• 센서학회지
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• 제14권4호
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• pp.237-243
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• 2005

Strain gauge type load cell is used widely as weight sensor. However, it has problems such as noise, power consumption, high cost and big size. Semiconductor type piezoresistive pressure sensor is practically used in recent for low hysteresis, good linearity, small size, light weight and strong on vibration. In this paper, we have fabricated the piezoresistive pressure sensor and packaged the miniature weight sensor. We packaged the miniature weight sensor by flip-chip bonding between die and PCB for durability, because the weight sensor is directly contacted on a physical solid distinct from air and oil pressure. We measured the characteristics of the weight sensor, which had the output of $10{\sim}80$ mV on the weight range of $0{\sim}2$ kg. In the result, we could fabricate the weight sensor with an accuracy of 3 %FSO linearity.

• 대한기계학회논문집A
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• 제26권10호
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• pp.1997-2007
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• 2002

Composite air spindles are appropriate for the high-speed and the high-precision machining as small hole drilling of printed circuit board (PCB) or wafer cutting for manufacturing semiconductors because of the low rotational inertia, the high damping ratio and the high fundamental natural frequency of composite shaft. The axial load and stiffness of composite air spindles fur drilling operation are determined by the thrust ben ring composed of the air supply part mounted on the housing and the rotating part mounted on the rotating shaft. At high-speed rotation, the rotating part of the thrust bearing should be designed considering the stresses induced by centrifugal force as well as the axial stiffness and the natural frequency of the rotating shaft to void the shaft from failure due to the centrifugal force and resonant vibration. In this work, the air supply part of the thrust bearing was designed considering the bending stiffness of the bearing and the applied load. The rotating part of the thrust bearing was designed through finite element analysis considering the cutting forces during manufacturing as well as the static and dynamic characteristics under both the axial and con trifugal forces during high-speed rotation.

• 마이크로전자및패키징학회지
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• 제27권1호
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• pp.55-65
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• 2020

반도체 패키지에서 언더필의 사용은 패키지의 응력 완화 및 습기 방지에 중요할 뿐만 아니라, 충격, 진동 시에 패키지의 신뢰성을 향상시키는 중요한 소재이다. 그러나 최근 패키지의 크기가 커지고, 매우 얇아짐에 따라서 언더필의 사용이 오히려 패키지의 신뢰성을 저하하는 현상이 발견되고 있다. 이러한 이슈를 해결하기 위하여 본 연구에서는 언더필을 대신 할 소재로서 solid epoxy를 이용한 패키지를 개발하여 신뢰성을 향상시키고자 하였다. 개발된 solid epoxy를 스마트 폰의 AP 패키지에 적용하여 열사이클링 신뢰성 시험과 수치해석을 통하여 패키지의 신뢰성을 평가하였다. 신뢰성 향상을 위한 최적의 solid epoxy 소재 및 공정 조건을 찾기 위하여 solid epoxy 의 사용 개수, PCB 패드 타입 및 solid epoxy의 물성 등, 3 개의 인자가 패키지의 신뢰성에 미치는 영향을 고찰하였다. Solid epoxy를 AP 패키지에 적용한 결과 solid epoxy가 없는 경우 보다, solid epoxy를 적용한 경우가 신뢰성이 향상되었다. 또한 solid epoxy를 패키지의 외곽 4곳에 적용한 경우 보다는 6 곳에 적용한 경우가 더 신뢰성이 좋음을 알 수 있었다. 이는 solid epoxy가 패키지의 열팽창에 따른 응력을 완화 시키는 역할을 하여 패키지의 신뢰성이 향상되었음을 의미한다. 또한 PCB 패드 타입에 대한 신뢰성을 평가한 결과 NSMD (non-solder mask defined) 패드를 사용할 경우가 SMD (solder mask defined) 패드 보다 신뢰성이 더 향상됨을 알 수 있었다. NSMD 패드의 경우 솔더와 패드가 접합하는 면적이 더 크기 때문에 구조적으로 안정하여 신뢰성 측면에서 더 유리하기 때문이다. 또한 열팽창계수가 다른 solid epoxy를 적용하여 신뢰성 평가를 한 결과, 열팽창계수가 낮은 solid epoxy를 사용한 경우가 신뢰성이 더 향상됨을 알 수 있었다.

• 한국신뢰성학회지:신뢰성응용연구
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• 제15권4호
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• pp.241-247
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• 2015

Purpose : The demand for higher fuel economy vehicles has helped develop fuel-efficient vehicles such as a CVVL called continuous variable valve lift. Existing CVVL has been applying DC type motor to control intake valve, but recently some car parts manufacturers have been developing a BLDC type CVVL motor for improvements of endurance performance. The purpose of this study is to find the potential failure mechanism of the CVVL BLDC moto in early stage of development based on the design properties and design the accelerated life test model. Methods : CVVL BLDC is consist of brushs, coil, magnetic, PCB, bearing and so on. Each component has a latent failure mechanism caused by temperature, humidity, vibration. By analysis result of the failure mechanism, thermal fatigue is the most important factor of a durability of CVVL BLDC motor. So, we designed a new accelerated life test model for guarantee of the CVVL BLDC motor. Results : A crack occurred on via hole in test using the conditions we designed, so we did change the design to avoid this failure. The via hole dimension is changed a little larger, as a result we achieve improvements in reliability of the CVVL BLDC motor. By applying various kinds and extreme level of stresses, we can find the operating limits of products. Conclusion : In thesis, We analyzed the failure mechanism of CVVL BLDC and designed an accelerated life test method to give a guarantee for reliability. Based on the test results, we could improve the reliability of developments by change of design.

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 2009년 추계학술발표대회
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• pp.77-77
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• 2009

ELV(; End of Life Vehicles)를 비롯한 최근 환경 동향은 자동차 전장 모듈에 대하여 다양한 무연 솔더 적용을 요구하고 있다. 특히 자동차 엔진룸과 트랜스미션은 가동 중 고온 및 진동의 지속적인 영향을 받기 때문에 이와 유사한 환경에서의 신뢰성 연구가 필요한 시점이다. 이에 본 연구에서는 Sn3.5Ag, Sn0.7Cu, Sn5.0Sb 솔더 조성에 대하여 복합환경 조건하에서 접합부 신뢰성을 평가하였다. 복합환경을 구현하기 위하여 $-40{\sim}150^{\circ}C$ 범위의 온도 사이클과 랜덤 진동을 동시에 인가하였으며, 진동 가속도 3G, 진동주파수는 10~1000Hz 로 설정하여 자동차 환경을 충족하였다. 복합시험의 1 cycle 은 20 시간이며, 총 120 시간의 시험 동안 진동의 영향 및 진동과 고온이 동시에 작용하였을 경우의 영향에 대해 비교하였다. 테스트 모듈 제작을 위해 450 um 의 솔더볼이 적용되었으며, 각 조성의 솔더볼을 이용하여 BGA test chip 제작하였고, 제작된 BGA test chip 은 다시 daisy chain PCB 위에 실장 및 리플로우 공정을 통해 접합되었다. 테스트 동안 In-situ 로 저항의 변화를 관찰하여 파단의 유무를 판단하였고 전자주사현미경을 통해 파괴 기전을 평가하였다. 복합시험 시간에 따른 전단강도를 측정하였으며, 각 조성에 대하여 상이한 전단강도 변화를 관찰하였다. 계면 IMC 형상은 전단강도 변화에 영향을 주었으며, 특히 높은 온도가 IMC 성장을 촉진시켜 전단강도 감소에 영향을 주었다. 본 복합환경 시험 조건에서는 Sn0.7Cu 가 가장 안정적이었으며, 파단면을 관찰한 결과 연성파괴 모드가 관찰되었다.

• 한국전기전자재료학회논문지
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• 제35권4호
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• pp.353-358
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• 2022

Bulky iron-core potential transformers (PT) are installed in a tank of gas insulated switchgears (GIS) for a system voltage measurement in power substations. In this paper, we studied an electronic voltage transformer (EVT) embedded in a spacer for miniaturization, eco-friendliness, and performance improvement of GIS. The prototype EVT consists of a capacitive probe (CP) that can be embedded in a spacer and a voltage Follower with a high input and a low output impedance. The CP was fabricated in the form of a Flexible-PCB to acquire the insulation performance and to withstand vibration and shock during operation. Voltage ratio of the prototype EVT is about 42,270, and the frequency bandwidth of -3 dB ranges from 0.33 Hz to 3.9 MHz. The voltage ratio error evaluated at about 6%, 12% and 18% of the rated voltage of 170 kV was 0.32%, and the phase error was 12.9 minutes. These results were within the accuracy for the class 0.5 specified in IEC 60044-7 and satisfy even in ranges from 80% to 120% of the rated voltage. If the prototype EVT replaces the conventional iron-core potential transformer, it is expected that the height of the GIS could be reduced by 11% and the amount of SF₆ will be reduced by at least 10%.

• 한국전기전자재료학회논문지
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• 제37권2호
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• pp.175-181
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• 2024

In electrical power substations, bulky iron-core potential transformers (PTs) are installed in a tank of gas-insulated switchgear (GIS) to measure system voltages. This paper proposed a low-power voltage transformer (LPVT) that can replace the conventional iron-core PTs in response to the demand for the digitalization of substations. The prototype LPVT consists of a capacitive voltage divider (CVD) which is embedded in a spacer and an impedance matching circuit using passive components. The CVD was fabricated with a flexible PCB to acquire enough insulation performance and withstand vibration and shock during operation. The performance of the LPVT was evaluated at 80%, 100%, and 120% of the rated voltage (38.1 kV) according to IEC 61869-11. An accuracy correction algorithm based on LabVIEW was applied to correct the voltage ratio and phase error. The corrected voltage ratio and phase error were +0.134% and +0.079 min., respectively, which satisfies the accuracy CL 0.2. In addition, the voltage ratio of LPVT was analyzed in ranges of -40~+40℃, and a temperature correction coefficient was applied to maintain the accuracy CL 0.2. By applying the LPVT proposed in this paper to the same rating GIS, it can be reduced the length per GIS bay by 11%, and the amount of SF6 by 5~7%.