• 한국재료학회지
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• 제2권4호
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• pp.285-292
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• 1992

Si(100) 웨이퍼를 사용하여 RTP 장비에서 $O_2$와 $N_2$O 분위기에서 8nm의 oxynitride를 제조 하였다. 기존의 로(furnace) 열산화막과 비교해서 oxynitride는 I-V, TDDB 특성이 우수하였고, flat-band voltage shift도 적었으며 $BF_2이온$ 주입에 의한 붕소 투과 억제 특성도 우수하다. 유전상수는 oxynitride가 열산화막에 비해서 크다. Oxynitride는 순수한 Si$O_2$유사하게 V 〉${\varphi}_0$ 구간에서 Fowler-Nordheim 터널링 특성을 나타낸다. SIMS, AES, 그리고 XPS 분석 결과 질소 pile-up이 Si$O_2$/Si 계면에서 나타나고, 이것은 oxynitride 산화막 특성 향상과 깊은 관련이 있다.

• E2M - 전기 전자와 첨단 소재
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• 제7권1호
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• pp.25-31
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• 1994

Properties of oxynitride films reoxidized by $N_2{O}$ gas after thermal oxidation and $N_2{O}$ oxide films directly oxidized by using $N_2{O}$ gas on the bare silicon wafer have been studied. From the AES analysis, nitrogen pile-up at the interface of Si/oxynitride and Si/$N_2{O}$ oxide has observed. $N_2{O}$ oxide and oxynitride films have the self-limited characteristics. Therefore, it will be possible to obtain ultra-thin films. Nitrogen pile-up at the interfaces of Si/oxynitride and Si/$N_2{O}$ oxide strengthens film structure and improves dielectric reliability. Although fixed charge densities and interface trap densities of N20 oxide and oxynitride films have somewhat higher than those of thermal $SiO_2{O}$, $N_2{O}$ oxide and oxynitride films showed improved I-V characteristics and constant current stress.

• 한국세라믹학회지
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• 제32권11호
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• pp.1241-1245
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• 1995

Ultrathin oxynitride (SiOxNy) films, 8nm thick, were formed on Si(100) in furnace using O2 and N2O as reactant gas. Compared with conventional furnace grown oxide, oxynitride dielectrics show better characteristics of Qbd and I-V, and less flat-band voltage shift. Excellent diffusion barrier property to dopant (BF2) is also confirmed.

• 한국결정학회:학술대회논문집
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• 한국결정학회 2002년도 정기총회 및 추계학술연구발표회
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• pp.44-44
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• 2002

방사광 X-선 반사도를 이용하여 나노 스케일의 두께를 가진 oxynitride 박막의 계면 구조 및 두께를 측정하였다. Oxynitride 박막에서 nitrogen 분포의 분석은 두께가 극도로 얇아지는 요즘의 반도체 제작에서 매우 중요한 과제로 대두되고 있다. (1) X-선 반사도 측정을 분석하여 박막 깊이에 따른 전자밀도분포와 계면에서의 거칠기 및 각 층의 두께가 결정되었다. X-선 반사도 측정 분석으로부터 Nitrogen은 SiO₂와 Si substrate 계면에 위치하며, 화학조성분포와 층 구조의 상관성을 SIMS를 이용한 조성분포 측정과 비교하였다.

• 한국재료학회지
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• 제4권6호
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• pp.662-668
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• 1994

실리콘 질화막을 습식 산화하여 제작한 산화막/질화막 복합층과 이 박막의 산화막을 식각하여 제작한 oxynitride 박막의 물리적, 전기적 특성을 기술하였다. $900^{\circ}C$에서 산화시간이 증가함에 따라 산화막/질화막의 경우에는 축전용량은 급격히 감소하였으나 절연 파괴전장은 증가하였다. Oxynitrite박막은 축전용량과 절연파괴 전장이 모두 증가하였다. Oxynitride박막의 경우 축전 용량의 증가와 절연 파괴 전장이 증가하였는데 이는 유효 주께 감소와 박막의 양질화에 기인하였다. 또한, 산화 시강의 증가에 따라 Oxynitride박막의 TDDB특성과 초기 불량율도 향상되었다. 결론적으로 Oxynitride박막은 dynamic기억소자의 유전체 박막으로 사용하기에 적합하였다.

• 대한전기학회:학술대회논문집
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• 대한전기학회 1993년도 하계학술대회 논문집 B
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• pp.1295-1297
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• 1993

Properties of oxynitride films oxidized by $N_2O$ gas after thermal oxidation and $N_2O$ oxide films directly oxidized using $N_2O$ gas on the bare silicon wafer have been studied. Through the AES analysis, Nitrogen pile-up at the interface of Si/oxynitride and Si/$N_2O$ oxide has observed. Also, it could be presumed that there are differences in the mechanism of the growth of film by observing film growth. $N_2O$ oxide and oxynitride films have the self-limited characteristics. Therefore, it will be possible to obtain ultra-thin films. Nitrogen pile-up at the interfaces Si/oxynitride and Si/$N_2O$ oxide strengthens film structure and improves dielectric reliability. Although fixed charge densities and interface trap densities of $N_2O$ oxide and oxynitride films has somewhat higher than those of thermal $SiO_2,\;N_2O$ oxide and oxynitride films showed improved I-V characteristics and constant current stress.

• 한국세라믹학회지
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• 제32권1호
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• pp.31-36
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• 1995

(100) Si was oxidized in N2O ambient, and the film properties of oxynitride dielectrics were compared with pure SiO2. The growth rate, after pre-oxidation in O2/N2 ambient with raising temperature, is faster than that of O2/N2O treatment during the same condition. Nitrogen piles up at the interface of SiO2 and Si substrate and the content is about 2atom%. Comparing with pure SiO2, oxynitride dielectrics shows less dielectric breakdown failures and flat-band voltage shift, and good diffusion barrier property to dopant(BF2) is also observed.

• 한국재료학회지
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• 제26권1호
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• pp.42-46
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• 2016

The properties of zinc oxynitride semiconductors and their associated thin film transistors are studied. Reactively sputtered zinc oxynitride films exhibit n-type conduction, and nitrogen-rich compositions result in relatively high electron mobility. Nitrogen vacancies are anticipated to act as shallow electron donors, as their calculated formation energy is lowest among the possible types of point defects. The carrier density can be reduced by substituting zinc with metals such as gallium or aluminum, which form stronger bonds with nitrogen than zinc does. The electrical properties of gallium-doped zinc oxynitride thin films and their respective devices demonstrate the carrier suppression effect accordingly.

• 대한전기학회논문지
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• 제41권5호
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• pp.483-491
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• 1992

Plasma silicon oxynitride film has been applied as a final passivation layer for semiconductor devices, because it has high resistance to humidity and prevents from alkali ion's penetration, and has low film stress. Structure properties of plasma silicon oxynitride film have been studied experimentally by the use of FT-IR, AES, stress gauge and ellipsometry. In this experiment,Si-N bonds increase as NS12TO/(NS12TO+NHS13T) gas ratio increases. Peaks of Si-N bond, Si-H bond and N-H bond were shifted to high wavenumber according to NS12TO/(NS12TO+NHS13T) gas ratio increase. Absorption peaks of Si-H bond were decreased by furnace anneal at 90$0^{\circ}C$. The atomic composition of film represents that oxygen atoms increase as NS12TO/(NS12TO+NHS13T) gas ratio increases, to the contrary, nitrogen atoms decrease.

• 한국재료학회지
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• 제28권10호
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• pp.595-600
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• 2018

This study investigates the microstructural properties of CoCrFeMnNi high entropy alloy (HEA) oxynitride thin film. The HEA oxynitride thin film is grown by the magnetron sputtering method using nitrogen and oxygen gases. The grown CoCrFeMnNi HEA film shows a microstructure with nanocrystalline regions of 5~20 nm in the amorphous region, which is confirmed by high-resolution transmission electron microscopy (HR-TEM). From the TEM electron diffraction pattern analysis crystal structure is determined to be a face centered cubic (FCC) structure with a lattice constant of 0.491 nm, which is larger than that of CoCrFeMnNi HEA. The HEA oxynitride film shows a single phase in which constituting elements are distributed homogeneously as confirmed by element mapping using a Cs-corrected scanning TEM (STEM). Mechanical properties of the CoCrFeMnNi HEA oxynitride thin film are addressed by a nano indentation method, and a hardness of 8.13 GPa and a Young's modulus of 157.3 GPa are obtained. The observed high hardness value is thought to be the result of hardening due to the nanocrystalline microstructure.