1 |
Gambit, Fluent, Inc., Lebanon, NH 2005.
|
2 |
Ansys version 11. Ansys Inc.
|
3 |
N. Narendran and Y. Gu, "Life of LED-based White Light Sources, Journal of Display Technology, Vol.1, No. 1, pp. 167-70, 2005.
DOI
|
4 |
Lan Kim, Jong Hwa Choi and Moo Whan Shin, "Thermal analysis of LED array system with heat pipe," Thermochimica Acta, Vol 455, Issues 1-2 ,pp. 21-25, 1 April 2007
DOI
ScienceOn
|
5 |
S. Liu, J. Yang, Z Gan and X. Luo, "Structural Optimization of a Microjet Based Cooling System for High Power LEDs," International Journal of Thermal Sciences, Vol. 47, pp. 1086-095, 2008.
DOI
|
6 |
Huanting Chen, Yijun Lu, Yulin Gao, Haibing Zhang, Zhong Chen, "The performance of compact thermal models for LED package", Thermochimica Acta, Volume 488, Issues 1-2, pp. 33-38, 5 May 2009,
DOI
ScienceOn
|
7 |
A. Christensen and S. Graham, "Thermal Effects in Packaging High Power Light Emitting Diode Arrays," Applied Thermal Engineering, Vol. 29, pp. 364-371, 2009.
DOI
ScienceOn
|
8 |
Young Lim Lee and Soon Ho Hwang, "Study on Thermal Design of a 3W MR16 Light with Single High-Power LED", Journal of the Korea Academia-Industrial cooperation Society, Vol. 11, No. 4, pp.1203-1209, April 2010
과학기술학회마을
DOI
|
9 |
Catia, V5R17, Dassault Systems, 2006.
|