1 |
A. S. da Silva Sobrinho, N. Schuehler, J. E. Klemberg-Sapieha, and M. R. Wertheimer, et al., Plasma-deposited silicon oxide and silicon nitride films on poly (ethylene terephthalate): a multitechnique study of the interphase regions, J. Vac. Sci. Technol. A16 (1998) 2021-2030.
|
2 |
M. Bose, D. N. Bose, D. K. Basa, Plasma enhanced growth, composition and refractive index ofsilicon oxynitride films, Mater. Lett., 52 (2002) 417-422.
DOI
|
3 |
A. N. R. da Silva, N. I. Morimoto, O. Bonnaud, Tetraethylorthosilicate films deposited at a low temperature, Microelectron. Reliab. 40 (2000) 621-624.
DOI
|
4 |
D. S. Wuu, W. C. Lo, L. S. Chang, R. H. Horng, Properties of SiO2-like barrier layers on polyethersulfone substrates by low-temperature plasma-enhanced chemical vapor deposition, Thin Solid Films 468 (2004) 105-108.
DOI
|
5 |
R. Foest, F. Adler, F. Sigeneger, M. Schmidt, Study of an atmospheric pressure glow discharge (APG) for thin film deposition, Surf. Coat. Technol. 163-164 (2003) 323-330.
DOI
|
6 |
Y. Sada, et al., Synthesis of plasma-polymerized tetraethoxysilane and hexamethyldisiloxane films prepared by atmospheric pressure glow discharge, Appl. Phys. D 28 p (1995) 1661-1669.
DOI
|
7 |
S. Martin, F. Massines, N. Gherardi, C. Jimenez, Atmospheric pressure PE-CVD of silicon based coatings using a glow dielectric barrier discharge, Surface and Coatings Tech. 177-178 (2004) 693-698.
DOI
|
8 |
Y. K. Kim, G. T. Kim, Oxygen Plasma Treatment of (-H)Films polymerized by Atmospheric Pressure Dielectric Barrier Discharge using Hexamethylcyclrotrisiloxane, Thin Solid Films 519 (2011) 6750-6754.
DOI
|
9 |
Alfred Grill, Cold Plasma in Materials Fabrication, IEEE press Inc., New York, (1989)
|
10 |
J. G. Kim, Y. K. Kim, Optical Emission Characteristics of Atmospheric Pressure Dielectric Barrier Discharge, Korean J. Mater. Res 25 (2015) 100-106.
DOI
|