• 제목/요약/키워드: PLATING DENSITY

검색결과 237건 처리시간 0.024초

Tin-Cobalt 합금 도금공정에서 도금물성 향상을 위한 최적 용액조성 디자인 (Plating Solution Composition Control of Tin-Cobalt Alloy Electroplating Process)

  • 이승범;홍인권
    • 공업화학
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    • 제17권2호
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    • pp.150-157
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    • 2006
  • 최근 들어 크롬대체 도금공정의 필요성이 대두되고 있는 가운데, 크롬도금과 색차가 적고 기계적 특성이 우수하며 환경 친화적인 주석 계 합금도금의 사용이 확대되고 있다. 따라서 본 연구에서는 Sn-Co 합금도금공정을 바탕으로 광택제, 착화제로서 glycine 사용에 대한 연구를 수행하고자 하였다. Sn-Co 합금도금과 glycine 첨가에 따른 물리적 특성 및 표면 광택측정을 위해 Hull-cell 분석 및 도금표면분석을 수행하였다. Hull-cell 분석결과 glycine의 첨가량이 증가함에 따라 광택특성은 우수한 것으로 관찰되었으며, 표면광택성이 가장 우수한 도금조건으로는 $50^{\circ}C$, pH = 8의 조건에서 전전류 공급량 1 A로 1 min간 도금한 경우 음극전류밀도 $1A/dm^2$인 영역을 추천할 수 있었다. 동일조건의 pilot 실험을 $10{\mu}m$ 두께로 Ni하지 도금 후 Sn-Co 합금도금액 기본조성인 0.03 M $SnCl_{2}{\cdot}2H_{2}O$, 0.05 M $CoSO_{4}{\cdot}7H_{2}O$, 0.7 M $K_{4}P_{2}O_{7}$의 혼합 용액에서 수행하 였다. $0.2{\sim}0.6 {\mu}m$의 도금두께를 갖는 Sn-Co 합금도금 표면의 기계적 특성과 도금표면의 성분분석 결과 glycine의 첨가량이 15 g/L일 때 우수한 밀착성, 내식성, 내마모성을 보였다. 따라서 Sn-Co 합금도금공정에 glycine을 첨가한 용액을 크롬도금공정의 최적 도금용액으로 추천할 수 있었다.

와트 Ni 도금욕에서 도금 피막에 미치는 Al, Al2O3 분산제 및 열처리의 영향 (Effect of Al, Al2O3 Dispersants and Heat Treatment on Deposits from Watt′s Ni Plating Bamth)

  • 이상백;박형호;배인성;윤재식;김병일
    • 한국재료학회지
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    • 제12권2호
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    • pp.153-159
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    • 2002
  • The co-deposited behavior was investigated under varied bath compositions and current densities from Watt Ni plating bath containing Al and A1$_2$O$_3$powders. For single-particle bath, Al and A1$_2$O$_3$particles were agglomerated. The area percentage of A1$_2$O$_3$on plating surface decreased with increasing the current density, while that of Al on plating surface increased. On the other hand, in case of double-particle bath with 1.25g/$\ell$ of Al and 5.0g/$\ell$ of A1$_2$O$_3$5g, the area percentage of Ni-Al-A1$_2$O$_3$increased with increasing current density and the surface morphology was fine without agglomeration. Intermetallic compounds such as $\gamma$'and $\gamma$+$\gamma$' phases appeared when the co-deposited film was annealed.

무전해(無電解) 구리 도금폐액(鍍金廢液)으로부터 구리의 회수(回收) 연구(硏究) (Recovery of Copper in Wastewater from Electroless Plating Process)

  • 이화영;고현백
    • 자원리싸이클링
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    • 제21권6호
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    • pp.39-44
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    • 2012
  • 무전해 구리 도금폐수로부터 증발농축 및 전해채취법을 이용하여 구리를 회수하기 위한 연구를 수행하였다. 무전해 구리 도금폐수의 분석결과, Cu 함량은 582 mg/l로 나타났으며, 미량의 Fe 성분이 함유되어 있었다. 또한, 로셀염의 첨가로 인하여 COD 9,560 mg/l, TOC 13,100 mg/l로써 매우 높았으며, 포름알데히드가 산화된 formic acid의 함량은 7.73%로 나타났다. 실험결과, 구리의 전해채취시 전류밀도가 증가할수록 전류효율은 감소하는 것으로 나타났다. 또한, 전류효율을 80% 이상으로 유지하기 위해서는 구리의 전해채취시 전류밀도를 $40mA/cm^2$ 이하로 낮추어야 함을 알 수 있었다. 전해채취를 통해 얻은 Cu중의 평균 Fe 함량은 황산농도 2 vol% 및 10 vol%에서 각각 0.021% 및 0.01%로 나타나 황산농도가 높을수록 Fe 혼입을 억제할 수 있는 것으로 나타났다.

흑색 황산3가크롬을 이용한 태양열 흡열판 선택흡수막 도금기술 (Technology of selective absorber coatings on solar collectors using black chromium+3 sulfate acid on substrates)

  • 엄태인;여운택;김동찬
    • 한국태양에너지학회 논문집
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    • 제33권3호
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    • pp.27-35
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    • 2013
  • One of the most important factors that have a large influence on performance of the solar water heater system is performance of the solar collector, more detailedly, coating technology on the surface of the solar collector, which can provide high solar absorptance and low emittance. The core of the coating technology is to coat solar selective surfaces. In this study, various performance experiments are carried out using $Cr_2(SO_4)_3{\cdot}15H_2O$ coating technology. Here, IGBT(Insulated Gate Bipolar Transistor) of 5000A-15V was used as the surface processing rectifier which can stably output power and also can control voltage and current. The plating solution mainly contains black chrome$^{+3}$ concentration, H-y Conductivity, N-u Complex, NF Additive and NC-2 Wetter. Before applying the black chrome coating on the copper plate, optimal conditions are provided by using various preprocessing methods such as removal of fat, activation, electrolytic polishing, nickel strike, copper sulfate plating and bright neckel plating, and then the automatic continuous coating experiment are performed according to plating time and cathode current density. In the experiment, after the removal of fat, chemical polishing, nickel strike and activation processes as the preprocessing methods, the black chrome coating was performed in a plate solution temperature of $28^{\circ}C$ and a cathode current density of $18A/cm^2$ for 90 seconds. The thickness of chrome and nickel on the coated plate is $0.389{\mu}m$, $159{\mu}m$ respectively. As a result of the coating experiment, it showed the most excellent performance having a high solar absorptance of 98% and a low emittance of $5{\pm}1%$ when the black chrome surface had a thickness of $0.398{\mu}m$.

이온 플레이팅법에 의한 내식 박막의 제작과 부식방식 메카니즘 (Preparation of corrosion-resistive thin films by ion plating method and their corrosion protection mechanism)

  • 이경희;배일용;김기준;문경만;이명훈
    • 한국마린엔지니어링학회:학술대회논문집
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    • 한국마린엔지니어링학회 2006년도 전기학술대회논문집
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    • pp.285-286
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    • 2006
  • Magnesium is the lightest of all the structural metals having density of 1.74. It is approximately 2/3 lighter than aluminium, l/4 lighter than titanium alloy and 1/5 lighter than iron. Among the light-weight alloys, magnesium and its alloys show a good possibility for high performance aerospace and automotive applications, however the widespread use of magnesium alloys has been limited mainly by its poor oxidation and corrosion resistance. In this work, corrosion-resistive thin films were prepared onto the magnesium alloy substrate(AZ91D) by environmental friendly coating technique, ion plating method. And their corrosion protection mechanism were analyzed.

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무전해 니켈 도금에서 pH에 따른 영향 (Effect of pH on electroless nickel plating)

  • 정승준;김병춘;박종은;이흥기;박수길
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 1999년도 추계학술대회 논문집
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    • pp.625-628
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    • 1999
  • Recently. high-density printed circuit boards(PCB) become indispensable with the minaturization of components. Nickel is deposited on the copper patterns and followed by the gold deposition for improving connection reliability between the printed circuit boards and electronic components. Conventionally electrodeposition has been applied to metalization of copper patterns. However metalization by this method is not applicable for the isolated fine and concentrated patterns. Therefore, metalization technology of the fine patterns by electroless plating is required in place of electrodeposition. The application of electroless nickel plating for interconnection with solder strongly relies on the solderability and the interactions between nickel and solder. Factors such as phosphorus content of the deposit additive and bath temperature may influence solderability of the electroless nickel deposit. So solderability of electroless nickel/ gold deposits was investigated with substrates plated changing the condition of nickel solution.

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전기화학적 해석을 통한 PCB용 구리도금에 대한 전류밀도의 영향성 연구 (A Study on The Effect of Current Density on Copper Plating for PCB through Electrochemical Experiments and Calculations)

  • 김성진;신한균;박현;이효종
    • 마이크로전자및패키징학회지
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    • 제29권1호
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    • pp.49-54
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    • 2022
  • 반도체 Si 웨이퍼 Cu 배선을 제작하는데 사용하는 submicron 크기의 다마신 패턴의 구리 도금공정을 동일한 조건의 유기첨가제 및 전류밀도 조건을 사용하여 PCB 금속배선에 사용되는 수십 micron 크기의 패턴 도금에 적용하였다. PCB 패턴의 종횡비가 작아 쉽게 채워질 것으로 기대했던 것과는 달리, 이 경우 패턴 내부에 위치별 도금 두께 불균일도가 심화되는 것이 관찰되었다. 이러한 원인을 정량적으로 분석하기 위해 유동 및 전기장을 고려한 전기화학적 해석을 진행하였으며, 이를 통해 패턴 바닥부 코너에서 측벽과 바닥부의 도금에 의한 용액내 Cu2+ 이온의 고갈이 상대적으로 패턴 상부보다 빠르게 일어나는 것이 확인되었다. 이는 Cu2+ 이온의 확산계수가 2.65×10-10 m2/s 로 초당 16.3 ㎛정도의 평균 이동거리를 가짐으로, 이 값이 다마신 패턴에서는 충분히 커서 원활하게 패턴 내부까지 이온 공급이 이루어지나, 수십 micron 크기를 갖는 PCB 크기에서는 소진된 구리이온을 보충해 주기 위해 충분한 시간이 필요하기 때문인 것으로 확인되었다. 구리 이온을 충분히 공급해 주기 위해 전류밀도를 낮춰 Cu2+ 이온이 확산할 수 있는 충분한 시간을 할애해 줌으로써 두께 균일도가 향상되는 것을 알 수 있었다.

Raney Ni-Zn-Fe 전극의 산소발생 반응 특성에 미치는 도금변수의 영향 (Effect of Electroplating Parameters on Oxygen Evolution Reaction Characteristics of Raney Ni-Zn-Fe Electrode)

  • 채재병;김종원;배기광;박주식;정성욱;정광진;김영호;강경수
    • 한국수소및신에너지학회논문집
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    • 제31권1호
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    • pp.23-32
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    • 2020
  • The intermittent characteristics of renewable energy complicates the process of balancing supply with demand. Electrolysis technology can provide flexibility to grid management by converting electricity to hydrogen. Alkaline electrolysis has been recognized as established technology and utilized in industry for over 100 years. However, high overpotential of oxygen evolution reaction in alkaline water electrolysis reduces the overall efficiency and therefore requires the development of anode catalyst. In this study, Raney Ni-Zn-Fe electrode was prepared by electroplating and the electrode characteristics was studied by varying electroplating parameters like electrodeposition time, current density and substrate. The prepared Raney Ni-Zn-Fe electrode was electrochemically evaluated using linear sweep voltammetry. Physical and chemical analysis were conducted by scanning electron microscope, energy dispersive spectrometer, and X-ray diffraction. The plating time did not changed the morphology and composition of the electrode surface and showed a little effect on overpotential reduction. As the plating current density increased, Fe content on the surface increased and cauliflower-like structure appeared on the electrode surface. In particular, the overpotential of the electrode, which was prepared at the plating current density of 320 mA/㎠, has showed the lowest value of 268 mV at 50 mA/㎠. There was no distinguishable overpotential difference between the type of substrate for the electrodes prepared at 80 mA/㎠.

수산을 사용한 크롬도금의 광택성에 미치는 도금액의 조성과 도금조건의 영향 (Effect of Bath Compositions and Plating Conditions for Decorative Properties of Chromium Deposits using Oxalic Acid)

  • 오이식;박정덕
    • 동력기계공학회지
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    • 제5권3호
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    • pp.80-87
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    • 2001
  • Decorative properties of chromium depositions from oxalic acid bath containing chromium oxide and ammonium sulfate have been examined over a wide range of bath compositions and plating conditions. The obtained results from this experiment are summarized as follow: The followings were determined as a optimum conditions, bath compositions; $CrO_3\;200{\sim}250\;g/{\ell},\;H_2C_2O_4{\cdot}2H_2O\;500{\sim}700\;g/{\ell},\;(NH_4)_2SO_4\;40{\sim}120\;g/{\ell}$, and operation conditions; pH $2.0{\sim}2.5$, current density $15{\sim}250\;A/dm^2$ at bath temperature range of $30{\sim}80^{\circ}C$. Bright chromium deposits were obtained over a wide range of ammonium sulfate concentration and bath temperature. Decorative property for chromium deposition was adopted to apply stoichiometric ratio of $CrO_3$ concentration and $H_2C_2O_4{\cdot}2H_2O$.

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Ni-PTFE 복합도금기술을 이용한 알칼리형 연료전지용 전극 제조 (Preparation of Electrode Using Ni-PTFE Composite Plating for Alkaline Fuel Cell)

  • 김재호;이영석
    • 한국수소및신에너지학회논문집
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    • 제20권5호
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    • pp.361-370
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    • 2009
  • Ni-PTFE composite plated on graphite (C/Ni-PTFE) and PTFE (PTFE/Ni-PTFE) particles were prepared uniformly by electroless composite plating. The conductivity of C/Ni-PTFE particles was 280 S/m higher than 95 S/m of PTFE/Ni-PTFE particles at same composite plating condition (Ni:35~36 wt%, PTFE:8 wt%). The C/Ni-PTFE particles were formed into the C/Ni-PTFE plate using heat treatment at $350^{\circ}C$ under 10~$1000\;kg/cm^2$. The C/Ni-PTFE plate showed 1) high conductivity of $5.7\;{\times}\;10^4\;S/m$ due to the existence of graphite as conducting aid and the formation of 3-dimensional Ni network 2) good gas diffusion caused by various pore volumes (0.01~$100\;{\mu}m$) in the plate. The plate could be useful for an electrode in an alkaline fuel cell (AFC). The current density of C/Ni-PTFE electrode indicated $84\;mA/cm^2$ at 0.3V and it was 3.0 times higher than that of PTFE/Ni-PTFE electrode.