• ETRI Journal
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• v.37 no.3
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• pp.523-532
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• 2015

Recently, we have witnessed the gradual miniaturization of electronic devices. In miniaturized devices, flip-chip bonding has become a necessity over other bonding methods. For the electrical connections in miniaturized devices, fine-pitch solder bumping has been widely studied. In this study, high-volume solder-on-pad (HV-SoP) technology was developed using a novel maskless printing method. For the new SoP process, we used a special material called a solder bump maker (SBM). Using an SBM, which consists of resin and solder powder, uniform bumps can easily be made without a mask. To optimize the height of solder bumps, various conditions such as the mask design, oxygen concentration, and processing method are controlled. In this study, a double printing method, which is a modification of a general single printing method, is suggested. The average, maximum, and minimum obtained heights of solder bumps are $28.3{\mu}m$, $31.7{\mu}m$, and $26.3{\mu}m$, respectively. It is expected that the HV-SoP process will reduce the costs for solder bumping and will be used for electrical interconnections in fine-pitch flip-chip bonding.

• ETRI Journal
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• v.35 no.4
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• pp.625-631
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• 2013

For the formation of solder bumps with a fine pitch of 130 ${\mu}m$ on a printed circuit board substrate, low-volume solder on pad (LVSoP) technology using a maskless method is developed for SAC305 solder with a high melting temperature of $220^{\circ}C$. The solder bump maker (SBM) paste and its process are quantitatively optimized to obtain a uniform solder bump height, which is almost equal to the height of the solder resist. For an understanding of chemorheological phenomena of SBM paste, differential scanning calorimetry, viscosity measurement, and physical flowing of SBM paste are precisely characterized and observed during LVSoP processing. The average height of the solder bumps and their maximum and minimum values are 14.7 ${\mu}m$, 18.3 ${\mu}m$, and 12.0 ${\mu}m$, respectively. It is expected that maskless LVSoP technology can be effectively used for a fine-pitch interconnection of a Cu pillar in the semiconductor packaging field.

• The Bulletin of The Korean Astronomical Society
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• v.37 no.2
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• pp.228.1-228.1
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• 2012

Digital waveform generation technology for SAR payload can be divided into DDS(Direct Digital Synthesizer) method and Memory Mapped(M/M) method. DDS is the single chip which consists of the Sine Table, NCO(Numerically Controlled Oscillator), DAC, and so on. DDS method is a very simple method because the circuit configuration is not complex but has a disadvantage that can not control phase and amplitude easily by using NCO. M/M method has the complexity of the circuit configuration because it requires the memories which stores the waveforms, the control circuits, and DAC. And this method should apply the high interface technology for being compatible with the wide bandwidth of the digital signal and has the difficulty for PCB design because the number of the signal lines should be increased according to the number of the data bits for DAC. Although it has several disadvantages, this method has the capability of pre-distortion function which can compensate the phase and amplitude characteristics of the system and also has an excellent advantage to make any arbitrary waveform, so this method is considered as an important technology with DDS method. This research describes the technological trends of the waveform generator for the SAR payload and analyzes the characteristics of the technology.

• The Transactions of the Korean Institute of Electrical Engineers D
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• v.54 no.9
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• pp.531-538
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• 2005

This paper proposes an expert system which is able to enhance the accuracy and productivity by determining the test strategy based on heuristic rules for test of the hybrid electronic circuit board producted massively in production line. The test heuristic rules are obtained from test system designer, test experts and experimental results. The guarding method separating the tested device with circumference circuit of the device is adopted to enhance the accuracy of measurements in the test of analog devices. This guarding method can reduce the error occurring due to the voltage drop in both the signal input line and the measuring line by utilizing heuristic rules considering the device impedance and the parallel impedance. Also, PSA(Parallel Signature Analysis) technique Is applied for test of the digital devices and circuits. In the PSA technique, the real-time test of the high integrated device is possible by minimizing the test time forcing n bit output stream from the tested device to LFSR continuously. It is implemented in Visual C++ computer language for the purpose of the implementation of the inference engine using the dynamic memory allocation technique, the interface with the electronic circuit database and the hardware direct control. Finally, the effectiveness of the builded expert system is proved by simulating the several faults occurring in the mounting process the electronic devices to the surface of PCB for a typical hybrid electronic board and by identifying the results.

• Proceedings of the KIEE Conference
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• 2006.07c
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• pp.1587-1588
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• 2006

Tn this paper, PCB (Printed Circuit Board) embedded $BaTiO_3$ MIM capacitors were designed, fabricated, and characterized for low cost organic SOP applications by using 3-D EM simulator and low temperature processes. Size of electrodes and thickness of high dielectric films are optimized for improving the performance characteristics of the proposed embedded MIM capacitors at high frequency regime. The selected thicknesses of the $BaTiO_3$ film are $12{\mu}m$, $16{\mu}m$, and $20{\mu}m$. The fabricated MIM capacitor with dielectric constant of 30 and thickness of $12{\mu}m$ has capacitance density of $21.5p\;F/mm^2$ at 100MHz, maximum quality factor of 37.4 at 300 MHz, a quality factor of 30.9 at 1GHz, self resonant frequency of 5.4 GHz, respectively. The measured capacitances and quality factors are well matched with 3-D EM simulated ones. These embedded capacitors are promising for SOP based advanced electronic systems with various functionality, low cost, small size and volume.

• Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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• v.29 no.2
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• pp.1-7
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• 2015

The Light Emitting Diode(LED) lighting control system proposed in this thesis is made up of a sensor module, a microcontroller, Bluetooth wireless communication, LED Driver, and LED downlight. The sensor module, comprised of an infrared sensor, an illumination sensor, and a temperature sensor, was designed to one Printed Circuit board(PCB). The system is able to identify the environment information collected by the sensor, and make it possible to control lighting automatically and manually through sensors. In addition, depending on users' conditions, a color temperature can be controlled. CS-1000, a spectroradiometer, was employed to measure the changing values of a color temperature in 8 steps. According to a test, it was found that it was possible to change a color temperature from 3187K of Warm White LED to 5598K of Cool White LED. The Bluetooth based wireless communication technique makes it possible to control more lighting devices than other wireless communication techniques does.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.26 no.10
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• pp.1997-2007
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• 2002

Composite air spindles are appropriate for the high-speed and the high-precision machining as small hole drilling of printed circuit board (PCB) or wafer cutting for manufacturing semiconductors because of the low rotational inertia, the high damping ratio and the high fundamental natural frequency of composite shaft. The axial load and stiffness of composite air spindles fur drilling operation are determined by the thrust ben ring composed of the air supply part mounted on the housing and the rotating part mounted on the rotating shaft. At high-speed rotation, the rotating part of the thrust bearing should be designed considering the stresses induced by centrifugal force as well as the axial stiffness and the natural frequency of the rotating shaft to void the shaft from failure due to the centrifugal force and resonant vibration. In this work, the air supply part of the thrust bearing was designed considering the bending stiffness of the bearing and the applied load. The rotating part of the thrust bearing was designed through finite element analysis considering the cutting forces during manufacturing as well as the static and dynamic characteristics under both the axial and con trifugal forces during high-speed rotation.

• Korean Journal of Artificial Intelligence
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• v.9 no.2
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• pp.23-28
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• 2021

In this paper, we studied a system that can efficiently build security management for single-person households using Arduino, ESP32-CAM and PIR sensors, and proposed an Android app with an internet connection. The ESP32-CAM is an Arduino compatible board that supports both Wi-Fi, Bluetooth, and cameras using an ESP32-based processor. The PCB on-board antenna may be used independently, and the sensitivity may be expanded by separately connecting the external antenna. This system has implemented an Arduino-based Unauthorized intrusion system that can significantly help prevent crimes in single-person households using the combination of PIR sensors, Arduino devices, and smartphones. unauthorized intrusion system, showing the connection between Arduino Uno and ESP32-CAM and with smartphone applications. Recently, if daily quarantine is underway around us and it is necessary to verify the identity of visitors, it is expected that it will help maintain a safety net if this system is applied for the purpose of facial recognition and restricting some access. This technology is widely used to verify that the characters in the two images entered into the system are the same or to determine who the characters in the images are most similar to among those previously stored in the internal database. There is an advantage that it may be implemented in a low-power, low-cost environment through image recognition, comparison, feature point extraction, and comparison.

• Journal of the Semiconductor & Display Technology
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• v.16 no.3
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• pp.121-126
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• 2017

EES System support to maximize equipment efficiency by providing real-time information of main equipment which has a significant effect on product quality and productivity, and to prevent equipment failure by detecting equipment abnormality in advance. Smart Equipment Engineering System(S-EES) integrates the activities performed at equipment that are the core of production activities and manages them by system so as to maximize the efficiency of equipment and raise the quality level of products to one level. In other words, when the product is put into the equipment, the recipe is downloaded through the RMS, the recipe is set to the optimal condition through R2R(process control), and the system detects and controls the abnormality of the equipment during operation through the FDC function in real time it means. In this way, we are working with the suitable recipe that matches the lot of product, detecting the abnormality of the equipment during operation, preventing the product from being defective, and establishing a system to maximize the efficiency through real-time equipment management. In this study, we review the present status and problems of equipment management in actual production lines, collect the requirements of the manufacturing line for the PCB line, design and develop the system, The measurement model was studied.

• Journal of Navigation and Port Research
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• v.31 no.6
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• pp.503-507
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• 2007

In this paper, the ultra-widebend, microstrip patch antenna with the bandwidth of 3 GHz was implemented for ultra-wideband(UWB) wireless communication applications. In order to cover the very wide bandwidth of 3 GHz, a multi-resonance antenna was designed, each resonance frequency was separated into five frequency bend, 7.5, 8.1, 8.7, 9.3, and 9.9GHz with the interval of 600MHz BW. And for wideband characteristics of each antenna, U-slot antennas were designed at each center frequency. Designed five U-slot antennas were connected in series for multi-resonance of 3GHz BW and wideband matching was also designed for impedance matching transmission line calculated. The relative dielectric constant, the height, the loss tangent of the PCB substrate were ${\epsilon}_r=4.8,\;h=0.6$ and loss tangent=0.0009 respectively. The implemented antenna's radiation patterns and gain were directivity characteristics and $1.46{\sim}4.08dBi$ at the five separated center frequency.