• Transactions of the Korean Society of Mechanical Engineers B
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• v.40 no.10
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• pp.629-636
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• 2016

This study presents the development of an acid resistance velocity sensor that is used for measuring velocity inside a copper sulfate plating bath. First, researchers investigated the acid resistance coating to confirm the suitability of the anti-acid sensor in a very corrosive environment. Then, researchers applied signal processing methods to reduce noise and amplify the signal. Next, researchers applied a pressure-resistive sensor with an operation amplifier (Op Amp) and low-pass filter with high impedance to match the output voltage of a commercial flowmeter. Lastly, this study compared three low-pass filters (Bessel, Butterworth and Chebyshev) to select the appropriate signal process circuit. The results show 0.0128, 0.0023, and 5.06％ of the mean square error, respectively. The Butterworth filter yielded more precise results when compared to a commercial flowmeter. The acid resistive sensor is capable of measuring velocities ranging from 2 to 6 m/s with a 2.7％ margin of error.

• Journal of the Microelectronics and Packaging Society
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• v.24 no.1
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• pp.45-50
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• 2017

We investigated effect of Zn content on shear strengh of Sn-0.7Cu-xZn and OSP surface finished solder joints. Five pastes of Sn-0.7Cu-xZn (x=0, 0.5, 1.0, 1.5, 2.0 wt.%) solders were fabricated by mixing of solder powder and flux using planatary mixer. $180{\mu}m$ diameter solder balls were formed on OSP surface finished Cu electrodes by screen print method, and the reflow process was performed. The shear strength was evaluated with two high shear speeds; 0.01 and 0.1 m/s. The thickness of the intermetallic compound(IMC) layer was decreased with increasing Zn content in Sn-0.7Cu-xZn solder. The highest shear strength was 3.47 N at the Zn content of 0.5 wt.%. As a whole, the shear strength at condition of 0.1 m/s was higher than that of 0.01 m/s because of impact stress. Fracture energies were calculated by F-x (Force-displacement) curve during high speed shear test and the tendency of fracture energy and that of shear strength were good agreement each other. Fracture took place within solder matrix at lower Zn content, and fracture occured near the interface of OSP surface finished Cu electrode and solder at higher Zn content.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.44 no.2
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• pp.19-24
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• 2007

With recent advancement of high-speed, multi-gigabit data transmission capabilities, serial links have been more widely adopted in industry than parallel links. Since the parallel link design forces its transmitter to transmit both the data and the clock to the receiver at the same time, it leads to hardware's intricacy during high-speed data transmission, large power consumption, and high cost. Meanwhile, the serial links allows the transmitter to transmit data only with no synchronized clock information. For the purpose, clock and data recovery circuit becomes a very crucial key block. In this paper, a 5.4Gbps half-rate bang-bang CDR is designed for the applications of high-speed graphic DRAM interface. The CDR consists of a half-rate bang-bang phase detector, a current-mirror charge-pump, a 2nd-order loop filter, and a 4-stage differential ring-type VCO. The PD automatically retimes and demultiplexes the data, generating two 2.7Gb/s sequences. The proposed circuit is realized in 66㎚ CMOS process. With input pseudo-random bit sequences (PRBS) of $2^{13}-1$, the post-layout simulations show 10psRMS clock jitter and $40ps_{p-p}$ retimed data jitter characteristics, and also the power dissipation of 80mW from a single 1.8V supply.

• Korean Journal of Optics and Photonics
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• v.21 no.1
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• pp.21-25
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• 2010

In this paper, in order to enhance the image reconstruction performance of white light scanning interferometry(WLI), we demonstrate the scattered point noise filtering performance of post-processing methods. Median filtering is similar to using an averaging filter. Because the median value is less sensitive than the mean to extreme values, the median filter can remove the scattered point noise from a height-map without significantly reducing the sharpness of the image. In several specific cases, however, the median filter can't remove the scattered point noise. Therefore, we propose a comparative mean filter that uses order-statistic filtering and the mean of the neighborhood pixels. The performance is demonstrated by measuring an array of metal solder balls fabricated on PCB. The proposed method reduced the noise pixels by 4.4 percent.

• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• v.25 no.3
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• pp.117-123
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• 2019

The general Impulse Sealer has a problem of sealing quality because continuously sealing process results in an undesirable temperature rise, which may accumulate the heat during the operation. In order to address such a drawback, the controlled sealing temperature method can be effectively utilized compared with the general controlled time method. As such, a temperature sensor with capability of detecting the sealing temperature was installed, and a separate PCB was manufactured to control the sealing temperature by measuring and calculating the detected temperature. The temperature changes during the temperature rise and maximum temperature after continuously operation were investigated using an Impulse Sealer system. Next, the results obtained from experiment were compared with each other. As such, the maximum temperature was 70.3℃, whereas 8.9℃ was recorded as control temperature. It implies that this controlled temperature system prevented the undesirable temperature rise, thereby causing a consistent sealing quality.

• Journal of Korean Society on Water Environment
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• v.24 no.6
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• pp.758-766
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• 2008

To evaluate homologue patterns and removal efficiency before and after water treatment, the concentrations of dibenzo-p-dioxins (PCDDs), polychlorinated dibenzofurans (PCDFs) and coplanar polychlorinated biphenyls (Co-PCBs) were determined in 122 samples from 42 drinking water treatment plants throughout Japan over a two year period. The mean concentrations and toxic equivalent (TEQ) values of dioxins in raw and treated waters were 60.24 pg/L (0.14 pg-WHO-TEQ/L) and 4.15 pg/L (0.016 pg-WHO-TEQ/L), respectively. The dioxins contribution ratio of drinking water in relation to dioxins tolerable daily intake (TDI, 4 pg-TEQ/kg/day) was 0.016%. The mean TEQ removal rate of dioxins by drinking water treatment was over 88%. However, the mean removal rate of 2, 3, 7, 8-TeCDF (tetrachlorodibenzofuran) by water treatment in the 122 samples was minus 17%. Therefore, to identify which process affected the level of 2, 3, 7, 8-TeCDF, the removal efficiencies at both the advanced and conventional water treatment plants were investigated. For the TEQ removal rate across the processes, the dioxin congeners, TeCDF and non-ortho-PCBs remarkably indicated minus values after chlorination in both the advanced and conventional water treatments plant. From this study, the level of 2, 3, 7, 8-TeCDF was found to be increased as a result of chlorination.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.37 no.1
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• pp.8-18
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• 2000

We presented a BGA(Ball Grid Array) package for RF circuit modules and extracted its electrical parameters. As the frequency of RF system devices increases, the effect of its electrical parasitics in the wireless communication system requires new structure of RF circuit modules because of its needs to be considered of electrical performance for minimization and module mobility. RF circuit modules with BGA packages can provide some advantages such as minimization, shorter circuit routing, and noise improvement by reducing electrical noise affected to analog and digital mixed circuits, etc. We constructed a BGA package of ITS(Intelligent Transportation System) RF module and measured electrical parameters with a TDR(Time Domain Reflectometry) equipment and compared its electrical parasitic parameters with PCB RF circuits. With a BGA substrate of 3${\times}$3 input and output terminals, we have found that self capacitance of BGA solder ball is 68.6fF, and self inductance 146pH, whose values were reduced to 34% and 47% of the value of QFP package structure. S11 parameter measurement with a HP4396B Network Analyzer showed the resonance frequency of 1.55GHz and the loss of 0.26dB. Routing length of the substrate was reduced to 39.8mm. Thus, we may improve electrical performance when we use BGA package structures in the design of RF circuit modules.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.22 no.7
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• pp.683-693
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• 2011

In this paper, a design of high current and broad-band microwave bias-tee was presented for a stable bias of a high power amplifier. An input impedance of bias-tee should be shown to 50 ohm with the wideband in order to be stably-biased the amplifier. For this design of the bias-tee, a capacitor of bias-tee for a DC block was designed with a high wide-band admittance by a parallel sum of capacitors, and a inductor for a RF choke and a DC feeding was designed with a high wide-band impedance by a series sum of inductors. As this inductor and capacitor for the sum has each SRF, band-limitation of lumped element was driven from SRF. This limitation was overcome by control of a resonance's quality factor with adding a resistor. 1608 SMD chips for design's element was mounted on the this pattern for the designed bias-tee. The fabricated bias-tee presented 10 dB of return loss and wide-band about 50 ohm input impedance at 10 MHz~10 GHz.

• Journal of Navigation and Port Research
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• v.26 no.4
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• pp.419-426
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• 2002

The conventional RTK-GPS technique has many problems which are permission using RF wireless modem, influence of geographic obstacle using radio wave, frequency interference, finiteness of frequency resources. To solve these problems, in this paper, we designed the DGPS correction message transmission system as a method to substitute the RF wireless modem of RTK-DGPS receiver. Then the interface module was designed and implemented for linkage of GPS receiver and mobile phone. As a result worked differential surveying using receiving correction message using RS-232C and communication control, users of mobile station were worked differential surveying correction between mobile phones. Interface module system was received the same result of precision which was compared RF wireless modem system.

• Resources Recycling
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• v.11 no.2
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• pp.28-35
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• 2002

A study on the grinding characteristics of metal components in printed circuit boards (PCBs) scrap by a swing-hammer typeimpact mill was conducted. The PCBs scrap crushed to sizes less than 3 mm were pulverized to liberate metal components by the impact mill. The effect of rotation speed of hammer on the grinding characteristics was investigated. The particle size distribution and degree of liberation of metals such as copper and solder were measured. The effect of rotation speed and particle size on the shape sorting of metal Particles from milled PCBs was investigated using an inclined vibrating Plate. At the hammer speed of 61.3 m/s about 80% of the copper particles became larger than 297 $\mu$m while 90% of solder particles was smaller than 297 $\mu$m. In the shape sorting method, the recovery location becomes shorter as the rotation speed of hammer increases. The recovery location for particles larger than 297$\mu$m was shorter than for particles sized between 149$\mu$m and 297$\mu$m. As the recovery location becomes shorter, KI value increases towards unity while $\phi_{c}$ value decreases towards unity indicating the more roundness of metal particles.