을 분석하여 니즈를 파악해 소비자를 만족시킬 수 있는 패키지 디자인을 제안하는 데에 목적을 둔다. 화장품 구매 시 패키지 디자인을 구매요인에서 중요시하는 실험집단을 모집하여 코즈 브랜드 제품과 일반 브랜드 제품을 비교하여 설문과 심층인터뷰를 진행하였다. 1차 실험은 패키지 디자인 선호유형 분석 문항에서 추출하여 인지적, 감성적, 행동적 반응으로 분류한 문항을 통해서 총 31명을 대상으로 설문을 실시하였고, 2차 실험은 Sheth의 소비가치 기준에서 4가지를 발췌하여 만든 질문을 통해 총 6명을 대상으로 심층 인터뷰를 진행하였다. 실험 결과, 소비자들은 제품의 정보를 빠르고 정확하게 파악할 수 있는 디자인을 선호하였다. 특히 코즈 브랜드 제품인지 파악하기가 쉽지 않기 때문에 사회적으로 어떻게 도움이 되는지 패키지에 명시되어야 할 것이다.

• 한국정밀공학회지
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• 제15권1호
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• pp.43-50
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• 1998

The purpose of the paper is to protect the damage of plastic IC package with searching the cause of the fracture due to the delamination and crack when the encapsulant of plastic IC package is on viscoelastic behavior with the effect of creep on high temperature, The model for analysis is the plastic SOJ package with dimpled diepad in the IR soldering process of surface mounting technology. The risk of delamination with calculating the distribution of viscoelastic thermal stress in the package without the crack in the surface mounting process is checked. The package model with the perfect delamination between chip and diepad is chosen to estimate the resistance against fracture in thermal loading with calculating C (t)-integrals according to the change of the design. The optimum design to depress the delamination and crack is presented.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2003년도 International Symposium
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• pp.109-119
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• 2003

o In order to start SIP Project .Marketing (& ASIC team) should present biz planning, schedule, device/SIP specs., in SIP TFT prior to request SIP development for package development project. .In order to prevent (PCB) revision, test, burn-in, & quality strategy should be fixed by SIP TFT (PE/Test, QA) prior to request for PKG development. .Target product price/cost, package/ test cost should be delivered and reviewed. o Minimum Information for PCB Design, Package Size, and Cost .(Required) package form factor: size, height, type (BGA, QFP), Pin count/pitch .(Estimated) each die size including scribe lane .(Estimated) pad inform. : count, pitch, configuration(in-line/staggered), (open) size .(Estimated) each device (I/O & Core) power (especially for DRAM embedded SIP) .SIP Block diagram, and net-list using excel sheet format o Why is the initial evaluation important\ulcorner .The higher logic power resulted in spec. over of DRAM Tjmax. This caused business drop longrightarrow Thermal simulation of some SIP product is essential in the beginning stage of SIP business planning (or design) stage. (i.e., DRAM embedded SIP) .When SIP is developed using discrete packages, the I/O driver Capa. of each device may be so high for SIP. Since I/O driver capa. was optimized to discrete package and set board environment, this resulted in severe noise problem in SIP. longrightarrow In this case, the electrical performance of product (including PKG) should have been considered (simulated) in the beginning stage of business planning (or design).

• 대한전자공학회:학술대회논문집
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• 대한전자공학회 2001년도 하계종합학술대회 논문집(2)
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• pp.133-136
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• 2001

A new package design method to reduce resonance effect due to an IC package is represented. Frequency-variant circuit model of the power/ground plane was developed to accurately reflect the resonance. The circuit model is benchmarked with a full wave simulation, thereby verifying its accuracy. Then it was shown that the proposed technique can efficiently reduce the resonance due to the IC package.

• JSTS:Journal of Semiconductor Technology and Science
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• 제1권4호
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• pp.216-231
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• 2001

Several methods for improving device yields and characteristics have been studied by IC manufacturers, as the options for programming components become diversified through the introduction of novel processes. Especially, the sequential repair steps on wafer level and package level are essentially required in DRAMs to improve the yield. Several repair methods for DRAMs are reviewed in this paper. They include the optical methods (laser-fuse, laser-antifuse) and the electrical methods (electrical-fuse, ONO-antifuse). Theses methods can also be categorized into the wafer-level(on wafer) and the package-level(post-package) repair methods. Although the wafer-level laser-fuse repair method is the most widely used up to now, the package-level antifuse repair method is becoming an essential auxiliary technique for its advantage in terms of cost and design efficiency. The advantages of the package-level antifuse method are discussed in this paper with the measured data of manufactured devices. With devices based on several processes, it was verified that the antifuse repair method can improve the net yield by more than 2%~3%. Finally, as an illustration of the usefulness of the package-level antifuse repair method, the repair method was applied to the replica delay circuit of DLL to get the decrease of clock skew from 55ps to 9ps.

• 한국정밀공학회지
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• 제17권12호
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• pp.88-93
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• 2000

The reduction of the cushion material such as Expanded Polystyrene (EPS) is one of the urgent tasks of the package design process in home electrical appliances considering environmental protection. EPS reduction often causes the structural damage of products, which must be protected in the environment of transportation. CAE simulation can help the efficient package design with low material cost. The mechanical drop simulation of packaged product was performed with commercial FEM code and Taguchi approach was used partially to determine the dominant design parameters. As results of this study, about 20% reduction of EPS was accomplished in the monitor package design.

• 산업공학
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• 제11권2호
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• pp.125-137
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• 1998

A new vehicle design approach coupled with an ergonomic human model was proposed in the study. The seating package layout of a vehicle is very important to the driving comfort, and it has been one of the primary ergonomic research areas since the past 30 years. The diverse and interrelated design factors of seating package layout in the limited workspace make designers often neglect many parameters related with drivers which differ in their anthropometric characteristics. It is due to the lack of the proper tools by which the designer can easily apply several ergonomic design guidelines to the vehicle design. In this study. an iterative package layout procedure was developed, and the effectiveness of an ergonomic human model was examined in this procedure. A discomfort function was developed for the quantitative evaluation of the driving posture. This study clearly demonstrates that the package layout using an ergonomic human model is very helpful to improve the usability and driving comfort of the drivers or passengers.

• 산업진흥연구
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• 제2권1호
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• pp.31-38
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• 2017

본 연구는 에너지음료시장 활성화를 위한 패키지디자인 연구전략에 관한 탐색적 연구로써 2016년10월 24일부터 28일까지 국내외에 판매 중인 에너지음료의 사례분석과 에너지음료 패키지디자인의 선호도를 연구하였다. 연구 결과 첫째, 에너지음료의 패키지디자인 중 색상에 대한 사항으로 파란색과 붉은색의 두 가지 색상에 대하여 선호도가 높게 나타났다. 특히 파란색은 62.8%로 가장 선호도가 높았으며 색상을 선택한 이유로는 에너지음료를 떠올리는 이미지이며 눈에 잘 띄어서 그렇다는 응답이 높았다. 둘째, 에너지음료의 포장재질에 대한 선호도를 조사한 결과 대부분 캔과 유리재질을 선택하였으며 그 중 캔에 대해 가장 선호했다. 셋째, 캘리그래피에 대한 선호도 조사한 결과 거친 이미지를 선호하여 에너지음료가 주는 역동적인 이미지로 인한 것으로 보여 진다. 넷째, 패키지디자인 인식은, 어느 한 요소보다는 전체적인 이미지를 중시하였다. 연구의 한계점은 연구 조사 대상이 대전, 충남지역 대학생만 대상으로 연구하여, 향후 패키지디자인의 전반적인 요소와 다양한 연구 대상을 분류하여 에너지음료의 주요 소비층 및 소비지역을 고려한 연구가 이루어져야 할 것이다. 본 연구에서는 패키지디자인은 어느 한 요소를 중요시하기 보다는 전체적인 제품 이미지에 맞게 패키지디자인 전략이 필요하다는데 연구의 시사점과 의미가 있다.

• 한국디자인학회:학술대회논문집
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• 한국디자인학회 2004년도 추계 학술발표대회 논문집
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• pp.92-93
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• 2004