• 대한전기학회논문지
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• 제43권5호
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• pp.802-808
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• 1994

The purpose of this paper is to describe an application of plasma polymerized thin film as an electron beam resist. Plasma polymerized thin film was prepared using an interelectrode capacitively coupled gas-flow-type reactor, and chosen methylmethacrylate(MMA)and methylmethacrylate-tetrameth-yltin(MMA-TMT) as a monomer. This thin films were also delineated by the electron-beam apparatus with an acceleration voltage of 30kV and an expose dose ranging from 20 to 900$\mu$C/cmS02T. The delineated pattern in the resist was developed with the same reactor which is used for polymerization using an argon as etching gas. The growth rate and etching rate of the thin film is increased with increasing of discharge power. Thin films by plasma polymerization show polymerization rate of 30~45($\pm$3) A/min, and etching rate of 440($\pm$30) A/min during Ar plasma etching at discharge power of 100W. In apparently lower than that of conventional PMMA, but the plasma-etching rate of PP(MMA-TMT) was higher than that of PPMMA.

• Tribology and Lubricants
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• 제24권5호
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• pp.255-263
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• 2008

Adhesion tests were conducted to investigate the adhesion characteristics between mold and thermoplastic polymer film. Coating of anti-sticking layer (ASL), a kind of polymer material, imprint pressure, and separation velocity were considered as the process conditions. A piece of fused silica without patterns on its surface was used as a mold and the thermoplastic polymer films were made on Si substrate by spin-coating the commercial polymer solution such as mr-I PMMA and mr-I 7020. The ASL was derived from (1H, 1H, 2H, 2H - perfluorooctyl) trichlorosilane($F_{13}$-OTS) and coated on the fused silica mold in vapor phase. The pull-off force was measured in various process conditions and the surfaces of the mold and the polymer film were observed after separation. It was found that the adhesion characteristics between the mold and the thermoplastic polymer film and the release performance of ASL were changed according to the process conditions. The ASL was effective to reduce the pull-off force and the damage of polymer film. In cases of the mold coated with ASL, the pull-off force did not depend on imprint pressure and separation velocity.

• Elastomers and Composites
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• 제37권1호
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• pp.21-30
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• 2002

개시제 ammonium persulfate(APS)와 유화제 sodium dodecyl benzene sulfonate(SDBS)를 이용하여 methyl methacrylate(MMA), styrene(St), ethyl acrylate(EA)등의 단량체를 core(내부)와 shell(외부)의 폴리머성분이 다른 core-shell 폴리머를 합성하고 각 core-shell 폴리머에 대한 구조를 연구하였다. 한 입자의 내부와 외부의 고분자 조성이 다른 composite 라텍스는 고분자 블렌딩과 공중합의 물성과는 달리 한 입자 내에서도 상반된 두 가지 물성을 동시에 나타내는 특성으로 인하여 여러 산업 분야에 응용이 가능하다. 그러나, core-shell 라텍스를 제조할 때 반응중입자가 성장하는 과정에서 입자의 응집과 중합율이 떨어지고, 라텍스의 응용시 기계적 안정성이 문제점으로 되고 있다. 따라서 shell 중합시에 새로운 입자의 생성이 적고 중합중 안정성이 우수한 라텍스를 제조하기 위해 유화제농도, 개시제농도, 중합온도가 PMMA/PSt과 PSt/PMMA의 core-shell 구조에 미치는 영향과 중합 후 입도분석기(particle size analyzer; PSA) 및 투과전자현미경(transmission electron microscope; TEM)을 이용하여 실제 입자측정과 입자형태 특성을 확인하였으며 시차주사열량계(differential scanning calorimeter, DSC)를 이용하여 유리전이온도($T_g$)의 측정, 최저성막온도(minimum film formation temperature; MFFT), NaOH 첨가에 의한 가수 분해에 따르는 pH를 측정하여 core-shell의 새로운 특성을 확인하였다.

• Macromolecular Research
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• 제15권7호
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• pp.688-692
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• 2007

The hydrogen-bonding induced alternating multilayer thin films of dendrimers and block copolymer micelles were demonstrated. The block copolymer micelles derived from amphiphilic poly(2-ethyl-2-oxazoline)block-$poly({\varepsilon}-carprolactone)$ (PEtOz-PCL) in aqueous phase have a core-shell structure with a mean hydrodynamic diameter of 26 nm. The hydrogen bonding between the PEtOz outer shell of micelle and the carboxyl unit of poly(amidoamine) dendrimer of generation 4.5 (PAMAM-4.5G) at pH 3 was utilized as a driving force for the layerby-layer alternating deposition. The multilayer thin film was fabricated on the poly(methyl methacrylate) (PMMA) thin film spin-coated on silicon wafer or glass substrate by the alternate dipping of PEtOz-PCL micelles and PAMAM dendrimers in aqueous solution at pH 3. The formation of multilayer thin film was characterized by using ellipsometry, UV-vis spectroscopy, and atomic force microscopy. The PEtOz outer shell of PEtOz-PCL micelle provided the pH-responsive hydrogen bonding sites with peripheral carboxylic acids of PAM AM dendrimer. The multilayer thin film was reversibly removed after dipping in aqueous solution at $pH{\geq}5.6$ due to dissociation of the hydrogen bonding between PEtOz shell of PEtOz-PCL micelle and peripheral carboxyl units of PAMAM dendrimer.

• Tribology and Lubricants
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• 제22권5호
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• pp.243-251
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• 2006

Molecular dynamics simulations of nanoimprint lithography NIL) are performed in order to investigate effects of process parameters, such as stamp shape, imprinting temperature and adhesive energy, on nanoimprint lithography process and pattern transfer. The simulation model consists of an amorphous $SiO_{2}$ stamp with line pattern, an amorphous poly-(methylmethacrylate) (PMMA) film and an Si substrate under periodic boundary condition in horizontal direction to represent a real NIL process imprinting long line patterns. The pattern transfer behavior and its related phenomena are investigated by analyzing polymer deformation characteristics, stress distribution and imprinting force. In addition, their dependency on the process parameters are also discussed by varying stamp pattern shapes, adhesive energy between stamp and polymer film, and imprinting temperature. Simulation results indicate that triangular pattern has advantages of low imprinting force, small elastic recovery after separation, and low pattern failure. Adhesive energy between surface is found to be critical to successful pattern transfer without pattern failure. Finally, high imprinting temperature above glass transition temperature reduces the imprinting force.

• 한국생산제조학회지
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• 제25권1호
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• pp.62-67
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• 2016

This paper presents a silicon nanostructure array embedded in a polymer film. The silicon nanostructure array was fabricated by using basic microelectromechanical systems (MEMS) processes such as photolithography, reactive ion etching, and anisotropic KOH wet etching. The fabricated silicon nanostructure array was transferred into polymer substrates such as polymethyl methacrylate (PMMA), polyethylene terephthalate (PET), and polycarbonate (PC) through the hot-embossing process. In order to determine the transfer conditions under which the silicon nanostructures do not fracture, hot-embossing experiments were performed at various temperatures, pressures, and pressing times. Transfer was successfully achieved with a pressure of 1 MPa and a temperature higher than the transition temperature for the three types of polymer substrates. The transferred silicon nanostructure array was electrically evaluated through measurements with a semiconductor parameter analyzer (SPA).

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2005년도 International Meeting on Information Displayvol.II
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• pp.1291-1293
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• 2005

Hybrid insulator pentacene thin film transistors (TFTs) were fabricated with thermally grown oxide and cross-linked polyvinylalcohol (PVA) including surface treatment by dilute ploymethylmethacrylate (PMMA) layers on $n^+$ doped silicon wafer. Through the optimization of $SiO_2$ layer thickness in hybrid insulator structure, carrier mobility was increased to above 35 times than that of the TFT only with the gate insulator of $SiO_2$ at the same transverse electric field. The carrier mobility of 1.80 $cm^2$/V-s, subthreshold swing of 1.81 V/decade, and $I_{on}$/ $I_{off}$ current ratio > 1.10 × $10^5$ were obtained at low bias (less than -30 V) condition. The result is one of the best reported performances of pentacne TFTs with hybrid insulator including cross-linked PVA material at low voltage operation.

• 공업화학
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• 제29권4호
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• pp.395-398
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• 2018

전기장 하에서 유기물은 전기장에 의해 부여된 여러 가지 힘의 영향을 받아서 특이한 거동을 나타낸다. 본 연구에서는, 지금까지 개별적으로 고찰되어 왔던 전기장 하에서의 블록 공중합체와 고분자 블렌드의 미세 거동을 비교 분석하여 특징적인 차이점을 알아보고자 한다. 두 가지 고분자가 공유결합으로 연결된 블록 공중합체와 약한 상호작용으로 혼합된 고분자 블렌드 시스템을 비교대상으로 하였다. 이때, 구성 고분자로는 비슷한 유전상수를 갖는 폴리아크릴로 나이트릴과 폴리메틸메타아크릴레이트를 도입하였다. 유사한 분자량, 같은 농도, 같은 전기장 세기하에서 고분자 블렌드가 전기장에 더욱 민감하게 반응하는 것을 알 수 있었다. 이는 공유결합이 분자의 운동성을 제약하여 전기장에 덜 민감하게 반응하도록 거동하기 때문이다. 본 연구는 고분자 물질의 전기장 하에서의 거동을 이해하는 중요한 정보를 제공할 것이다.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2014년도 제46회 동계 정기학술대회 초록집
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• pp.390-390
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• 2014

Soft-lithography 기술 중의 하나인 Micro-Contact Printing (${\mu}$-CP) 기술은 패턴이 형성된 mold 위에 고분자 물질을 코팅하고 기판과 접촉시켜, 패턴 된 부분만 기판으로 전사시켜 패턴을 형성하는 방법이다. ${\mu}$-CP 기술은 Imprint 방식과 비교하여 잔여물을 제거하기 위한 ashing 공정이 필요 없으며, 상대적으로 패턴이 전사되기 위한 공정 온도와 압력이 낮은 장점이 있다. 한편, 기존의 Photolithography 기술로 유기기판에 패턴을 형성하는 것은 제한이 있으며, 자외선에 의해 유기기판의 특성이 변화될 수 있다. 또한 패턴 형성 후 고분자 패턴을 제거하는 용매가 기판이 손상 받게 된다. 본 실험에서는 poly (1H,1H,2H,2H-perfluorodecyl methacrylate) polymer (PFDMA) films을 패턴 된 poly (dimethylsiloxane) (PDMS) mold 위에 코팅하고 ${\mu}$-CP 기술을 통해 poly (methylmethacrylate) (PMMA), poly (vinyl pyrrolidone) (PVP)등과 같은 유기기판 위에 고분자 패턴 형성을 하였다. 이때 전사 가능한 온도는 상온이며, 압력은 코팅된 PFDMA films이 기판과 접촉될 수 있는 정도만 필요하다. PFDMA가 상온에서 전사 가능한 이유는 유리전이온도가 상온보다 낮기 때문이다. 또한 접촉각을 측정하여 접착력을 계산하면 PFDMA와 기판과의 접착력이 상대적으로 높기 때문이다. PFDMA는 플루오르계 용매에 제거되기 때문에 유기기판의 손상을 최소화 할 수 있다. ${\mu}$-CP 기술을 이용한 PFDMA의 패턴 형성 방법은 물질의 특성으로 flexible 및 organic device 제작에 응용 될 수 있다.

• 한국전기전자재료학회논문지
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• 제14권3호
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• pp.207-214
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• 2001

The conductive polymers, polyaniline (PANI) emeralidin base and 3,4-polyethylene dioxythiophene(PEDOT) were synthesized and coated on the PET film dealt with acryl type primer to study the electromagnetic shielding effectiveness. When both PANI and PEDOT were coated on the PET film dealt with acryl type priemer, their surface properties such as he adhesive increased. For PANI, when blended with the binder such as PMMA, it adhesive and surface hardness increased, too. The visible light transmittance decreased, while the electromagnetic shielding effectiveness increased, when coated thickness of PANI and PEDOT increased. For PANI, the electromagnetic shielding effectiveness increased as its surface resistance decreased. For PANI, when the surface resistance was 140 Ω/$\square$, the shielding effectiveness was found to be 11 dB in the far field, and 13 dB in the near field at 1 GHz. For PEDOT, when the surface resistance was 200 Ω/$\square$, the shielding effectiveness was found to be 3 dB in the far field, and 7dB in the near field.