• 조명전기설비학회논문지
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• 제26권2호
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• pp.1-7
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• 2012

LED package with 4[mm]-height mold was manufactured and the surface temperature was measured directly using both thermocouple and thermal infrared (IR) camera. FVM simulation was conducted to estimate the surface temperature of the same LED package under the same condition, by which the accuracy of the simulation was secured. Then, the effects of the height and thermal conductivity of the mold on the junction temperature of the LED package were investigated by FVM simulation. The results showed that the junction temperature decreased by 10[$^{\circ}C$] when the mold height was 3~5[mm], but the thermal conductivity of the mold didn't affect the junction temperature significantly.

• 대한인간공학회지
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• 제18권2호
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• pp.57-69
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• 1999

The primary objective of this research was to suggest the design dimensions of automotive seating package that has an important effect upon seating package design. To conduct the research, a set of manikin dimensions that are representative for Korean was determined by using a statistical scheme. With these dimensions, we generated nine manikins for male and female, respectively. Also, the preferred driving posture was investigated using the experimental setup. To find each joint angle for subjects, a driving monitoring system was developed and a three dimensional motion analysis system was employed. The joint angle for the subject was established and compared with related literature. With the generated manikins and each joint angle, the driving posture was simulated by using SAFEWORK that is a program to generate manikins. The positions and adjustable ranges from the accelerator heel point to the hip point and the steering wheel center point that are important variables in order to design seating package were suggested. Further research is needed to determine the seating package dimensions three dimensionally.

• 한국식품저장유통학회지
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• 제2권2호
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• pp.285-291
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• 1995

This study was performed to investigate the optimum moisture content and the best packaging method of dried persimmons for long term storage at room temperature. The package material to be used were 0.05mm polyethylene film, Wrap film, 0.08mm LDPE film exchanged nitrogen gas, and non package for untreated control. Before the storage, the initial moisture contents of dried persimmons were treated with 40%, 35% and 30%, respectively; 40% as traditional dryness, 35% as extending dry period one more week, and 30% as for two more weeks. The best package method was 0.08mm LDPE film exchanged nitrogen gas, and the optimum moisture control was 35%

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2004년도 추계학술대회 논문집 Vol.17
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• pp.53-56
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• 2004

This paper presents the improved burn-in method for the reliability of SRAM in MCP Semiconductor reliability is commonly improved through the burn-in process. Reliability problem is more significant in the Multi Chip Package, because of including over two devices in a package. In the SRAM-based Multi Chip Package, the failure of SRAM has a large effect on the yield and quality of the other chips - Flash Memory, DRAM, etc. So, the quality of SRAM must be guaranteed. To improve the quality of SRAM, we applied the improved wafer level burn-in process using multi cell selection method in addition to the current used methods. That method is effective in detecting special failure. Finally, with the composition of some kinds of methods, we could achieve the high qualify of SRAM in Multi Chip Package.

• 제어로봇시스템학회:학술대회논문집
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• 제어로봇시스템학회 1988년도 한국자동제어학술회의논문집(국제학술편); 한국전력공사연수원, 서울; 21-22 Oct. 1988
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• pp.1028-1032
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• 1988

The purpose of this paper is the development of a fully integrated simulation package for industrial robot. The simulation package consists of kinematics, dynamics, and control. The kinematics contains trajectory plans and inverse kinematics. The dynamics combines manipulator dynamics and actuator dynamics including the effect of payloads and viscous frictions. The control is a hardware oriented scheme which contains position controller, velocity controller, current controller, and PWM generator. Thus, the simulation package can be used not only for theoretical purposes but also for development purposes in industry. Using this package, the characteristics and performances of the SCARA robot, which has been developed in GSIS, are investigated.

• 한국포장학회지
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• 제13권3_4호
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• pp.113-120
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• 2007

The method to characterize the fresh produce respiration was presented with possible application of modified atmosphere package design. Particularly the respiration model based on enzyme kinetics was introduced as function of oxygen and carbon dioxide concentrations. The method to estimate the equilibrated package atmosphere for any package conditions was presented by incorporation of $O_2$ and $CO_2$ permeabilities of the packaging film. Temperature dependences for fresh produce respiration and gas permeation were given by Arrhenius equation and then used to analyze the effect of temperature on the package atmosphere. An example analysis was presented for better understanding of the concept.

• Journal of Welding and Joining
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• 제17권6호
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• pp.78-83
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• 1999

Solder joint is the weakest part which connects in mechanically and electronically between package body and PCB(Printed Circuit Board). Recently, the reliability of solder joint become the most critical issue in surface mounted technology. The solder joint interconnection between plastic package and PCB is susceptible to shear stress during thermal storage due to the mismatch in coefficient of thermal expansion between plastic package and PCB. A general computational approach to determine the effect of solder joint shape on the fatigue life presented. The thermal fatigue life was estimated from the engelmaier equation which was obtained from the temperature cycling loading($-65^{\circ}C$ to $150^{\circ}C$). As result of the simulation, TSOP structure has the shortest thermal fatigue life and the same structure Copper lead has 2.5 times as much fatigue life as Alloy 42 lead. In BGA structure, fatigue life time extended 80 times when underfill material exists.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2012년도 추계학술대회 논문집
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• pp.345-346
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• 2012

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2010년도 춘계학술대회 논문집
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• pp.665-666
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• 2010

• 한국음향학회지
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• 제38권2호
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• pp.200-206
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• 2019

본 연구에서는 예인 음탐기용 음향패키지에 대한 수신전압감도 특성을 분석하기 위해 수치해석과 실험계획법을 적용하였다. 수치해석 결과는 초기 설계된 음향패키지의 구조 공진 모드 특성으로 인한 수신전압감도 변화를 보여준다. 수신전압감도 편차를 줄이기 위해 도출된 음향패키지 설계 변수의 영향은 실험계획법을 통해 분석하였다. 수신전압감도 편차는 수중청음기 쉴드캔 두께(t)의 변화에 가장 민감한 것을 확인하였다. 수조시험 결과 실험계획법에 의해 도출된 음향패키지는 수신전압감도 편차가 감소됨을 확인하였다.