• Archives of design research
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• v.9
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• pp.1101-1114
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• 1994

As of today-half a century has passed after 1945, the liberation from Japanese imperialism-it's significant to introspect our culture. On the one hand our culture has succeeded due to the peculiar history, but on the other hand it hasn't. So to speak, it has gained in Quantity but lost in Quality. There are keen, international competition and exchange in the modern culture. So the Qualitive success of modern design depends on if it had an original character or not. According to Korean rapid industrialization, technological extence, and economic growth, the export has increased greatly, but package design hasn't been match for them. Korean expoters have been meeting with cutthroat competition in world market. Under these circumstances it's very important that we have a real understand and interest in our culture, we strengthen the competitive power of home products with good package design. This is our age of not home market but world market. We live in an age when design wins, so that we have to develop the good design native to Korea. Many designers have proposed their opinions with the characteristic designs, but it has been only a fragmentary and passive method. We must seek for the new method more positively. The effective and proper method resolves itself into the following four points. First, to understand Korean history and culture. Second, to have the exact grip of this economic situation. Third, to promote the national emotion. Fourth, in conclusion, to accord the package design with them. We cannot put off this task to overcome the cultural subordination, to place Korea on a firm cultural basis in the world, and to contribute to the cultural exchange of package design. First, to understand Korean history and culture. Second, to have the exact grip of this economic situation. Third, to promote the national emotion. Fourth, in conclusion, to accord the package design with them. We cannot put off this task to overcome the cultural subordination, to place Korea on a firm cultural basis in the world, and to contribute to the cultural exchange of package design.

• Journal of Digital Convergence
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• v.15 no.9
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• pp.479-486
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• 2017

The purpose of this study is to analyze the preference and value of consumers through the package design of cosmetics with the concept of cause branding, and to propose a package design that can satisfy consumers' needs. I have recruited an experimental group that emphasizes the importance of package design in purchasing cosmetics. And Survey and in-depth interviews were conducted by comparing cause brand's product with general brand's product. In the first experiment, the items were classified into cognitive, emotional, and behavioral responses and a total of 31 subjects were surveyed. In the second experiment, six interviewees were interviewed through a questionnaire prepared by extracting 4 items from Sheth 's consumption value standard. As a result of the experiment, consumers preferred a design that can quickly and accurately grasp the information of the product. Especially, it is not easy to know whether it is a cause brand's product. So It should be stated in the package how it will be socially beneficial.

• Journal of the Korean Society for Precision Engineering
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• v.15 no.1
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• pp.43-50
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• 1998

The purpose of the paper is to protect the damage of plastic IC package with searching the cause of the fracture due to the delamination and crack when the encapsulant of plastic IC package is on viscoelastic behavior with the effect of creep on high temperature, The model for analysis is the plastic SOJ package with dimpled diepad in the IR soldering process of surface mounting technology. The risk of delamination with calculating the distribution of viscoelastic thermal stress in the package without the crack in the surface mounting process is checked. The package model with the perfect delamination between chip and diepad is chosen to estimate the resistance against fracture in thermal loading with calculating C (t)-integrals according to the change of the design. The optimum design to depress the delamination and crack is presented.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2003.09a
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• pp.109-119
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• 2003

o In order to start SIP Project .Marketing (& ASIC team) should present biz planning, schedule, device/SIP specs., in SIP TFT prior to request SIP development for package development project. .In order to prevent (PCB) revision, test, burn-in, & quality strategy should be fixed by SIP TFT (PE/Test, QA) prior to request for PKG development. .Target product price/cost, package/ test cost should be delivered and reviewed. o Minimum Information for PCB Design, Package Size, and Cost .(Required) package form factor: size, height, type (BGA, QFP), Pin count/pitch .(Estimated) each die size including scribe lane .(Estimated) pad inform. : count, pitch, configuration(in-line/staggered), (open) size .(Estimated) each device (I/O & Core) power (especially for DRAM embedded SIP) .SIP Block diagram, and net-list using excel sheet format o Why is the initial evaluation important\ulcorner .The higher logic power resulted in spec. over of DRAM Tjmax. This caused business drop longrightarrow Thermal simulation of some SIP product is essential in the beginning stage of SIP business planning (or design) stage. (i.e., DRAM embedded SIP) .When SIP is developed using discrete packages, the I/O driver Capa. of each device may be so high for SIP. Since I/O driver capa. was optimized to discrete package and set board environment, this resulted in severe noise problem in SIP. longrightarrow In this case, the electrical performance of product (including PKG) should have been considered (simulated) in the beginning stage of business planning (or design).

• Proceedings of the IEEK Conference
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• 2001.06b
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• pp.133-136
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• 2001

A new package design method to reduce resonance effect due to an IC package is represented. Frequency-variant circuit model of the power/ground plane was developed to accurately reflect the resonance. The circuit model is benchmarked with a full wave simulation, thereby verifying its accuracy. Then it was shown that the proposed technique can efficiently reduce the resonance due to the IC package.

• JSTS:Journal of Semiconductor Technology and Science
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• v.1 no.4
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• pp.216-231
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• 2001

Several methods for improving device yields and characteristics have been studied by IC manufacturers, as the options for programming components become diversified through the introduction of novel processes. Especially, the sequential repair steps on wafer level and package level are essentially required in DRAMs to improve the yield. Several repair methods for DRAMs are reviewed in this paper. They include the optical methods (laser-fuse, laser-antifuse) and the electrical methods (electrical-fuse, ONO-antifuse). Theses methods can also be categorized into the wafer-level(on wafer) and the package-level(post-package) repair methods. Although the wafer-level laser-fuse repair method is the most widely used up to now, the package-level antifuse repair method is becoming an essential auxiliary technique for its advantage in terms of cost and design efficiency. The advantages of the package-level antifuse method are discussed in this paper with the measured data of manufactured devices. With devices based on several processes, it was verified that the antifuse repair method can improve the net yield by more than 2%~3%. Finally, as an illustration of the usefulness of the package-level antifuse repair method, the repair method was applied to the replica delay circuit of DLL to get the decrease of clock skew from 55ps to 9ps.

• Journal of the Korean Society for Precision Engineering
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• v.17 no.12
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• pp.88-93
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• 2000

The reduction of the cushion material such as Expanded Polystyrene (EPS) is one of the urgent tasks of the package design process in home electrical appliances considering environmental protection. EPS reduction often causes the structural damage of products, which must be protected in the environment of transportation. CAE simulation can help the efficient package design with low material cost. The mechanical drop simulation of packaged product was performed with commercial FEM code and Taguchi approach was used partially to determine the dominant design parameters. As results of this study, about 20% reduction of EPS was accomplished in the monitor package design.

• IE interfaces
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• v.11 no.2
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• pp.125-137
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• 1998

A new vehicle design approach coupled with an ergonomic human model was proposed in the study. The seating package layout of a vehicle is very important to the driving comfort, and it has been one of the primary ergonomic research areas since the past 30 years. The diverse and interrelated design factors of seating package layout in the limited workspace make designers often neglect many parameters related with drivers which differ in their anthropometric characteristics. It is due to the lack of the proper tools by which the designer can easily apply several ergonomic design guidelines to the vehicle design. In this study. an iterative package layout procedure was developed, and the effectiveness of an ergonomic human model was examined in this procedure. A discomfort function was developed for the quantitative evaluation of the driving posture. This study clearly demonstrates that the package layout using an ergonomic human model is very helpful to improve the usability and driving comfort of the drivers or passengers.

• Industry Promotion Research
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• v.2 no.1
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• pp.31-38
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• 2017

This study is an exploratory study on the package design research strategy for the activation of the energy drink market. We analyzed the case study of energy drinks and the preference of energy beverage package design which are being sold in Korea and overseas from Oct. 24 to 28, 2016. The results of this study are as follows: First, preference is given to two colors, blue and red, regarding the color of package design of energy drinks. In particular, blue was the most preferred at 62.8%, and the reason for choosing color was the image that reminds me of energy drinks, and it was highly visible. Second, most preference of energy drinks for packaging material was selected from can and glass materials, and most preferred for can. Third, preference for calligraphy was found to be due to the dynamic images of energy drink preferring rough images. Fourth, package design awareness focused on overall image rather than one factor. The limitations of the study are the research subjects only to university students in Daejeon and Chungnam area. In the future, it will be necessary to classify the overall elements of package design and various research subjects, and to study the major consumption and consumption areas of energy drinks. In this study, it is implied that the design of the package needs a package design strategy in accordance with the overall product image, rather than focusing on one factor.

• Proceedings of the Korea Society of Design Studies Conference
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• 2004.10a
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• pp.92-93
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• 2004