• 대한기계학회:학술대회논문집
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• 대한기계학회 2001년도 춘계학술대회논문집D
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• pp.390-395
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• 2001

Cooling characteristics using convection and conduction heat transfer in a parallel channel with extruding heat sources are studied numerically. A two-dimensional model has been developed for numerical prediction of transient, compressible, viscous, laminar flow, and conjugate heat transfer between parallel plates with uniform block heat sources. The finite volume method is used to solve this problem. The considered assembly consists of two channels formed by two covers and one PCB which has three uniform heat source blocks. Five different cooling methods are considered to find efficient cooling method in a given geometry and heat source. The velocity and temperature fields, local temperature distribution along surface of blocks, and the maximum temperature in each block are obtained.

• 산업공학
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• 제7권1호
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• pp.67-74
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• 1994

In this study, we propose an integrated CAD(Computer Aided Design) library database in a heterogeneous commercial ECAD(Electronic CAD) environment. To effectively solve engineering problems focused on BOM data extraction we use a software system called schematic capture and company-wide standard electronic part information loaded on different commercial ECADs. We unify many commercial ECADs into one schematic capture and a variety of PCB(Printed Circuit Board) design tools. For this purpose we develope a model for linking CAD symbol library with company-wide standard part information. We also develope a schematic design data conversion scheme and show how to extract PBA level BOM data using our customized schematic capture. This system is being operated in an X-Window based engineering work station and commercial RDBMS base.

• 산업공학
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• 제11권3호
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• pp.1-13
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• 1998

This paper addresses a scheduling scheme for Flexible Flow Shop(FFS) in the case that a factory is a sub-plant of an electronic device manufacturing plant. Under this environment, job orders for the sub-plants in the production route are generated together with job processing time bucket when the customer places orders for final product. The processing time bucket for each job is a duration from possible release date to permissible due date. A sub-plant modeled FFS should schedule these jobs orders within time bucket. Viewing a Printed Circuit Board(PCB) assembly line as a FFS, the developed scheme schedules an incoming order along with the orders already placed on the scheduled. The scheme consists of the four steps, 1)assigning operation release date and due date to each work cells in the FFS, 2)job grouping, 3)dispatching and 4)machine allocation. Since the FFS scheduling problem is NP-complete, the logics used are heuristic. Using a real case, we tested the scheme and compared it with the John's algorithm and other dispatching rules.

• 유체기계공업학회:학술대회논문집
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• 유체기계공업학회 2006년 제4회 한국유체공학학술대회 논문집
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• pp.561-564
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• 2006

Because of new requirements related to the employment of SMT(Surface Mounting Technology) manufacturing and the diversity of components on high density PCB(printed circuit boards), Thermal control of the reflow process is required in oder to achieve acceptable yields and reliability of SMT assemblies. Accurate control of the temperature distribution during the reflow process is one of the major requirements, especially in lead-free assembly. This study has been performed for reflow process using the commercial CFD tool(Fluent) for predicting flow and temperature distributions. There was flow recirculation region that had a weak point in the temperature uniformity. Porous plate was installed to prevent and minimize flow recirculation region for acquiring uniform temperature in oven. This paper provided design concept from CFD results of the steady state temperature distribution and flow field inside a reflow oven.

• 제어로봇시스템학회:학술대회논문집
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• 제어로봇시스템학회 2002년도 ICCAS
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• pp.97.4-97
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• 2002

1. Introduction Pose estimation of a three dimensional object has been studied in robot vision area, and it is needed in a number of industrial applications such as process monitoring and control, assembly and PCB inspection. In this research, we propose a new pose estimation method based on principal axes analysis. Here, it is assumed that the locations of x-ray source and the image plane are predetermined and the object geometry is known. To this end, we define a dispersion matrix of an object, which is a discrete form of inertia matrix of the object. It can be determined here from a set of x-ray images, at least three images are required. Then, the pose information is obtained fro...

• 제어로봇시스템학회논문지
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• 제21권10호
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• pp.982-987
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• 2015

The inspection machine in SMT (Surface Mount Technology) line detects the assembly defects such as missing, misalignment, loosing, or tombstone. We propose a new method to classify the defect types of chip components by processing the image of PCB. Two original images are obtained from horizontal lighting and vertical lighting. The image of the component is divided into two soldering regions and one packaging region. The features are extracted by appling the PCA (Principle Component Analysis) to each region. The MLP (Multilayer Perceptron) and SVM (Support Vector Machine) are then used to classify the defect types by learning. The experimental results are presented to show the usefulness of the proposed method.

• 한국정밀공학회지
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• 제31권12호
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• pp.1061-1066
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• 2014

Generally electrical circuits are fabricated as PCB(Printed Circuit Board) and mounted on a casing of the product. And it requires lots of other parts and some labor for assembly. Recently a molding technology is increasingly applied to embed simple circuits on a plastic casing. The technology is called as MID(Molded Interconnected Device). Therefore this paper introduces a new MID fabrication process by using direct 3D printing technology.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 1994년도 추계학술대회 논문집
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• pp.504-509
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• 1994

Recently SMT is used widely to place the SMD on bare board which is very small and highly integrated. And that is one of the issue directly in the electric products assembly process and especiallly in the field of optimizing electric product's performance, automatically tuning method which is highly demanded in the electronics industry. To tune product's performance, variable resistances's resistivity should be changed until it has good performance characteristics. In this paper to automatically regulate the 8mm camcoder's performance, it is proposed variable resistence's center position and orientation detection algorithm by image processing, which has very precise and accurate result. And we found optimal conditions which can have effects on image acquisition process. And real time processing is done by DSP to detect vr's center and orientation. This results make it possible to utilize proposed image processing algorithm and system directly in electronics industry.

• 한국산업융합학회 논문집
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• 제4권3호
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• pp.289-294
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• 2001

In this paper a POCSAG receiver interface circuit for wireless remote control using pager system is presented. SM8212A and AT89C51 chips are used for the core of system design. The proposed system is able to communicate with computers through RS-232C interface, which enables users to manage the data from the pager system on computers in real time. Analysis of SM8212A for Ole algorithm of CPU control program is described. The hardware is implemented on a PCB and the control program is made by C++ and assembly language. The performance of designed system is confirmed by experiments using the TESCOM equipments.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2002년도 추계학술대회 논문집
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• pp.488-491
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• 2002

This growth if WWW(World Wide Web) with the spread of ADSL provides us with a variety of service that are the extensions of opportunities to get information. a various education methods by remote courses and electronic commerce. Remote Monitoring Server(RMS) that uses internet and WWW is constructed for chip mounter. Hardware base consists of RMS, chip mounter and C/S server. In this paper, we realize the remote management system with monitoring and diagnosis function to efficiently operate chip mounter the one of PCB assembly equipment. The remote management system for chip mounter consists of RMS(Remote Monitoring Server) and C/S server. RMS manages real-time information from chip mounter through TCP/IP. RMS that utilizes real-time information informs user of the actual output the operation status of chip mounter, user of the actual output, the operation status of chip mounter, the trouble code and the trouble description.