• 제목/요약/키워드: PCB manufacturing

검색결과 191건 처리시간 0.024초

Direct Write 기술을 이용한 3DCD의 제작 (Fabrication of 3D-Printed Circuit Device using Direct-Write Technology)

  • 윤해룡;김호찬;이인환
    • 한국기계가공학회지
    • /
    • 제15권2호
    • /
    • pp.1-8
    • /
    • 2016
  • Generally, electrical circuits are fabricated as Printed Circuit Boards (PCBs) and mounted on the casing of the product. Additionally, this requires many other parts and some labor for assembly. Recently, molding technology has increasingly been applied to embed simple circuits in plastic casing. The technology is called a Molded Interconnected Device (MID). By using this technology, PCB fabrication can be replaced by molding, and much of the corresponding assembly process for PCBs can be eliminated if the circuit is simple enough for molding. Furthermore, as the improvement of conductive materials and printing technologies of simple electric circuits can be printed directly on the casing part, this also reduces the complexity of the product design and production cost. Therefore, this paper introduces a new MID fabrication process using direct 3D printing technology. Additionally, it is applied to an automotive part of a cruise control switch. The methodology and design are shown.

쾌속조형기에 의한 기어식 주유장치의 개발 (Development of gear type grease lubricator by rapid prototyping)

  • 왕덕현
    • 한국기계가공학회지
    • /
    • 제13권6호
    • /
    • pp.46-53
    • /
    • 2014
  • An automatic grease lubricator provides an adequate amount of fresh grease constantly to any type of rotating machine to minimize friction heat and reduce friction loss. This study seeks to develop an automatic grease lubricator by means of rapid prototyping with a gear-driven mechanism and a controlled operation time. The ultimate design is to lubricate an adequate amount of grease by a simple dip-switch clicking mechanism according to an advanced set cycle. The backlash of the gear was minimized to increase the power, and to increase the power of the mechanism, the binding frequency and the thickness of the coil were changed. To control the rotation cycles of the main shaft according to certain set numbers, different resistances and chips were used in the design of the circuit which controls the electrical signals via a pulse. A digital mock-up was analyzed and the rapid prototyping (RP) trial products were tested with a PCB circuit and grease. An evaluation of the outlet capacity of RP trial products was conducted, as the friction caused by the outlet on the wall surface was an important factor in the operation of the equipment. Finally, a finishing process was applied to decrease the roughness of a surface to a comparable level to test the performance of the product.

플렉서블 양각금형의 마이크로 밀링가공에서 하이브리드 윤활공정에 따른 공구마멸과 표면조도 특성 (Characteristics of Tool Wear and Surface Roughness using for Hybrid Lubrication in Micro-Milling Process of Flexible Fine Die)

  • 김민욱;류기택;강명창
    • 한국기계가공학회지
    • /
    • 제12권6호
    • /
    • pp.30-36
    • /
    • 2013
  • An FFD(flexible fine die) is an embossed mold that consists of a thin plate ranging from 0.6 to 3 mm in thickness. FFDs are primarily used for cutting LCD films and F-PCB sheets. In the high-speed micro-milling process of flexible fine dies, the lubrication and cooling of the cutting edges is very important from the aspect of eco machining and cutting performance. In this paper, a comparative study of tool wear and surface roughness between cutting fluid and hybrid lubrication for eco-machining of FFD was conducted for processes of high-speed machining of highly hardened material (STC5, HRC52). Especially, the incorporated fluid method for eco machining, in which the cutting performances can be simultaneously measured, was introduced. The machining results show that hybrid lubrication, instead of conventional cutting fluid, leads to excellent tool wear and surface roughness and represents the proper conditions for eco micro-machining of flexible fine dies.

30W급 LED 투광등 히트싱크 높이변화에 따른 온도분포에 관한 실험적 연구 (An Experimental Study on the Temperature Distribution according to the Heat Sink Height of 30W LED Floodlight)

  • 김대언;정한식;정효민;이중섭
    • 한국기계가공학회지
    • /
    • 제16권5호
    • /
    • pp.150-156
    • /
    • 2017
  • This study tests the characteristics of heat radiation by applying the pin-height variables to 30-W LED floodlights. The angle of the heat sink enables us to identify the characteristics of the heat radiation based on the temperature distribution. The results of the study are as follows. When the heat sinks are set towards the ground, the heat transfer decreases in speed only to expands the temperature distribution, which adversely affects the characteristics of heat radiation and expands the temperature distribution of PCB with the LED chip. We verify that the characteristics of heat radiation are adversely affected when the height of the cooling pin decreases and the heat radiation area decreases, which impedes the heat transfer and increases the temperature distribution on the heat sink.

대기압 유전체배리어방전으로 합성 및 산화 처리된 SiOxCy(-H) 박막의 부식방지 특성 (Anti-corrosion Properties of SiOxCy(-H) thin Films Synthesized and Oxidized by Atmospheric Pressure Dielectric Barrier Discharge)

  • 김기택;김윤기
    • 한국표면공학회지
    • /
    • 제53권5호
    • /
    • pp.201-206
    • /
    • 2020
  • A SiOxCy(-H) thin film was synthesized by atmospheric pressure dielectric barrier discharge(APDBD), and a SiO2-like layer was formed on the surface of the film by oxidation treatment using oxygen plasma. Hexamethylcyclotrisiloxane was used as a precursor for the SiOxCy(-H) synthesis, and He gas was used for stabilizing APDBD. Oxygen permeability was evaluated by forming an oxidized SiOxCy(-H) thin film on a PET film. When the single-layer oxidized SiOxCy(-H) film was coated on the PET, the oxygen gas permeability decreased by 46% compared with bare PET. In case of three-layer oxidized SiOxCy(-H) film, the oxygen gas permeability decreased by 73%. The oxygen permeability was affected by the thickness of the SiO2-like layer formed by oxidation treatment rather than the thickness of the SiOxCy(-H) film. The excellent corrosion resistance was demonstrated by coating an oxidized SiOxCy(-H) thin film on the silver-coated aluminum PCB for light emitting diode (LED).

고속 복합재료 공기 주축부를 위한 추력베어링 설계 (Thrust Bearing Design for High-Speed Composite Air Spindles)

  • 방경근;이대길
    • 대한기계학회논문집A
    • /
    • 제26권10호
    • /
    • pp.1997-2007
    • /
    • 2002
  • Composite air spindles are appropriate for the high-speed and the high-precision machining as small hole drilling of printed circuit board (PCB) or wafer cutting for manufacturing semiconductors because of the low rotational inertia, the high damping ratio and the high fundamental natural frequency of composite shaft. The axial load and stiffness of composite air spindles fur drilling operation are determined by the thrust ben ring composed of the air supply part mounted on the housing and the rotating part mounted on the rotating shaft. At high-speed rotation, the rotating part of the thrust bearing should be designed considering the stresses induced by centrifugal force as well as the axial stiffness and the natural frequency of the rotating shaft to void the shaft from failure due to the centrifugal force and resonant vibration. In this work, the air supply part of the thrust bearing was designed considering the bending stiffness of the bearing and the applied load. The rotating part of the thrust bearing was designed through finite element analysis considering the cutting forces during manufacturing as well as the static and dynamic characteristics under both the axial and con trifugal forces during high-speed rotation.

시작시기와 납기를 고려하는 유연흐름공장의 일정계획 (A Scheduling Scheme for Flexible Flow Shop with Release Date and Due Date)

  • 이주한;김성식
    • 산업공학
    • /
    • 제11권3호
    • /
    • pp.1-13
    • /
    • 1998
  • This paper addresses a scheduling scheme for Flexible Flow Shop(FFS) in the case that a factory is a sub-plant of an electronic device manufacturing plant. Under this environment, job orders for the sub-plants in the production route are generated together with job processing time bucket when the customer places orders for final product. The processing time bucket for each job is a duration from possible release date to permissible due date. A sub-plant modeled FFS should schedule these jobs orders within time bucket. Viewing a Printed Circuit Board(PCB) assembly line as a FFS, the developed scheme schedules an incoming order along with the orders already placed on the scheduled. The scheme consists of the four steps, 1)assigning operation release date and due date to each work cells in the FFS, 2)job grouping, 3)dispatching and 4)machine allocation. Since the FFS scheduling problem is NP-complete, the logics used are heuristic. Using a real case, we tested the scheme and compared it with the John's algorithm and other dispatching rules.

  • PDF

반도체 공정용 수직로 설계를 위한 열유동 제어. (The Third National Congress on Fluids Engineering: Thermal design for the vertical type oven of soldering process.)

  • 정원중;권현구;조형희
    • 유체기계공업학회:학술대회논문집
    • /
    • 유체기계공업학회 2006년 제4회 한국유체공학학술대회 논문집
    • /
    • pp.561-564
    • /
    • 2006
  • Because of new requirements related to the employment of SMT(Surface Mounting Technology) manufacturing and the diversity of components on high density PCB(printed circuit boards), Thermal control of the reflow process is required in oder to achieve acceptable yields and reliability of SMT assemblies. Accurate control of the temperature distribution during the reflow process is one of the major requirements, especially in lead-free assembly. This study has been performed for reflow process using the commercial CFD tool(Fluent) for predicting flow and temperature distributions. There was flow recirculation region that had a weak point in the temperature uniformity. Porous plate was installed to prevent and minimize flow recirculation region for acquiring uniform temperature in oven. This paper provided design concept from CFD results of the steady state temperature distribution and flow field inside a reflow oven.

  • PDF

마이크로 드릴링 M/C에 의한 미세구멍가공특성에 관한 연구 (A Study on the Characteristics of Micro Deep Hole Machining in Micro Drilling Machine)

  • 민승기;이동주;이응숙;강재훈;김동우
    • 한국공작기계학회:학술대회논문집
    • /
    • 한국공작기계학회 2001년도 춘계학술대회 논문집(한국공작기계학회)
    • /
    • pp.275-280
    • /
    • 2001
  • Recently, the trends of industrial products grow more miniaturization, variety and mass production. Micro drilling which take high precision in cutting work is requested more micro hole and high speed working. Especially, Micro deep hole drilling is becoming more important in a wide spectrum of precision production industries, ranging from the production of automotive fuel injection nozzle, watch and camera parts, medical needles, and thick multi-layered Printed Circuit Boards(PCB) that are demanded for very high density electric circuitry. This paper shows the tool monitoring results of micro drill with tool dynamometer. And additionally, microscope with built-in monitor inspection show the relationship between burr in workpiece and chip form of micro drill machining.

  • PDF

Ball Bar를 이용한 칩마운터의 운동 오차 정밀도 측정 및 평가 기술 개발 (Development of measuring and calibrating technology for moving error and precision of chip mounter using Ball Bar)

  • 이창하;김정환;박희재
    • 한국정밀공학회:학술대회논문집
    • /
    • 한국정밀공학회 2000년도 춘계학술대회 논문집
    • /
    • pp.621-628
    • /
    • 2000
  • A kinematic ball bar measuring system can analyze the various errors of a machine tool easil rapidly with only one measurement, But it cannot be used to measure the errors of the equipment the semiconductor manufacturing (e.g. chip mounter, PCB router etc.) not to use a cir interpolation. This paper presents the method to apply a kinematic ball bar measuring system tc machines which use merely a linear interpolation Also, the work of measuring and calibratir various errors of a chip mounter with a kinematic bal1 bar measurement system is accomplished

  • PDF