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http://dx.doi.org/10.14775/ksmpe.2016.15.2.001

Fabrication of 3D-Printed Circuit Device using Direct-Write Technology  

Yun, Hae Young (Department of Mechanical & Automotive Engineering, Andong National Univ.)
Kim, Ho Chan (Department of Mechanical & Automotive Engineering, Andong National Univ.)
Lee, In Hwan (School of Mechanical Engineering, Chungbuk National University)
Publication Information
Journal of the Korean Society of Manufacturing Process Engineers / v.15, no.2, 2016 , pp. 1-8 More about this Journal
Abstract
Generally, electrical circuits are fabricated as Printed Circuit Boards (PCBs) and mounted on the casing of the product. Additionally, this requires many other parts and some labor for assembly. Recently, molding technology has increasingly been applied to embed simple circuits in plastic casing. The technology is called a Molded Interconnected Device (MID). By using this technology, PCB fabrication can be replaced by molding, and much of the corresponding assembly process for PCBs can be eliminated if the circuit is simple enough for molding. Furthermore, as the improvement of conductive materials and printing technologies of simple electric circuits can be printed directly on the casing part, this also reduces the complexity of the product design and production cost. Therefore, this paper introduces a new MID fabrication process using direct 3D printing technology. Additionally, it is applied to an automotive part of a cruise control switch. The methodology and design are shown.
Keywords
3D Printing; Molded Interconnect Device; Silver Paste; Direct Writing; 3 Dimensionally Printed Circuit Device;
Citations & Related Records
Times Cited By KSCI : 1  (Citation Analysis)
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