• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2001.09a
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• pp.183-192
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• 2001

1- Buildup PCB technology is utilized to a bare chip attach substrate technology for packaging of semiconductor chip 2- Requirement for the substrate design rule is described in SIA International Technology Roadmap for Semiconductor. 3- There are seven fabrication methods of build-up technology. 4- Coating and lamination for resin and photo, and laser for micro via hope processes are available. Below $50\mu\textrm{m}$ in diameter is possible. 5- Fine pitch lines down to $30\mu\textrm{m}$ can be achieved by pattern plating with better electrical property. 6- Dielectric loss reduction is a key material improvement item for next generation build-up technology. 7- High band width up to 512 GB/s is possible with current wiring groundrule.

• Proceedings of the Korea Electromagnetic Engineering Society Conference
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• 2003.11a
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• pp.496-500
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• 2003

In This paper, a pole-zero optimized design method for multi-layed planar interdigital stripeline linear group delay bandpass filter with tap input port is presented. As a design example, a four-pole group delay filter with center frequency of 2.14GHz, bandwidth of 160MHz, and group delay variation of ${\pm}0.1nS$ for LTCC technology or multilayerd PCB technology is designed. In the design process, as well the whole structure is not necessary to be simulated, and within three times of optimizing process we have good result as well. This design method could be useful for controlling error correction of manufacturing process as well as design stage.

• Journal of Power Electronics
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• v.9 no.2
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• pp.308-319
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• 2009

An increasing number of power electronic applications require high power density. Therefore, the switching frequency and switching speed have to be raised considerably. However, the very fast switching transients induce a strong voltage and current ringing. In this work, a novel damping concept is introduced where the parasitic wiring inductances are advantageously magnetically coupled with a damping layer for attenuating these unwanted oscillations. The proposed damping layer can be implemented using standard materials and printed circuit board manufacturing processes. The system behavior is analyzed in detail and design guidelines for a damping layer with optimized RC termination network are given. The effectiveness of the introduced layer is determined by layout parasitics which are calculated by application of the Partial Element Equivalent Circuit (PEEC) simulation method. Finally, simulations and measurements on a laboratory prototype demonstrate the good performance of the proposed damping approach.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.23 no.1
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• pp.38-41
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• 2010

Compared to conventional molding technology, the color uniformity of light direction emitted from LED is improved with PCB type lead frame technology in which metal thin film is used and transfer molding technology which makes the density of phosphor uniform by manufacturing high density LED lamp. The light efficiency and the color uniformity of the LED are improved by molding the phosphor layer outside of chip and controlling the thickness of the phosphor layer. CIE x,y difference of LED in major axis is also improved uniformly from 0 to 90 degrees.

• Journal of the Korean Society for Precision Engineering
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• v.16 no.3 s.96
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• pp.47-52
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• 1999

Theoretical and experimental studies on burr formation and deburring in many manufacturing processes have been actively pursued. Though micro-drilling has become more important in the production of precision parts such as PCB, air bearing, camera and nozzle, most studies on drilling burr formation have focused on the conventional drilling process. This paper describes burr formation process and the effect of cutting conditions such as spindle speed, feedrate and drilling depth per one step on burr formation in drilling A6061 with drills of diameter 1.0mm and 0.6mm. Experimental results showed that burr with cap were formed at relatively low feedrates, while petal burrs with several large burr fragments were formed at high feedrates. Burr height appeared to increase at the hight feedrates and lower spindle speeds. The effect of final cutting depth on burr height was negligible.

• Analytical Science and Technology
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• v.18 no.5
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• pp.410-418
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• 2005

PCBs had numerous uses such as hydraulic fluid, heat exchange fluid, sealant, lubricant, and carbonless copy paper. They are most likely found in electric utilities, power stations, industrial facilities, electronic manufacturing plants, petrochemical plants, railroad systems, electric equipment repair facilities, mining sites (active or abandoned), and military camps. Due to its outstanding chemical and thermal stabilities and electrical insulation properties, the commercial and industrial products of PCBs, such as Aroclors, Kaneclors, Clophens, Phenaclors etc., had been widely used as thermal oil and transformer oil from 1930s until the 1970s. The transformer oils were analyzed as a main source of polychlorinated biphenyls (PCBs) emission into the environment. Qualitative estimation of oil extracts as carried out with Aroclor 1242, 1248, 1254, 1260. The transformer oils contained the pure and mixed of Aroclor 1242, Aroclor 1254, and Aroclor 1260. Also, commercial screening kit of 20 ppm and 50 ppm were applied to the transformer oil samples.

• Clean Technology
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• v.19 no.2
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• pp.84-89
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• 2013

The running blots between patterns during electroless nickel electroless palladium immersion gold (ENEPIG) surface finish of printed circuit board (PCB) are investigated and a proper solution is presented. Computational chemistry is first employed to understand the process and experiments are then designed to verify the proposed ideas. A $PdCl_2$ activator which has relatively weak chemical bonding to the epoxy resin is introduced to prevent the formation of palladium seeds on the epoxy resin and a couple of operational measures such as increasing HCl concentration and lowering the temperature of Pd activation process are executed to prevent a further hydrolysis of $PdCl_2$ to more stable $Pd(OH)_2$ in aqueous solution. Computational chemistry provides thermodynamic backgrounds for experiments and their results. This combined approach is expected to be very useful in the research of relevant processes.

• Resources Recycling
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• v.22 no.2
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• pp.71-77
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• 2013

Electronic products such as appliances, computers, and cellular phones have printed circuit boards (PCBs) in common and the PCBs in the waste electronic products contain valuable metals and organic resins. In Korea, recovery and recycling of the organic resins as well as the valuable metallics from the wastes are required indeed as the most of resources are being imported from abroad. In this article, the patents and papers for the recycling of organic residues from the waste PCBs were collected and analyzed. The open patents of USA (US), European Union (EP), Japan (JP), and Korea (KR) and SCI journals from 1979 to 2012 were investigated. The patents and journals were collected using key-words and filtered by the definition of the technology. The patents and journals were analyzed by the years, countries, companies, and technologies and the technical trends were discussed in this paper. It is showed sluggish relatively activity of published papers and patent applications for polymer manufacturing technology in local and abroad.

• Journal of the Microelectronics and Packaging Society
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• v.10 no.3
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• pp.43-55
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• 2003

As the development of If industries and their electronic device manufacturing technology have been accelerated recently, the request for electronic devices with small size, light weight, and high performance has been inducing that electronic package and substrate (PCB) companies have to develop substrates with low cost, high dense I/O, excellent thermal properties and electrical properties. Therefore, world-wide chip makers have been setting their own severe reliability standards and requiring their suppliers to keep specification and to develop green, high frequency and high-performing substrates. Because properties of substrates are dependent mainly on their constituent materials, the application of them showing superior properties is expected to satisfy the customer's requirement. Therefore, substrate companies should ensure the superiority of materials and assure their competitive capability of substrates by analyzing the latest trends of technology and properties of the materials.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.38 no.8
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• pp.869-874
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• 2014

It is possible to fabricate a three-dimensional (3D) shape using the solid freeform fabrication (SFF) technology. However, there are several problems in applying conventional SFF technologies to the direct manufacturing of a product. Hence, multimaterial SFF is gaining attention. Moreover, a 3D circuit device that is different from a conventional two-dimensional PCB can also be fabricated using multimaterial SFF. In this study, a hybrid system using fused deposition modeling and direct writing was designed for 3D circuit device fabrication.