• 대한기계학회논문집A
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• 제21권1호
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• pp.1-11
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• 1997

Austomated visual inspection(AVI) capability has become an important key component in the automated manufacturing system. In such a visual inspection system an intensity(or color) image of a scene is quickly affected by optical property of objects, condition and roughness of surface, lens and filters, image sensor property and lighting system. In particular, the lighting system disign is the most important factor, since it affects overall performance of the visual system. For fast and cheap automated visual inspection system it is important to obtain the good image quality which results from careful attention to the design of the lighting system. In this paper, the lighting subsystem of AVI system is analysed for the inspection of printed circuit board(PCB) patterns. The spectral reflectance of materials, which are composed of PCB, is measured for choosing the light source. The reflection property is theoretically obtained by a reflection model and also obtained by experiments which measure intensity with varying the viewing direction of image sensor and the lighting direction of illuminator. The illumination uniformity of a ring-type illuminator. The lighting system is designed based upon the experimental results and theoretial analysis.

• 자원리싸이클링
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• 제20권5호
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• pp.16-33
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• 2011

E-waste는 종류가 많고 유통경로가 다양하여 눈에 보이지 않는 흐름이 주류를 형성하고 있다. E-waste에는 레어메탈의 사용이 많을 뿐 아니라 유해한 중금속도 함유되어 있어 자원확보면에서, 환경오염방지면에서 재자원화 처리가 필수적이며 정확한 재자원화 물질흐름의 분석이 요구되고 있는 실정이다. 이러한 관점에서 2008년 1월부터 실시한 "전기 전자제품 및 자동차의 자원순환에 관한 법률" 중에서 E-waste와 관련된 법률내용의 골자, 리싸이클링시스템, 리싸이클링현황, E-waste 배출량 추정과 물질흐름 및 PCB의 경제학을 논하였다. 그리고 현시점에서 한국의 E-waste 재자원화산업을 약술하였다.

• Korean Chemical Engineering Research
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• 제47권6호
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• pp.688-694
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• 2009

PCB의 먼지 제거용 세정제로 사용되는 스프레이형 세정제를 선정하여 이에 대한 청정도를 평가하였다. 친환경적인 대체 세정제를 채택하기 위해서는 세정제의 세정성, 환경성, 경제성을 평가하여 체계적인 선정절차에 의거하여 도입 및 적용하여야 한다. 객관적이고 효율적인 세정성 평가방법의 정립이 현시점에서 매우 중요하다. 본 연구에서는 여러 세정성 평가 방법들 중 표면관찰평가법인 SEM-EDX(Scanning Electron Microscopy/Energy-Dispersive X-ray) 분석과 적외선열화상카메라(THERMOVISION A20 model)를 이용하여 청정도를 평가하였다. CT-2770 모델의 사운드카드를 $2{\times}2cm$로 잘라내어 스프레이 세정 전과 후의 청정도를 SEM의 이미지 분석을 통해 관찰할 수 있었고 EDX의 성분분석을 통해 먼지의 제거율을 정량화할 수 있었다. 컴퓨터의 P4T-E 모델의 마더보드와 IPC-A-36 모델의 기판을 사용, 오염물로 먼지와 철가루를 사용하여 열화상카메라로 세정 전, 후의 상온과 $50^{\circ}C$ Oven에 방치된 시간의 차이에 따른 온도의 변화를 비교하였다.

• 대한안전경영과학회지
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• 제15권1호
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• pp.109-120
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• 2013

As information-oriented industry has been developed and electronic devices has come to be smaller, lighter, multifunctional, and high speed, the components used to the devices need to be much high density and should have find pattern due to high integration. Also, diverse reliability problems happen as user environment is getting harsher. For this reasons, establishing and securing products and components reliability comes to key factor in company's competitiveness. It makes accelerated test important to check product reliability in fast way. Out of fine pattern failure modes, failure of Electrochemical Migration(ECM) is kind of degradation of insulation resistance by electro-chemical reaction, which it comes to be accelerated by biased voltage in high temperature and high humidity environment. In this thesis, the accelerated life test for failure caused by ECM on fine pattern substrate, $20/20{\mu}m$ pattern width/space applied by Semi Additive Process, was performed, and through this test, the investigation of failure mechanism and the life-time prediction evaluation under actual user environment was implemented. The result of accelerated test has been compared and estimated with life distribution and life stress relatively by using Minitab software and its acceleration rate was also tested. Through estimated weibull distribution, B10 life has been estimated under 95% confidence level of failure data happened in each test conditions. And the life in actual usage environment has been predicted by using generalized Eyring model considering temperature and humidity by developing Arrhenius reaction rate theory, and acceleration factors by test conditions have been calculated.

• 한국광학회지
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• 제26권5호
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• pp.261-264
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• 2015

본 논문에서는 인쇄회로기판의 감광층 보호필름을 532 nm 파장의 나노초 레이저의 단일펄스로 박리할 수 있음을 보여준다. 인쇄회로기판의 가장자리를 9 mm 크기의 레이저 빔으로 국부적으로 박리시킨 후 스카치테이프를 레이저 조사에 의해 초기 박리 된 영역에 붙여 전체 보호필름을 떼어내었는데, 160 - 170 mJ의 펄스에너지 범위에서는 10회의 반복된 실험 모두에서 감광층 손상 없는 박리에 성공하였다. 보호필름 초기 박리에 레이저를 사용하는 방식은 기계적 압착에 바탕을 둔 기존의 널링방식과는 달리 감광층에 손상을 유발하지 않는 비접촉 방식으로써, 인쇄회로기판 제조공정에 보다 효율적으로 사용될 수 있을 것으로 판단된다.

• Design & Manufacturing
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• 제15권4호
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• pp.65-71
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• 2021

In the early days of laser invention, it was simply used as a measuring tool, but as lasers became more common, they became an indispensable processing tool in the industry. Short-wavelength lasers are used to make patterns on wafers used in semiconductors depending on the wavelength, such as CO2 laser, YAG laser, green laser, and UV laser. At first, the hole of the PCB board mainly used for electronic parts was not thin and the hole size was large, so a mechanical drill was used. However, in order to realize product miniaturization and high integration, small hole processing lasers have become essential, and pattern exposure for small hole sizes has become essential. This paper intends to analyze the characteristics through patterns by exposing the PCB substrate through DMD and polygon scanner, which are different optical systems. Since the optical systems are different, the size of the patterns was made the same, and exposure was performed under the optimal conditions for each system. Pattern characteristics were analyzed through a 3D profiler. As a result of the analysis, there was no significant difference in line width between the two systems. However, it was confirmed that dmd had better pattern precision and polygon scanner had better productivity.

• 한국정밀공학회지
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• 제27권10호
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• pp.14-22
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• 2010

The most costly and time-consuming process in the fabrication of today's multi-layer circuit board is drilling interconnection holes between adjacent layers and via holes within a layer. Decreasing size of via holes being demanded and growing number of via holes per panel increase drilling costs. Component density and electronic functionality of today's multi-layer circuit boards can be improved with the introduction of cost-effective, variable depth laser drilled blind micro via holes, and interconnection holes. Laser technology is being quickly adopted into the circuit board industry but can be accelerated with the introduction of a true production laser drilling system. In order to get optimized condition for drilling to FPCB (Flexible Printed Circuit Board), we use various drill pattern as drill step. For productivity, we investigate drill path optimization method. And for the precise drilling the thermal drift of scanner and temperature change of scan system are tested.

• Journal of Welding and Joining
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• 제31권3호
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• pp.84-88
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• 2013

These days embedded technology may be the most significant development in the electronics industry. The study focused on the development of active device embedding using flexible printed circuit in view of process and materials. The authors fabricated 30um thickness Si chip without any crack, chipping defects with a dicing before grinding process. In order to embed chips into flexible PCB, the chip pads on a chip are connected to bonding pad on flexible PCB using an ACF film. After packaging, all sample were tested by the O/S test and carried out the reliability test. All samples passed environmental reliability test. In the future, this technology will be applied to the wearable electronics and flexible display in the variety of electronics product.

• 한국산학기술학회논문지
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• 제11권7호
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• pp.2317-2322
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• 2010

신성장 동력 산업으로 분류된 LED 조명등은 점차 수요가 확대되고 있으나 본격적인 대중화를 이루기 위해서는 여전히 LED 방열 설계 최적화를 통한 긴 수명과 고효율 확보가 매우 중요하다고 하겠다. 본 연구에서는 기존 10W LED 조명등에 비하여 방열 성능이 더욱 개선된 LED 조명등을 개발하고자 하였다. 이를 위하여 기존 램프의 방열 성능 실험을 통하여 수치해석 모델을 완성하였고 이러한 수치 모델을 이용하여 방열핀 형상, PCB 종류 및 LED 개수 등과 같은 방열 설계 인자들을 최적화하였다. 또한, 시제품을 제작한 후 방열 성능을 실험으로 검증함으로써 방열 성능이 획기적으로 개선된 10W LED 조명등을 성공적으로 개발하였다.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2007년도 하계학술대회 논문집 Vol.8
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• pp.545-545
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• 2007

Recently, innovative process has been investigated in order to replace the conventional high-cost micro patterning processes on the electronic products. To produce desirable profit margins from this low cost products, printed circuit board(PCB), will require dramatic changes in the current manufacturing philosophies and processes. Innovative process using metal nano particles replaces the current industry standard of subtractive etched of copper as a highly efficient way to produce robust circuitry on low cost substrates. An advantage of using metal nano particles process in patterned conductive line manufacturing is that the process is additive. Material is only deposited in desired locations, thereby reducing the amount of chemical and material waste. Simply, it just draws on the substrate as glass epoxy or polyimide with metal nano particles. Particles, when their size becomes nano-meter scale, show some specific characteristics such as enhanced reactivity of surface atoms, decrease in melting point, high electric conductivity compared with the bulk. Melting temperature of metal gets low, the metal nano particles could be formated onto polymer substrates and sintered under $300^{\circ}C$, which would be applied in PCB. It can be getting the metal line of excellent electric conductivity.