• Journal of Advanced Marine Engineering and Technology
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• v.39 no.8
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• pp.801-806
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• 2015

The experimental analysis of a crevice-type vapor chamber heat pipe (CVCHP) is investigated. The heat source of the CVCHP is a high-power light-emitting diode (LED). The CVCHP, which exhibits a bubble pumping effect, is used for heat dissipation in a high-heat-flux system. The working fluid is R-141b, and its charging ratio was set at 60 vol.% of the vapor chamber in a heat pipe. The total thermal conductivity of the falling-liquid-film-type model, which was a modified model, was 24% larger than that of the conventional model in the LED package. Flow visualization results indicated that bubbles grew larger as they combined. These combined bubbles pushed the working fluid to the top, partially wetting the heat-transfer area. The thermal resistance between the vapor chamber and tube in the modified design decreased by approximately 32%. The overall results demonstrated the better heat dissipation upon cooling of the high-power LED package.

• Journal of the Microelectronics and Packaging Society
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• v.22 no.3
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• pp.57-65
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• 2015

Electronic packages consist of various materials, and as temperature changes, warpage occurs because of the difference in coefficient of thermal expansion. Shadow $moir{\acute{e}}$ is non-contact, whole field measurement technique for out-of-plane displacement. However, the technique has low sensitivity above $50{\mu}m/fringe$, it is not adequate for the warpage measurement in some circumstance. In this paper, by applying phase shifting process to the traditional shadow $moir{\acute{e}}$, measurement system having enhanced sensitivity of $12.5{\mu}m/fringe$ is constructed. Considering Talbot effect, the measurement is carried out in the half Talbot area. Shadow fringe pattern having four times enhanced sensitivity is obtained by the image process with four shadow fringes. The measurement technique is applied to the fibered package substrate and coreless package substrate for measuring warpages at room temperature and at about $100^{\circ}C$.

• Corrosion Science and Technology
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• v.6 no.6
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• pp.282-285
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• 2007

Smaller size and higher integration of electronic systems make narrower interconnect pitch not only in chip-level but also in package-level. Moreover electronic systems are required to operate in harsher conditions, that is, higher current / voltage, elevated temperature / humidity, and complex chemical contaminants. Under these severe circumstances, electronic components respond to applied voltages by electrochemically ionization of metals and conducting filament forms between anode and cathode across a nonmetallic medium. This phenomenon is called as the electrochemical migration. Many kinds of metal (Cu, Ag, SnPb, Sn etc) using in electronic packages are failed by ECM. Eutectic SnPb which is used in various electronic packaging structures, that is, printed circuit boards, plastic-encapsulated packages, organic display panels, and tape chip carriers, chip-on-films etc. And the material for soldering (eutectic SnPb) using in electronic package easily makes insulation failure by ECM. In real PCB system, not only metals but also many chemical species are included. And these chemical species act as resources of contamination. Model test systems were developed to characterize the migration phenomena without contamination effect. The serpentine-shape pattern was developed for analyzing relationship of applied voltage bias and failure lifetime by the temperature / humidity biased(THB) test.

• The Journal of the Korea Contents Association
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• v.22 no.4
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• pp.301-313
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• 2022

This study aims to investigate the causal relationship between variables of UTAUT2 model and the acceptance intention by Netflix and Wavve intention to adopt and acceptance intent by plan package. The results indicate that (1)First, the intention of Netflix adoption was influenced by performance expectancy, effort expectancy, hedonic motivation, price value, and habit; (2) the intention of wave adoption was influenced by performance expectancy, social influence, price value, and habit. (3)in the acceptance intention of Netflix's acceptance intent by plan package, price value and habit, performance expectancy and habit influenced on the acceptance intent of premium plan, and did not affect the standard plan; (4) in the acceptance intention of the basic plan by the Wavve plan, the price value had a negative effect on the acceptance intention of the basic plan, and the habit had a positive effect.The social impact on the acceptance intention of the standard rate plan, the price value and habit of the acceptance intention of the premium rate plan were affected.

• The Korean Journal of Franchise Management
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• v.14 no.1
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• pp.39-55
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• 2023

Purpose: This study is designed to grasp how consumers' beliefs about the lunch box attributes such as healthiness, diversity, price, hygiene, and package eco-friendliness affect consumers' perceived value and purchasing behavior. Research design, data, and methodology: The data were collected from 615 respondents composed of men and women aged 20 to 59 who purchased lunch box products and were sampled using the quota sampling method. An online survey was conducted. The data were analyzed using the measurement model and structural equation model assessment with SPSS 24 and SmartPLS 4.0. Results: First, healthiness, diversity, hygiene, and the price had a significant positive effect on the perceived functional value of consumers, but package eco-friendliness did not significantly affect functional value. On the other hand, healthiness, diversity, price, and package eco-friendliness were found to have a positive impact on consumers' perceived emotional value, but hygiene was found to have no significant effect on emotional value. It was found that functional and emotional values significantly positively affected repurchase intention. Conclusions: This study confirmed that consumers' belief in the product attributes of franchise lunch boxes influenced consumers' perceived value, which thus formed the attitude of consumers and showed a relationship that affects repurchase intention. At the end of this paper, the managerial implications for the franchise lunch box brand, the limitations of this study, and future research directions were presented.

• Korean Journal of Food Science and Technology
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• v.20 no.6
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• pp.737-741
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• 1988

The storage stabilities of philipines' bananas were investigated according to the storage pretreatments and packaging methods during 60 days storage at $13^{\circ}C$. The better storage stability was got in bananas packaged with 60{\mu}m low density polyethylene (PE) film inside the carton box than those without inside pack. Radiation gave the adverse effects on bananas' storage stabilities. Shelf-life of bananas in PE package was 60 days, but that of radiated bananas was only 20 days. And shelf-life of bananas in no inner pack was 20 days. Soluble solid content of bananas packaged with PE film was 17 Brix degree after 60 days storage, but that with no inner package was around 20 Brix after 20 days. Color was below 3 in color chart after 60 days storage and hardness was rapidly decreased from 40 days in bananas packaged with PE film, but color was became to 3 color after 30 days and hardness was rapidly decreased after 20 days in bananas without inner package. Percentage of deteriorated bananas were below 3% in PE films after 60 days storage, but 100% after 40 days in bananas without inner package.

• Korean Journal of Food Science and Technology
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• v.30 no.2
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• pp.461-467
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• 1998

Two hundred grams of fresh jujubes at whitish green maturity was packaged in the film bags of different gas permeabilities and stored at 0 and $5^{\circ}C$. Through the storage package atmosphere and jujube quality were monitored. Package of $30\;{\mu}m\;CPP$ film resulted in anaerobic conditions of $O_2$ content below 1% and $CO_2$ content above 15%, and caused off-flavor at both temperatures within 4 weeks. Package of $60\;{\mu}m\;LDPE$ film also showed potential risk of anaerobic condition development within 5 weeks, because of high $CO_2$ and/or low $O_2$ concentration at 0 and $5^{\circ}C$. Microperforated film packages could preserve quality of jujubes for 10 and 7 weeks at 0 and $5^{\circ}C$, respectively, which were significantly longer than shelf lives for perforated air pack and hermetically sealed packages.

• The Journal of Korean Medicine
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• v.36 no.3
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• pp.111-125
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• 2015

Objectives: The purpose of this study was to analyze the current cases of oriental medical injury relief data from Korea Consumer Agency (KCA), and to report the current change of oriental medical disputes pattern. Methods: Oriental medical injury relief cases processed by KCA from January 2010 to February 2015 were collected and analyzed. Results: 149 Oriental medical injury relief cases from KCA were analyzed for the study. The highest number that had been relieved was 43 in 2014. In monthly status, 18 case in September was The highest. According to the record, the bigger city had the bigger amount of relief cases which was 53(Seoul), 43(Gyeng-gi), 11(Busan) and so on. In age categories, 30s had the highest number of injury relief cases. The injury relief cases of package program had been rapidly increasing since 2013. Cancellation was the dominant claims cause of package program and consumer required the refund of prepayment. Breast augmentation was the majority treatment type of injury relief cases of package program. Average prepayment of package program was \3,166,085. Conclusions: This study finded that the major cause of oriental medical dispute was changed from side effect of clinical treatment to patient's satisfaction of medical service.

• Korean Journal of Materials Research
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• v.22 no.11
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• pp.587-590
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• 2012

Recently, the demand for the miniaturization of package substrates has been increasing. Technical innovation has occurred to move package substrate manufacturing steps into CMP applications. Electroplated copper filled trenches on the substrate need to be planarized for multi-level wires of less than $10{\mu}m$. This paper introduces a chemical mechanical planarization (CMP) process as a new package substrate manufacturing step. The purpose of this study is to investigate the effect of surfactant on the dishing and erosion of Cu patterns with the lines and spaces of around $10/10{\mu}m$ used for advanced package substrates. The use of a conventional Cu slurry without surfactant led to problems, including severe erosion of $0.58{\mu}m$ in Cu patterns smaller than $4/6{\mu}m$ and deep dishing of $4.2{\mu}m$ in Cu patterns larger than $14/16{\mu}m$. However, experimental results showed that the friction force during Cu CMP changed to lower value, and that dishing and erosion became smaller simultaneously as the surfactant concentration became higher. Finally, it was possible to realize more globally planarized Cu patterns with erosion ranges of $0.22{\mu}m$ to $0.35{\mu}m$ and dishing ranges of $0.37{\mu}m$ to $0.69{\mu}m$ by using 3 wt% concentration of surfactant.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.06a
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• pp.183-184
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• 2007

A 40 Gb/s transimpedance amplifier IC was designed and fabricated with a InP/InGaAs HBTs technology. In this study, we interconnect 40Gbps trans impedance amplifier IC to a duroid substrate by a flip chip bonding instead of conventional wire bonding for interconnection. For flip chip bonding, we developed fine pitch bump with the $70{\mu}m$ diameter and $150{\mu}m$ pitch using WLP process. To study the effect of WLP, electrical performance was measured and analyzed in wafer and package module using WLP. The Small signal gains in wafer and package module were 7.24 dB and 6.93dB respectively. The difference of small signal gain in wafer and package module was 0.3dB. This small difference of gain is due to the short interconnection length by bump. The characteristics of return loss was under -10dB in both wafer and module. So, WLP process can be used for millimeter wave GaAs MMIC with the fine pitch pad and duroid substrate can be used in flip chip bonding process.