• 한국전기전자재료학회논문지
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• 제21권4호
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• pp.296-299
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• 2008

The effects of radio frequency (RF) source power for decoupled plasma nitridation (DPN) process on the electrical properties and Fowler-Nordheim (FN) stress immunity of the oxynitride gate dielectrics for deep nano-technology devices has been investigated. With increase of RF source power, the threshold voltage (Vth) of a NMOS transistor(TR) decreased and that of a PMOS transistor increased, indicating that the increase of nitrogen incorporation in the oxynitride layer due to higher RF source power induced more positive fixed charges. The improved off-current characteristics and wafer uniformity of PMOS Vth were observed with higher RF source power. FN stress immunity, however, has been degenerated with increasing RF source power, which was attributed to the increased trap sites in the oxynitride layer. With the experimental results, we could optimize the DPN process minimizing the power consumption of a device and satisfying the gate oxide reliability.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2007년도 추계학술대회 논문집
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• pp.93-93
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• 2007

We present a mechanism for stress-induced interface degrdadations through ab initio pseudopotential calculations. We find that N interstitials at the interface create various defects levels in the Si band gap, which range from the mid gap to the conduction band of Si. The level positions are dependent on the configuration of oxygen toms around the N interstitial. On the other hand, the mid-gap level caused by Pb center is possibly removed by substitution of a N atom for a threefold-coordinated Si atom in the defect. Our calculations explain why interface state generations are enhanced in Si oxynitride, especially near conduction band edge of Si, although densities of Pb center are reduced.

• 대한전기학회:학술대회논문집
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• 대한전기학회 1993년도 하계학술대회 논문집 B
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• pp.1180-1182
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• 1993

In this paper, studing for the formative characterizations, bonding structures and hydrogen atom content in layer that oxynitride films deposited by Plasma CVD was investigated adaptive possibility for intemediate layer or final passivation layer of ULSI semiconductor devices.

• 한국세라믹학회지
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• 제25권4호
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• pp.380-384
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• 1988

This investigation includes nitridation phenomena of silicon powder compacts in air. Nitridation reaction condition has been provided with using silicon nitride bed and active carbon additive. Reaction products are Oxynitride, $\alpha$-Si3N4, and $\beta$-Si3N4, Oxynitride(Si2N2O) phase in formed at outer surface layer ofsilicon powder compacts. $\alpha$-Si3N4, and $\beta$-Si3N4 are formed at inner region of powder compacts. Microstructural observation indicates that nitridation mechanism in this work is the same as conventional nitridation mechanism nitrogen gas.

• E2M - 전기 전자와 첨단 소재
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• 제6권1호
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• pp.55-62
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• 1993

수소 관련된 species를 포함하지 않고 자기제한특성으로 초박막 성장을 용이하게 제어할 수 있는 N$_{2}$O 가스 분위기에서 실리콘의 산화는 질화된 산화막의 재산화공정 보다 훨씬 간단한 공정이다. N$_{2}$O산화로 형성된 Si-SiO$_{2}$ 계면에서 nitrogen-rich층은 산화막 구조를 강화할 뿐만 아니라 게이트 유전체의 질을 개선하고 산화율을 감소시키는 산화제의 확산 장벽으로 작용한다. 초박막 oxynitride 게이트 유전체가 종래의 열산화 방법으로 제작되었고 oxynitride막의 특성이 AES와 I-V 특성 측정의 결과를 분석하여 연구하였다.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2001년도 하계학술대회 논문집
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• pp.70-73
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• 2001

MFIS(Metal-ferroelectric-insulator- semiconductor) structures using silicon oxynitride(SiON) buffer layers were fabricatied and demonstrated nonvolatile memory operations. Oxynitride(SiON) films have been formed on p-Si(100) by RTP(rapid thermal process) in O$_2$+N$_2$ ambient at 1100$^{\circ}C$. The gate leakage current density of Al/SiON/Si(100) capacitor was about the order of 10$\^$-8/ A/cm$^2$ at the range of ${\pm}$ 2.5 MV/cm. The C-V characteristics of Al/LiNbO$_3$/SiON/Si(100) capacitor showed a hysteresis loop due to the ferroelectric nature of the LiNbO$_3$ thin films. Typical dielectric constant value of LiNbO$_3$ film of MFIS device was about 24. The memory window width was about 1.2V at the electric field of ${\pm}$300 kV/cm ranges.

• 한국결정성장학회지
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• 제9권3호
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• pp.320-326
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• 1999

금속 Al과 산화물{{{{{Al}_{2}{O}_{3}}}}}를 사용하여 Al의 직접질화법에 의한 ALON 합성실험을 행하여 Al의 첨가량의 변화에 따른 질화반응 거동과 ALON 반응소결체의 특성을 조사하였다. Al과{{{{{Al}_{2}{O}_{3}}}}}의 직접질화법에 의한 ALON 합성이 가능함을 확인하였다. 소결온도가 증가함에 따라 ALON의 생성량이 증가하였으며, Al 첨가량 10wt%까지는 $1750^{\circ}C$ 이상의 소결온도에서 ALON상만이 존재하였다. Al 첨가량 13wt% 이상의 조성에서는 약간의 AlN상이 ALON상과 공존하였다. 반응소결체의 밀도는 소결온도가 증가함에 따라 증가하였으나, AlN이 잔존하는 시편의 소결밀도는 $1750^{\circ}C$를 넘으면 약간 감소하였다. Al 첨가량이 증가할수록 입내파괴현상이 현저히 증가하였다.

• 한국세라믹학회지
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• 제43권10호
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• pp.646-652
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• 2006

Several oxynitride glasses were fabricated by means of adding $Si_3N_4$ powders as nitrogen source to Ca-Al-Si-O-N (CAS) and Mg-Al-Si-O-N (MAS) glass powders, and heat-treated in graphite crucible at 1600$^{\circ}C$ for 1 h. The physical and mechanical properties as well as impact resistance were generally increased and compared with each other. The impact resistance properties of those manufactured glasses were evaluated by DOP (depth of penetration) method which is a way to analyze armor materials. There were two means to be used herein; the copper jet impacted at hyper velocity by exploding K2l5 warhead and tungsten heavy alloy (WHA) impact bar at high velocity by firing in 30 mm solid propellent gun. The impact resistance properties against copper jet were increased and then decreased with increasing nitrogen content, while those against WHA bar were not changed apparently with nitrogen content.

• Applied Science and Convergence Technology
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• 제26권4호
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• pp.62-65
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• 2017

Passivation of surface defects by the formation of chemically inert structure at the surface of $TiO_2$ nanocrystals can be potentially useful in enhancing their photocatalytic activity. In this regard, we have studied the surface chemical states of $TiO_2$ surfaces prepared by a treatment in the afterglow of $N_2$ microwave plasma using X-ray photoemission spectroscopy (XPS). We find that nitrogen is incorporated into the surface after the treatment up to a few atomic percent. Interestingly, the surface oxynitride layer is found to be chemically stable when it's in contact with water at room temperature (RT). The surface nitrogen species were also found to be thermally stable upon annealing up to $150^{\circ}C$ in the atmospheric pressure. Thus, we conclude that the treatment of oxide materials such as $TiO_2$ in the afterglow of $N_2$ plasma can be effective way to passivate the surface with nitrogen species.

• 대한전자공학회:학술대회논문집
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• 대한전자공학회 2000년도 하계종합학술대회 논문집(2)
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• pp.20-23
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• 2000

We have investigated a process for the preparation of high-quality tantalum oxynitride ( $T_{a}$ $O_{x}$ $N_{y}$) via the N $H_3$ annealing of 7$_{a2}$ $O_{5}$, for use in gate dielectric applications. Compared with tantalum oxide (7$_{a2}$ $O_{5}$), a significant improvement in the dielectric constant was obtained by the N $H_3$ treatment. In addition, light reoxidation in a wet ambient at 45$0^{\circ}C$ resulted in a significantly reduced leakage current. We confirmed nitrogen incorporation in the tantalum oxynitride ( $T_{a}$ $O_{x}$ $N_{y}$ by Auger Electron Spectroscopy. By optimizing the nitridation and reoxidation process, we obtained an equivalent oxide thickness as thin as 1.6nm and a leakage current of less than 10mA/$\textrm{cm}^2$ at 1.5V..5V..5V..5V..5V..5V.