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http://dx.doi.org/10.3795/KSME-A.2014.38.8.869

Development of Hybrid Fused Deposition Modeling System for Three-Dimensional Circuit Device Fabrication  

O, Sung Taek (Dept. of Precision Mechanical Engineering, Chungbuk Nat'l Univ.)
Lee, In Hwan (School of Mechanical Engineering, Chungbuk Nat'l Univ.)
Kim, Ho-Chan (Dept. of Mechanical & Automotive Engineering, Andong Nat'l Univ.)
Cho, Hae Yong (School of Mechanical Engineering, Chungbuk Nat'l Univ.)
Publication Information
Transactions of the Korean Society of Mechanical Engineers A / v.38, no.8, 2014 , pp. 869-874 More about this Journal
Abstract
It is possible to fabricate a three-dimensional (3D) shape using the solid freeform fabrication (SFF) technology. However, there are several problems in applying conventional SFF technologies to the direct manufacturing of a product. Hence, multimaterial SFF is gaining attention. Moreover, a 3D circuit device that is different from a conventional two-dimensional PCB can also be fabricated using multimaterial SFF. In this study, a hybrid system using fused deposition modeling and direct writing was designed for 3D circuit device fabrication.
Keywords
3-Dimensional Circuit Device; Direct Writing; Solid Freeform Fabrication; Fused Deposition Modeling;
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