Proceedings of the KSME Conference (대한기계학회:학술대회논문집)
- 2001.06d
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- Pages.390-395
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- 2001
Numerical Analysis on Cooling Characteristics of Electronic Components Using Convection and Conduction Heat Transfer
대류와 전도 열전달을 이용한 전자부품의 냉각특성 수치해석
- Published : 2001.06.27
Abstract
Cooling characteristics using convection and conduction heat transfer in a parallel channel with extruding heat sources are studied numerically. A two-dimensional model has been developed for numerical prediction of transient, compressible, viscous, laminar flow, and conjugate heat transfer between parallel plates with uniform block heat sources. The finite volume method is used to solve this problem. The considered assembly consists of two channels formed by two covers and one PCB which has three uniform heat source blocks. Five different cooling methods are considered to find efficient cooling method in a given geometry and heat source. The velocity and temperature fields, local temperature distribution along surface of blocks, and the maximum temperature in each block are obtained.
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