• Journal of the Korean Institute of Telematics and Electronics A
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• v.33A no.12
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• pp.59-64
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• 1996

InSb MIS devices prepared by remote PECVD SiO$_{2}$ were fabricated. The SiO$_{2}$ films on InSb were deposited at atemperature range of 67~190$^{\circ}$C. The effects of deposition temperature on the structural characteristics of the SiO$_{2}$ films evaluated Auger electron spectroscopy showed that atomic raito of silicon to oxygen was 0.5 and composition toms were distributed uniformaly throuout the oxide film. The transition region is about 100$\AA$ for SiO$_{2}$/InSb interface. The leakage current density at 1MV/cm and the breakdownelectric field of the MiS device using SiO$_{2}$ film deposited at 105$^{\circ}$C were about 22 nA/cm$^{2}$ and 3.5MV/cm, respectively. The interface-state density at mid-bandgap extracted from 1 MHz high frequency C-V measurement was about 2X10$^{11}$ cm$^{-2}$eV$^{-1}$.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2000.04a
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• pp.109-109
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• 2000

Recently, carbon nanotube has been investigating for field emission display ( (FED) applications due to its high electron emission at relatively low electric field. However, the growing of carbon nanotube generally requires relatively high temperature processing such as arc-discharge (5,000 ~ $20,000^{\circ}C$) and laser evaporation (4,000 ~ $5,000^{\circ}C$) methods. In this presentation, low temperature growing of carbon nanotube by plasma enhanced chemical vapor deposition (PECVD) using nickel catalyst which is compatible to conventional FED processing temperature will be described. Carbon n notubes with average length of 100 run and diameter of 2 ~ $3\mu$ill were successfully grown on silicon substrate with native oxide layer at $550^{\circ}C$using nickel catalyst. The morphology and microstructure of carbon nanotube was highly depended on the processing temperature and nickel layer thickness. No significant carbon nanotube growing was observed with samples deposited on silicon substrates without native oxide layer. This is believed due to the formation of nickel-silicide and this deteriorated the catalytic role of nickel. The formation of nickel-silicide was confirmed by x-ray analysis. The role of native oxide layer and processing parameter dependence on microstructure of low temperature grown carbon nanotube, characterized by SEM, TEM XRD and R없nan spectroscopy, will be presented.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2006.06a
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• pp.356-357
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• 2006

Tin oxide thin films have been prepared on display glass from mixtures of dibutyl tin diacetate as a tin source, oxygen as an oxidant by Plasma Enhanced Chemical Vapor Deposition (PECVD) method. The relationships between the properties of tin oxide thin films and various reaction parameters such as the deposition temperature, deposition time and the oxygen gas flow rate were studied. As the deposition temperature increased, the texture plane of $SnO_2$ changed from (200) plane to denser (211) and (110) planes. Lower deposition temperature and thinner thickness of deposited film led to decreasing grain size, surface roughness and electrical resistivity of the formed thin films at $325{\sim}425^{\circ}C$. The properties of fabricated $SnO_2$ films are highly changed with variations of substrate temperature and deposition time.

• Proceedings of the Korean Vacuum Society Conference
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• 2016.02a
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• pp.198.1-198.1
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• 2016

Organic light-emitting diode (OLED) displays have promising potential to replace liquid crystal displays (LCDs) due to their advantages of low power consumption, fast response time, broad viewing angle and flexibility. Organic light emitting materials are vulnerable to moisture and oxygen, so inorganic thin films are required for barrier substrates and encapsulations.[1-2]. In this work, the silicon-based inorganic thin films are deposited on plastic substrates by plasma-enhanced chemical vapor deposition (PECVD) at low temperature. It is necessary to deposit thin film at low temperature. Because the heat gives damage to flexible plastic substrates. As one of the transparent diffusion barrier materials, silicon oxides have been investigated. $SiO_x$ have less toxic, so it is one of the more widely examined materials as a diffusion barrier in addition to the dielectric materials in solid-state electronics [3-4]. The $SiO_x$ thin films are deposited by a PECVD process in low temperature below $100^{\circ}C$. Water vapor transmission rate (WVTR) was determined by a calcium resistance test, and the rate less than $10.^{-2}g/m^2{\cdot}day$ was achieved. And then, flexibility of the film was also evaluated.

• Proceedings of the KIEE Conference
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• 1992.07b
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• pp.832-834
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• 1992

Using the PECVD method, the silicon nitride films were deposited by changing the $SiH_4/NH_3$ gas flow ratio from 0.2 to 1.4 at an interval of 0.2, AES, FTIR, and Spectroscopic Ellipsomter were used to analyze the film composition and structure, the refractive index, and the deposition rate. Also the C-V analysis was used to estimate the memory performance in the capacitor type MNOS memory devices, which utilized native oxide as the tunneling barrier, with the silicon nitride by the above deposition conditions. As a result, it was confirmed that the performance of MNOS memory devices with PECVD silicon nitride was comparable to that with LPCVD or APCVD silion nitride.

• 제어로봇시스템학회:학술대회논문집
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• 1998.10a
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• pp.195-200
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• 1998

Since the neural network was introduced, significant progress has been made on data handling and learning algorithms. Currently, the most popular learning algorithm in neural network training is feed forward error back-propagation (FFEBP) algorithm. Aside from the success of the FFEBP algorithm, polynomial neural networks (PNN) learning has been proposed as a new learning method. The PNN learning is a self-organizing process designed to determine an appropriate set of Ivakhnenko polynomials that allow the activation of many neurons to achieve a desired state of activation that mimics a given set of sampled patterns. These neurons are interconnected in such a way that the knowledge is stored in Ivakhnenko coefficients. In this paper, the PNN model has been developed using the plasma enhanced chemical vapor deposition (PECVD) experimental data. To characterize the PECVD process using PNN, SiO$_2$films deposited under varying conditions were analyzed using fractional factorial experimental design with three center points. Parameters varied in these experiments included substrate temperature, pressure, RF power, silane flow rate and nitrous oxide flow rate. Approximately five microns of SiO$_2$were deposited on (100) silicon wafers in a Plasma-Therm 700 series PECVD system at 13.56 MHz.

• Journal of the Semiconductor & Display Technology
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• v.22 no.4
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• pp.72-75
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• 2023

Carbon neutrality has been emerged as important mission for all the manufacturing industry to reduce energy usage and carbon emission equivalent. Korean semiconductor and display manufacturing industries are also in huge interest by minimize the energy usage as well as to find a less global warming product gases in both etch and cleaning. In addition, Korean government is also investing long term research and development plan for the safe environment in various ways. In this paper, we revisit previous research activities on carbon emission equivalent and current research activities performed in semiconductor process diagnosis research center at Myongji University with respect to the reduction of NF3 usage for the PECVD chamber cleaning, and we present the analytical result of the exhaust gas with residual gas analysis in both 6 inches and 12 inches PECVD equipment. The presented result can be a reference study of the development of new substitution gas in near future to compare the cleaning rate of the silicon oxide deposition chamber.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2018.06a
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• pp.88-88
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• 2018

DLC(Diamond Like Carbon) 박막은 높은 열전도도, 큰 전기저항, 높은 강도 등의 다이아몬드와 유사한 특성을 가지고 있으면서 저온 저압에서도 합성이 가능하고, 합성 조건에 따라 물리 화학적 특성도 넓게 조절 할 수 있으며 상대적으로 넓은 면적에서 균일하고 평활한 박막의 합성이 가능하여 산업적 응용 면에서도 경쟁력을 갖추고 있다[1]. 이러한 DLC 박막을 합성함에 있어서 RF-PECVD(Radio Frequency Plasma Enhanced Chemical Vapor Deposition) 방법은 PECVD 방법 중 가장 보편적으로 사용되고 또 캐패시터 타입의 RF-PECVD 방법은 균일한 대면적 증착과 대량생산이 가능하다[1,2]. 본 연구에서는 우수한 특성을 갖는 DLC 박막의 증착 조건을 찾기 위해 캐패시터 타입의 RF-PECVD를 사용하여 공정 가스의 유량과 RF Power를 변화하여 박막을 증착하고, 증착된 박막의 특성을 연구하였다. DLC 박막은 ITO(Indium Tin Oxide) 유리 기판 위에 $100^{\circ}C$에서 5 min 동안 아세틸렌($C_2H_2$) 가스를 사용하여 가스 유량과 RF Power를 변화하여 증착하였다. 증착된 DLC 박막의 특성은 투과도, 평탄도, 두께를 측정하여 비교하였다. 가시광선 영역(380-780 nm)에서 투과도를 측정한 결과 ITO 유리 기판을 기준으로 한 DLC 박막의 투과도는 가시광선 영역 평균 94.8~98.8% 사이의 값으로 매우 높은 투과율을 나타내었다. 투과도는 가스 유량이 증가함에 따라 증가하는 경향을 나타내었고, RF Power의 변화에는 특정한 변화를 나타내지 않았다. 박막의 평탄도($R_a$, $R_{rms}$)와 두께는 AFM(Atomic Force Microscope)을 사용하여 측정하였다. 평탄도 $R_{rms}$는 0.8~3.3 nm, $R_a$는 0.6~2.5 nm 사이를 나타내었고 RF Power와 가스 유량의 변화에 따른 경향성을 나타내지는 않았다. 두께는 RF Power 25 W에서 55 W로 증가함에 따라 증가하는 경향을 나타내었으나 70W에서는 가스의 유량에 따라 상이한 결과를 나타내었다.

• Transactions on Electrical and Electronic Materials
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• v.13 no.4
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• pp.192-195
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• 2012

We reported diborane ($B_2H_6$) doped wide bandgap hydrogenated amorphous silicon oxide (p-type a-SiOx:H) films prepared by using silane ($SiH_4$) hydrogen ($H_2$) and nitrous oxide ($N_2O$) in a radio frequency (RF) plasma enhanced chemical vapor deposition (PECVD) system. We improved the $E_{opt}$ and conductivity of p-type a-SiOx:H films with various $N_2O$ and $B_2H_6$ ratios and applied those films in regards to the a-Si thin film solar cells. For the single layer p-type a-SiOx:H films, we achieved an optical band gap energy ($E_{opt}$) of 1.91 and 1.99 eV, electrical conductivity of approximately $10^{-7}$ S/cm and activation energy ($E_a$) of 0.57 to 0.52 eV with various $N_2O$ and $B_2H_6$ ratios. We applied those films for the a-Si thin film solar cell and the current-voltage characteristics are as given as: $V_{oc}$ = 853 and 842 mV, $J_{sc}$ = 13.87 and 15.13 $mA/cm^2$. FF = 0.645 and 0.656 and ${\eta}$ = 7.54 and 8.36% with $B_2H_6$ ratios of 0.5 and 1% respectively.

• Journal of the Microelectronics and Packaging Society
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• v.6 no.3
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• pp.65-71
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• 1999

The effects of mask materials and etching solutions on the dimensional accuracy of V-groove were studied for the alignment between optoelectronic devices and optical fibers in optical packaging. PECVD nitride, LPCVD nitride, or thermal oxide($SiO_2$) was used as a mask material. The anisotropic etching solution was KOH(40wt%) or the mixture of KOH and IPA. LPCVB nitride has the best etching selectivity and thermal oxide was etched most rapidly in KOH(40wt%) at $85^{\circ}C$ among the mask materials studied here. The V-groove size enlarged than the designed value. This phenomenon was due to the undercutting benearth the mask layer from the etching toward Si (111) plane. The etch rate of (111) plane wart 0.034 - 0.037 $\mu\textrm{m}$/min in KOH(40wt%). This rate was almost same regardless of mask materials. When IPA added to KOH(40wt%), the etch rate of (100) plane and (111) plane decreased, but etching ratio of (100) to (111) plane increased. Consequently, the undercutting phenomenon due to etching toward (111) plane decreased and the size of V-groove could be controlled more accurately.