• Corrosion Science and Technology
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• v.18 no.4
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• pp.117-120
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• 2019

Considering the tendency of development of electrification vehicles, development and verification of new evaluation technology is needed because of new technology applications. Recently, as the battery package is set outdoors of an electric vehicle, such vehicles are exposed to corrosive environments. Among major components connected to the battery package, rust prevention of high-voltage cables and connectors is considered the most important issue. For example, if corrosion of high voltage cable connectors occurs, the corrosion durability assessment of using an electric vehicle will be different from general environmental corrosion phenomena. The purpose of this study is to investigate the corrosion mechanism of high voltage cable connectors of an electric vehicle under various driving environments (road surface vibration, corrosion environment, current conduction by stray current, etc.) and develop an optimal rust prevention solution. To improve our parts test method, we have proposed a realistic test method to reproduce actual electric vehicle corrosion issues based on the principle test.

• The Bulletin of The Korean Astronomical Society
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• v.46 no.2
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• pp.53.3-53.3
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• 2021

Adaptive Optics (AO) was first studied in the field of astronomy, and its applications have been extended to the field of laser, microscopy, bio, medical, and free space laser communication. AO modelling and simulation are required throughout the system development process. It is necessary not only for proper design but also for performance verification after the final system is built. In KASI, we are trying to develop the AO Python Package for AO modelling and simulation. It includes modelling classes of atmosphere, telescope, Shack-Hartmann wavefront sensor, deformable mirror, which are the components for an AO system. It also includes the ability to simulate the entire AO system over time. It is being developed in the Super Eye Bridge project to develop a segmented mirror, an adaptive optics, and an emersion grating spectrograph, which are future telescope technologies. And it is planned to be used as a performance analysis system for several telescope projects in Korea.

• ETRI Journal
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• v.34 no.5
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• pp.706-712
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• 2012

In previous work, novel maskless bumping and no-flow underfill technologies for three-dimensional (3D) integrated circuit (IC) integration were developed. The bumping material, solder bump maker (SBM) composed of resin and solder powder, is designed to form low-volume solder bumps on a through silicon via (TSV) chip for the 3D IC integration through the conventional reflow process. To obtain the optimized volume of solder bumps using the SBM, the effect of the volumetric mixing ratio of resin and solder powder is studied in this paper. A no-flow underfill material named "fluxing underfill" is proposed for a simplified stacking process for the 3D IC integration. It can remove the oxide layer on solder bumps like flux and play a role of an underfill after the stacking process. The bumping process and the stacking process using the SBM and the fluxing underfill, respectively, for the TSV chips are carefully designed so that two-tier stacked TSV chips are sucessfully stacked.

• ETRI Journal
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• v.31 no.6
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• pp.749-754
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• 2009

The design and performance of an InGaAs/InP transimpedance amplifier and post amplifier for 40 Gb/s receiver applications are presented. We fabricated the 40 Gb/s transimpedance amplifier and post amplifier using InGaAs/InP heterojunction bipolar transistor (HBT) technology. The developed InGaAs/InP HBTs show a cut-off frequency ($f_T$) of 129 GHz and a maximum oscillation frequency ($f_{max}$) of 175 GHz. The developed transimpedance amplifier provides a bandwidth of 33.5 GHz and a gain of 40.1 $dB{\Omega}$. A 40 Gb/s data clean eye with 146 mV amplitude of the transimpedance amplifier module is achieved. The fabricated post amplifier demonstrates a very wide bandwidth of 36 GHz and a gain of 20.2 dB. The post-amplifier module was fabricated using a Teflon PCB substrate and shows a good eye opening and an output voltage swing above 520 mV.

• Journal of Korea Society of Digital Industry and Information Management
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• v.8 no.3
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• pp.11-22
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• 2012

GIS have expanded the use-range to the various application area with the advantage of interface environment, the various geographical operation. topological analysis by the friendly user. Early GIS software was developed as monolithic tool in which all functions packed in the same software. But, these GIS software have the problems of the high cost of constructing system, closely related system architecture and the reusability. And there is a lack of interoperability between them because most of them have their own unique data format according to their practical application fields. So Component is a unit that it is cohesive software package which is able to be developed and arranged independently and connected with another component for necessary system composition. In this paper, we analyze the requirements for component design and component specifications based on the extracted components. Commonly used to extract components from the requirements of the GPS component-based development process is presented. These components extracted by the process can be used to assemble components only. In particular, applications for developers to add features specific case without affecting the other components that can be modify the component.

• Journal of Smart Tourism
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• v.4 no.2
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• pp.15-23
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• 2024

This study aims to present a framework involving smartness components and indicators of tourism destinations. This work had three phases. The first phase extracted the components and indicators of smartness evaluation in tourism destinations and validated them by experts' opinions. The second phase determined the effectiveness of each element of smartness using an online questionnaire tool, a survey of 320 tourism experts at the level of 12 selected urban tourism destinations, and a factor analysis method, in addition to measuring the level of their smartness. The third phase of the research analyzed the difference between the smartness of the selected urban tourism destinations using a One-Way Analysis of Variance and the Tukey Test. The results indicated six components and fifty-seven indicators. Also, a substantial difference between the smartness of urban tourism destinations was proved. This study substantially contributes to the existing body of knowledge by offering the smartness indicators within a detailed package of six components with a systemic, holistic, and integrated perspective. The results help policymakers and decision-makers evaluate and improve the smartness of tourism destinations. As a result, it is possible to achieve the goals of smartness of urban tourism destinations, including equality, livability, sustainability, and effectiveness of resource management by using different technologies, especially with the emphasis on two aspects: (1) increasing the quality of the tourism experience, and (2) improving the residents' quality of life.

• The Korean Journal of Community Living Science
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• v.16 no.4
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• pp.15-24
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• 2005

We investigated the changes of volatile flavor components from Codonopsis lanceolata, which were packed in woven polypropylene(WP) film or low density polyethylene(LDPE) film and stored for 15 and 30 days at refrigerated($2{\∼}4^{\circ}C$ ) or room($18{\∼}20^{\circ}C$) temperature. A hundred and sixty seven volatile flavor components in the fresh C. lanceolata were identified by GC/MS analysis. When determining the flavor components from C. lanceolata cultivated on a wild hill and stored at 4 conditions for 30days, six volatile components such as 1-hexadecene, 2,6-dimethyl-2-octanol, 2-methyl-2-dodecanol, $\alpha$-guaiene, $\delta$-cadinene and trans-2-hexen-1-ol were detected as common components of all stored samples, and The types of common flavor components of C. lanceolata were different according to storage conditions. The numbers were 16 from refrigerated, 7 from room temperature stored, and 10 components from WP or LDPE packed conditions, respectively. The total peak area ratio of the major 10 compounds were $52.0{\∼}86.8\%$, and the percentage of trans-2-hexen-1-ol, which was the only common compound among the major 10 components, was the highest as $26.4{\∼}68.1\%$ The major flavor profile, describe by highly trained panel, were green, aldehydic, earthy and camphoreous. As the result from sensory evaluation, the freshness of C. lanceolata was maintained better by controlling storage temperature rather than selection of package materials. The best condition for characteristic flavor of C. lanceolata was packing with LDPE and chilling.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.16 no.1 s.92
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• pp.102-112
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• 2005

In this work, we developed fully integrated broadband MMIC chip set employing CSP(Chip Size Package) for K/Ka band applications. By utilizing an ACF for the RF-CSP, the fabrication process for the packaged amplifier MMIC could be simplified and made cost effective. $STO(SrTi_{3})$ capacitors were employed to integrate the DC biasing components on the MMIC, and LC parallel circuits were employed for DC feed and ESD protection. A pre-matching technique and RC parallel circuit were used to achieve a broadband matching and good stability fer the amplifier MMIC in K/Ka band. The amplifier CSP MMIC exhibited good RF performance over a wide frequency range in K/Ka band. This work is the first report of a fully integrated CSP amplifier MMIC successfully operating in the K/Ka band.

• Journal of the Microelectronics and Packaging Society
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• v.15 no.1
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• pp.7-18
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• 2008

This paper reviews the current development of an ultra-slim SiP for Radio Frequency (RF) application, in which three flip chips, additional passive components and Surface Acoustic Wave (SAW) filters are integrated side-by-side. A systematic investigation is carried out for the design optimization, process and reliability improvement of the package, which comprises several aspects: a design study based on the 3D thermo-mechanical finite element analysis of the packaging, the determination of stress, warpage distribution, critical failure zones, and the figuration of the effects of material properties, process conditions on the reliability of package. The optimized material sets for manufacturing process were determined which can reduce the number of testing samples from 75 to 2. In addition the molded underfilling (MUF) process is proposed which not only saves one manufacturing process, but also improves the thermo-mechanical performance of the package compared with conventional epoxy underfilling process. In the end, JEDEC's moisture sensitivity test, thermal cycle test and pressure cooker tests have also been carried out for reliability evaluation. The test results show that the optimized ultra-slim SiP has a good reliability performance.

• Journal of the Microelectronics and Packaging Society
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• v.21 no.3
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• pp.7-17
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• 2014

Power electronics modules are semiconductor components that are widely used in airplanes, trains, automobiles, and energy generation and conversion facilities. In particular, insulated gate bipolar transistors(IGBT) have been widely utilized in high power and fast switching applications for power management including power supplies, uninterruptible power systems, and AC/DC converters. In these days, IGBT are the predominant power semiconductors for high current applications in electrical and hybrid vehicles application. In these application environments, the physical conditions are often severe with strong electric currents, high voltage, high temperature, high humidity, and vibrations. Therefore, IGBT module packages involves a number of challenges for the design engineer in terms of reliability. Thermal and thermal-mechanical management are critical for power electronics modules. The failure mechanisms that limit the number of power cycles are caused by the coefficient of thermal expansion mismatch between the materials used in the IGBT modules. All interfaces in the module could be locations for potential failures. Therefore, a proper thermal design where the temperature does not exceed an allowable limit of the devices has been a key factor in developing IGBT modules. In this paper, we discussed the effects of various package materials on heat dissipation and thermal management, as well as recent technology of the new package materials.