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http://dx.doi.org/10.9725/kstle.2008.24.5.255

Adhesion Characteristics between Mold and Thermoplastic Polymer Film in Thermal Nanoimprint Lithography  

Kim, Kwang-Seop (School of Mechanical, Aerospace & Systems Engineering, Korea Advanced Institute of Science and Technology (KAIST))
Kang, Ji-Hoon (R&D Group, Storage System Division, Semiconductor Business, Samsung Electronics Co., Ltd.)
Kim, Kyung-Woong (School of Mechanical, Aerospace & Systems Engineering, Korea Advanced Institute of Science and Technology (KAIST))
Publication Information
Tribology and Lubricants / v.24, no.5, 2008 , pp. 255-263 More about this Journal
Abstract
Adhesion tests were conducted to investigate the adhesion characteristics between mold and thermoplastic polymer film. Coating of anti-sticking layer (ASL), a kind of polymer material, imprint pressure, and separation velocity were considered as the process conditions. A piece of fused silica without patterns on its surface was used as a mold and the thermoplastic polymer films were made on Si substrate by spin-coating the commercial polymer solution such as mr-I PMMA and mr-I 7020. The ASL was derived from (1H, 1H, 2H, 2H - perfluorooctyl) trichlorosilane($F_{13}$-OTS) and coated on the fused silica mold in vapor phase. The pull-off force was measured in various process conditions and the surfaces of the mold and the polymer film were observed after separation. It was found that the adhesion characteristics between the mold and the thermoplastic polymer film and the release performance of ASL were changed according to the process conditions. The ASL was effective to reduce the pull-off force and the damage of polymer film. In cases of the mold coated with ASL, the pull-off force did not depend on imprint pressure and separation velocity.
Keywords
thermal nanoimprint lithography; adhesion; anti-sticking layer; thermoplastic polymer film;
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