• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2002.11a
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• pp.387-390
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• 2002

SiC direct bonding technology is very attractive for both SiCOI(SiC-on-insulator) electric devices and SiC-MEMS(micro electro mechanical system) fields because of its application possibility in harsh environments. This paper presents pre-bonding techniques with variation of HF pre-treatment conditions for 2 inch SiC wafer direct bonding using PECVD(plasma enhanced chemical vapor deposition) oxide. The PECVD oxide was characterized by XPS(X-ray photoelectron spectrometer) and AFM(atomic force microscopy). The characteristics of the bonded sample were measured under different bonding conditions of HF concentration and an applied pressure. The bonding strength was evaluated by the tensile strength method. The bonded interface was analyzed by using IR camera and SEM(scanning electron microscope). Components existed in the interlayer were analyzed by using FT-IR(fourier transform infrared spectroscopy). The bonding strength was varied with HF pre-treatment conditions before the pre-bonding in the range of $5.3 kgf/cm^2$ to $15.5 kgf/cm^2$

• Journal of the Korea Safety Management & Science
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• v.12 no.4
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• pp.93-98
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• 2010

본 연구에서는, 반도체, LCD 공정에서 금속막을 증착하기 위하여 PECVD장비에 화재, 폭발 위험성과 독성을 가진 Silane가스를 사용하게 되는 장비인 gas cabinet, pipeline, VMB(Valve manifold box), MFC(mass flow controller)장비 등, 전반적인 시스템에 대하여 영국 HES의 ALARP개념을 도입하여 위험성 평가를 실시하여 문제점을 도출하고 대책을 강구 하는데 목적이 있고, 여러 가지 문제점중 절대적으로 수용 할 수 없는 Critical Risk로는 Gas Cylinder를 사용하여 Silane을 공급하고자 할 때에는 필히 Gas Cabinet을 사용하여 공급하여야 하고, Tube Trailer를 사용하여 공급하고자 할 때에는 필수적으로 Purge System을 갖추어 공급하여야 한다. 선택적으로 수용할 수 있는 High, Medium Risk로는 Gas Cylinder 또는 Tube Trailer를 사용하여 Silane을 공급하고자 할 때는 Inlet 부분에 RFO(Resticted Flow Orifice)를 설치하여 사용하고 Gas Supply Room에는 CO2소화설비를 적용하지 말고 Water Mist등 물 분무설비를 적용하여야한다.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2001.11a
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• pp.247-250
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• 2001

We studied optical properties of SiON thin-film in the applications of optical waveguide. SiON thin-film was grown in 300$^{\circ}C$ by PECVD(plasma enhanced chemical vapor deposition) system. The change of SiON thin-film composition and refractive Index was studied as a function of varying NH$_3$ gas flow rate. As NH$_3$ gas flow rate was increased, Quantity of N and refractive index were increased at the same time. By the results, we could form the SiON thin-film to use of a waveguide with refractive index of 1.6. We analyzed the conditions of the thin-film with FTIR(fourier transform infrared) and OES(optical emission spectroscopy). N-H bonding(3390cm$\^$-1/) can be removed by thermal annealing. And we could observe the SiH bonding state and quantity by OES analysis in SiH$_4$

• 한국정보디스플레이학회:학술대회논문집
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• 2006.08a
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• pp.1705-1708
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• 2006

Nanocrystalline silicon (nc-Si) based TFTs were developed using a conventional PECVD production system. Devices exhibit very interesting characteristics, in particular when using a bi-layer structure which reduces leakage current and improves subthreshold area. Good stability and low leakage current make these devices suitable for the fabrication of low-cost and high performance AMOLED displays.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.11a
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• pp.430-430
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• 2008

Using multi plasma enhanced chemical vapor deposition system (Multi-PECVD), p-a-Si:H deposition layer as a $p^+$ region which was annealed by laser (Q-switched fiber laser, $\lambda$ = 1064 nm) on an n-type single crystalline Si (100) plane circle wafer was prepared as new doping method for single crystalline interdigitated back contact (IBC) solar cells. As lots of earlier studies implemented, most cases dealt with the excimer (excited dimer) laserannealing or crystallization of boron with the ultraviolet wavelength range and $10^{-9}$ sec pulse duration. In this study, the Q-switched fiber laser which has higher power, longer wavelength of infrared range ($\lambda$ = 1064 nm) and longer pulse duration of $10^{-8}$ sec than excimer laser was introduced for uniformly deposited p-a-Si:H layer to be annealed and to make sheet resistance expectable as an important process for IBC solar cell $p^+$ layer on a polished n-type Si circle wafer. A $525{\mu}m$ thick n-type Si semiconductor circle wafer of (100) plane which was dipped in a buffered hydrofluoric acid solution for 30 seconds was mounted on the Multi-PECVD system for p-a-Si:H deposition layer with the ratio of $SiH_4:H_2:B_2H_6$ = 30:120:30, at $200^{\circ}C$, 50 W power, 0.2 Torr pressure for 20 minutes. 15 mm $\times$ 15 mm size laser cut samples were annealed by fiber laser with different sets of power levels and frequencies. By comparing the results of lifetime measurement and sheet resistance relation, the laser condition set of 50 mm/s of mark speed, 160 kHz of period, 21 % of power level with continuous wave mode of scanner lens showed the features of small difference of lifetime and lowering sheet resistance than before the fiber laser treatment with not much surface damages. Diode level device was made to confirm these experimental results by measuring C-V, I-V characteristics. Uniform and expectable boron doped layer can play an important role to predict the efficiency during the fabricating process of IBC solar cells.

• Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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• v.20 no.8
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• pp.6-14
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• 2006

This paper is a study about a proper method of plasma generation to cleaning method and a high frequency power equipment circuit to generation of plasma that used cleaning of chamber for TFT-LCD PECVD. The high density plasma required for cleaning causes a possibility of high density plasma more than $1{\times}10^{11}[EA/cm^3]$. It apply a ferrite core of ferromagnetic body to a existing ICP form. In case of power transfer equipment on 400[kHz] high frequency to generation of plasma it makes certain a stable switching operation in condition of plasma through using a inverter form for general purpose HB. And it demonstrates the performance of power transfer equipment using methods of measurement which use a transformer of series combination the density of plasma and the rate of dissolution of $NF_3$ in condition of $A_r\;and\;NF_3$.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.06a
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• pp.181-181
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• 2008

DLC (Diamond-like Carbon) 박막은 높은 내마모성과 낮은 마찰 계수, 화학적 안정성 및 적외선 영역에서의 높은 투과율과 낮은 광 반사도, 높은 전기저항과 낮은 유전율, 전계방출특성 등 여러 가지 장점을 가진 물질이다[1]. 최근에는 DLC 박막의 여러 장점들과 산과 염기 유기용매에 대한 화학적 안정성으로 인하여 인조관절에서 인공심장의 판막에 이르기까지 의공학 관련 부품소재로 응용되고 있으며 내구성과 안정성에 있어서 탁월한 성능을 보여주고 있다. 또한 DLC 박막의 높은 경도와 낮은 마찰 계수, 부드러운 박막 표면 (수nm의 RMS 거칠기)의 장점을 살려 마그네틱 미디어와 하드디스크의 슬라이딩 표면에 사용되어지고, MEMS (Micro-Electro Mechanical System) 소자와 MMAs (Moving Mechanical Assemblies)의 고체윤활코팅으로 활용하여 미세기계의 내구성과 성능 향상을 도모할 수 있다. 이와 같이 DLC 박막은 다양한 분야에 응용되고 있으며, 박막이 지닌 여러 가지 장점들로 인하여 더 많은 분야에 응용될 가능성을 지닌 물질이다. 그러나 수 ${\mu}m$이상의 두께에서 박막이 높은 잔류응력 (residual stress)을 가지고, 열에 취약하여 이의 개선에 관한 연구들이 진행되어 지고 있다 [2]. 따라서 사용되는 목적에 따라 용도에 맞는 양질의 DLC 박막을 합성하기 위해선 합성 장치의 개발과 다양한 실험을 통한 최적의 합성조건 도출 등의 노력이 요구된다. 또한 DLC 박막 합성시의 여러 가지 증착 방법에 따른 박막 물성에 대한 재현성 확보 및 박막 증착에 관한 명확한 메커니즘 규명이 아직까지는 불분명하여 이에 관한 연구가 시급하다. 따라서 본 연구에서는 MEMS 소자와 MMAs의 고체윤활코팅으로 사용가능한 DLC 박막을 RF PECVD (Plasma Enhanced Vapor Deposition) 방식으로 합성하고 후열처리 온도에 따른 DLC 박막의 마찰계수 변화를 박막에 훼손을 주지 않는 FFM (Friction Force Microscopy) 방식을 사용하여 분석하였다.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.11a
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• pp.418-419
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• 2007

플라즈마 열화학기상 증착법으로 Fe-Ni-Co 3원계 측매합금을 이용하여 $442^{\circ}C$의 저온에서 다중벽 탄소나노튜브를 합성하였다. 수소의 유량이 일정할 때 아세틸렌의 유량이 감소함에 따라 성장속도가 증가하였다. 합성된 탄소나노튜브는 약 8.4 nm의 직경과 $5.5\;{\mu}m$의 길이를 보였으며, 기판에 대해 수직으로 성장되었다. 4인치 웨이퍼 위에서도 전면적에서 균일한 성장을 보였다.

• Vacuum Magazine
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• v.2 no.3
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• pp.11-15
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• 2015

Particle characteristics diagnosis system (PCDS) was developed to measure submicron particle characteristics by modulation of particle beam mass spectrometry (PBMS) with scanning electron microscopy (SEM) and energy dispersive x-ray spectroscopy (EDS). It is possible to measure the particle size distribution in real-time, and the shape, composition can be measured in sequence keeping vacuum condition. Apparatus was calibrated by measuring the size classified NaCl particle which generated at atmospheric pressure. After the calibration, particles were sampled from the exhaust line of plasma enhanced chemical vapor deposition (PECVD) process and measured. Result confirms that PCDS is capable for analyzing particles in vacuum condition.

• 한국정보디스플레이학회:학술대회논문집
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• 2006.08a
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• pp.1673-1675
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• 2006

As the manufacturing capacity needs for large size LCD TV shifts very fast into next generation, processing and test equipment makers face more difficult challenges in accommodating productivity, reliability and lead time of panel makers as well as the prerequisite of high process quality. In this paper, AKT will discuss its new innovative productivity solutions in PECVD (Plasma Enhanced Chemical Vapor Deposition), as the key thin film process system, and EBT (Electron Beam Test), as the key array test system, for the huge glass size with surface dimension larger than 2 meter by 2 meter.