• Title/Summary/Keyword: Package

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Analysis of Evaluation for Emotional Image of the Package Design of Tea Brand in the Chinese Market (중국시장 차 음료브랜드 패키지디자인의 감성이미지 평가 분석)

  • Xin, Li
    • The Journal of the Korea Contents Association
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    • v.12 no.1
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    • pp.185-196
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    • 2012
  • This study of the emotional image of the package design of Tea drink. Above all, Collects the packages of tea drink in the Chinese market. Investigate the taste adjectives with about the package design of Tea drink. And 'Sweet. Bitter, refreshing, sour 'four major taste adjectives were deduced. Next, Investigate the level with the taste adjectives of the package design of tea drink and the affinity of package design of tea drink. Finally, Analyzed the distinction of visual elements with the taste adjectives of the package design of tea drink. And, Analyzed the distinction of visual elements according to impact of preference of the package design of tea drink.

Effect of Subatomospheric Pressure and Polyethylene Film Package on the Kacdugi Fermentation (깍두기의 숙성(熟成)에 미치는 감압(減壓) 및 Polyethylene Film 포장처리(包裝處理) 효과(效果))

  • Kim, Soon-Dong;Yoon, Soo-Hong;Kang, Meung-Su;Park, Nam-Sook
    • Journal of the Korean Society of Food Science and Nutrition
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    • v.15 no.1
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    • pp.39-44
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    • 1986
  • Kacdugi fermented in the subatomospheric pressure(350mmHg) and polyethylene film package to improve the quality and to investigate the effect of fermentative control at $25^{\circ}C$. Brix degree, acidity, vitamin C content and number of total microbe and Lactobacilli was determined and also, the edible period of kacdugi was checked up by sensory assessment. The increasing rate of brix degree during kacdugi fermentation was high in the subatomospheric pressure, but decreased at the last period of fermentation as same tendency to the control, and it was preferably increased at the last period of fermentation in the polyethylene film package. However, the acidity was higher in the control than sbuatomospheric pressure but it was low in the polyethylene film package. Vitamin C content was high in the control at beginning and middle period of fermentation but high in sbuatomospheric pressure, and was low in the polyethylene film package at the last period of fermentation. The number of Lactobacilli was more in the subatomospheric pressure and polyethylene film package than the control, but it was suddenly incressed for the total microbe in the polyethylene film package at last period of fermentation. The edible periods of kacdugi by the sensory assessment of sour flavor, hardness and complex flavor was second days in the control. third days in the polyethylene film package, and fifth days in the subatomospheric pressure after soaking.

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The investigation on the selection criteria of cost elements in package tour products (기획여행상품 원가구성요소의 선택기준에 대한 고찰)

  • Oh, hyun-jun;Hurr, hee-young
    • Proceedings of the Korea Contents Association Conference
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    • 2008.05a
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    • pp.763-767
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    • 2008
  • This paper investigates a selected criteria of cost elements in prior researches on value of package tour products, satisfaction of the tourist and cost elements of package tour products. In theoretical point of view, this paper shows the relationship between the value of the package tour products and satisfaction of the tourist. In this paper, the selected criteria of cost elements in package tour products for evaluating the satisfaction of the tourist are also analyzed. This research shows travel agencies' focus on the plan and products and consumers' needs. Also this can be used for development of package tour products which meet the consumers' needs as package tour product suppliers. Meanwhile, other purpose of this research is to help investigate evaluation indicators of package tour products for tourists and travel agencies based on cost elements.

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Study of Modeling for Stock Food Material with Location Movement by the Communication Signal System

  • Kim, Jeong-Lae;Kim, Jung-Yun;Rha, Young-Ah
    • International Journal of Advanced Culture Technology
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    • v.9 no.4
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    • pp.409-416
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    • 2021
  • We are invented the movement composition technique that is to check the food adjacent-package status of the wireless-management movement monitoring level (WMMML) on the movement monitoring communication system. The movement monitoring level condition by the movement monitoring communication system is formatted with the adjacent-package system. As to inspection a wireless RFID of the wireless RFID, we are found of the movement value with wireless RFID by the adjacent upper take form. The concept of movement monitoring level is formatted the reference of wireless-management level for composition signal by the movement package communication system. Further symbolizing a food composition of the WMMML of the medium-minimum in terms of the adjacent-package communication system, and the movement wireless RFID package that was the movement value of the far composition of the Mo-MMCS-FA-φMED-MIN with 5.80±1.20 units, that was the movement value of the convenient composition of the Mo-MMCS-CO-φMED-MIN with 4.06±(-0.04) units, that was the movement value of the flank composition of the Mo-MMCS-MO-φMED-MIN with 0.91±0.07 units, that was the movement value of the vicinage composition of the Mo-MMCS-VI-φMED-MIN with 0.18±(-0.03) units. The adjacent package will be to look into at the food ability of the adjacent-package communication system with wireless RFID by the movement monitoring level on the WMMML that is supply the wireless communication by the movement monitoring level system. We will be possible to make effort of a communication system by the management signal and to put to use of the delivery data of RFID level by the delivery system.

The BINSYN Program Package

  • Linnell, Albert P.
    • Journal of Astronomy and Space Sciences
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    • v.29 no.2
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    • pp.123-129
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    • 2012
  • The BINSYN program package, recently expanded to calculate synthetic spectra of cataclysmic variables, is being further extended to include synthetic photometry of ordinary binary stars in addition to binary stars with optically thick accretion disks. The package includes a capability for differentials correction optimization of eclipsing binary systems using synthetic photometry.

SPICE-Compatible Modeling of a Microbolometer Package Including Thermoelectric Cooler (열전 냉각기를 포함하는 볼로미터 패키지의 SPICE 등가 모델링)

  • Han, Chang Suk;Park, Seung Man;Kim, Nam-Hwan;Han, Seungoh
    • Journal of Sensor Science and Technology
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    • v.22 no.1
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    • pp.44-48
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    • 2013
  • For a successful commercialization of microbolometer, it is required to develop a robust package including thermal stabilizing mechanism. In order to regulate the temperature within some operating range, thermoelectric cooler is generally used but it's not easy to model the whole package due to the coupled physics nature of thermoelectric cooler. In this paper, SPICE-compatible modeling methodology of a microbolometer package is presented, whose steady-state results matched well with FEM results at the maximum difference of 5.95%. Although the time constant difference was considerable as 15.7%, it can be offset by the quite short simulation time compared to FEM simulation. The developed model was also proven to be useful for designing the thermal stabilizer through parametric and transient analyses under the various working conditions.

Effect of the Epoxy Mold on the Thermal Dissipation Behavior of LED Package (LED 패키지에서 에폭시 몰드가 방열특성에 미치는 영향)

  • Bang, Young-Tae;Moon, Cheol-Hee
    • Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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    • v.26 no.2
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    • pp.1-7
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    • 2012
  • LED package with 4[mm]-height mold was manufactured and the surface temperature was measured directly using both thermocouple and thermal infrared (IR) camera. FVM simulation was conducted to estimate the surface temperature of the same LED package under the same condition, by which the accuracy of the simulation was secured. Then, the effects of the height and thermal conductivity of the mold on the junction temperature of the LED package were investigated by FVM simulation. The results showed that the junction temperature decreased by 10[$^{\circ}C$] when the mold height was 3~5[mm], but the thermal conductivity of the mold didn't affect the junction temperature significantly.