• Journal of the Korea Convergence Society
• /
• v.11 no.10
• /
• pp.1-7
• /
• 2020

The manufacturing process of the resistive variable memory device, which is the based of neuromorphic device, maintained the continuity of vacuum process and applied plasma module suitable for the production of the ReRAM(resistive random access memory) and process technology for the neuromorphic computing, which ensures high integrated and high reliability. The ReRAM device of the oxide thin-film applied to the plasma module was fabricated, and research to improve the properties of the device was conducted through various experiments through changes in materials and process methods. ReRAM device based on TiO₂/TiOx of oxide thin-film using plasma module was completed. Crystallinity measured by XRD rutile, HRS:LRS current value is 2.99 × 10³ ratio or higher, driving voltage was measured using a semiconductor parameter, and it was confirmed that it can be driven at low voltage of 0.3 V or less. It was possible to fabricate a neuromorphic ReRAM device using oxygen gas in a previously developed plasma module, and TiOx thin-films were deposited to confirm performance.

• Journal of the Microelectronics and Packaging Society
• /
• v.19 no.4
• /
• pp.79-83
• /
• 2012

LTCC (Low temperature co-fired ceramic) package have been paid much attention due its good reliability, miniaturization, and application of silver paste with complex wiring and printing. Therefore, LTCC package has been expected to replace vulnerable plastic package in the field of high power LED device. Currently, LTCC ceramic package is mainly made up of aluminum oxide powder. In this study, zinc oxide powder is added or replaced for the fabrication of LTCC ceramic body. By adding small amount of ZnO, thermal conductivity of the LTCC ceramic body could be remarkably increased by 25% leading to the extension of LED life time. The LTCC package structure with composition including ZnO has an increased thermal flux by 56% as a result of ANSYS simulation. Actually, the fabricated LED package with the addition of ZnO exhibits a decreased thermal resistivity by 14.9%.

• Journal of the Korea Institute of Information and Communication Engineering
• /
• v.13 no.2
• /
• pp.348-354
• /
• 2009

It has analyzed that the device degradation by NBTI (Negative Bias Temperature Instability) stress induced the increase of gate-induced-drain-leakage(GIDL) current for p-MOSFETs. It is shown that the degradation magnitude, as well as its time, temperature, and field dependence, is govern by interface traps density at the silicon/oxide interface. from the relation between the variation of threshold voltage and subthreshold slope, it has been found that the dominant mechanism for device degradation is the interface state generation. From the GIDL measurement results, we confined that the EHP generation in interface state due to NBTI stress led to the increase of GIDL current. Therefore, one should take care of the increased GIDL current after NBTI stress in the ultra-thin gate oxide device. Also, the simultaneous consideration of reliability characteristics and dc device performance is highly necessary in the stress engineering of nanoscale CMOSFETs.

• Journal of the Institute of Electronics Engineers of Korea SD
• /
• v.39 no.5
• /
• pp.1-7
• /
• 2002

Deep sub-micron bulk CMOS circuits require gate electrode materials such as metal silicide and titanium silicide for gate oxides. Many authors have conducted research to improve the quality of the sub-micron gate oxide. However, few have reported on the electrical quality and reliability of an ultra-thin gate. In this paper, we will recommend a novel shallow trench isolation structure and a two-step TiS $i_2$ formation process to improve the corner metal oxide semiconductor field-effect transistor (MOSFET) for sub-0.1${\mu}{\textrm}{m}$ VLSI devices. Differently from using normal LOCOS technology, deep sub-micron CMOS devices using the novel shallow trench isolation (STI) technology have unique "inverse narrow-channel effects" when the channel width of the device is scaled down. The titanium silicide process has problems because fluorine contamination caused by the gate sidewall etching inhibits the silicide reaction and accelerates agglomeration. To resolve these Problems, we developed a novel two-step deposited silicide process. The key point of this process is the deposition and subsequent removal of titanium before the titanium silicide process. It was found by using focused ion beam transmission electron microscopy that the STI structure improved the narrow channel effect and reduced the junction leakage current and threshold voltage at the edge of the channel. In terms of transistor characteristics, we also obtained a low gate voltage variation and a low trap density, saturation current, some more to be large transconductance at the channel for sub-0.1${\mu}{\textrm}{m}$ VLSI devices.

• Transactions of the Korean Society of Mechanical Engineers
• /
• v.7 no.3
• /
• pp.263-269
• /
• 1983

Underwater welding by a gravity arc welding process was investigated by using six types of coated electrodes and SM41A steel plates of 10 mm thickness as base metal and it was ascertained that this process may be put to practical use. Main results obtained are summarized as follows: 1. Angle of electrode affects no influence on bead appearance and the proper range of welding current and diameter of electrode for the high titanium oxide type is relatively wider than that for the ilmenite type. And the lime titania type, high titanium oxide type and ilmenite type of domestic coated arc welding electrodes of .phi.4 mm could attain the soundest underwater welded joints which contain no welding imperfection. 2. According to macro-structure, micro-structure and hardness distribution inspectionson underwater welded joint, the area between the HAZ and the surface of the weld in neighbourhood of the bond has the maximum hardness value. The structure of these parts is martensite and bainite. Other parts contain mocro-ferrite, micro-pearlite structure, which contain soundness of welded joint free from weld imperfection. 3. On consideration of both tensile strength of more than 100% joint efficiency and sufficient impact value, the welding condition which can get optimal welding strength is heat input of 1,400-1,500 J/mm, current of 200-215 ampere (voltage of 32-33 volts) in the case of lime titania type electrode. 4. Underwater welding strength (tensile strength, impact strength) depends on heat input (or current) quantitatively and they have the relationship of parabolic function. Each experimental equation has a high reliability and its percent of mean error is 4.14%. 5. It is suggested that the optimal design of weld strength by welding condition (current, heat input) could be utilized for a quality control of underwater welding.

• Asian-Australasian Journal of Animal Sciences
• /
• v.15 no.11
• /
• pp.1634-1638
• /
• 2002

Quantification of endogenous amino acid loss at the terminal ileum is an essential means for calculation of the true amino acid digestibility of a feedstuff. Since nitrogen appeared in the determined diet or not could shift the results very much, also, none of digestibility markers could be recovered with 100% rate at the terminal ileum, the objectives of the present study were: (1) to determine endogenous amino acid losses when fed either a casein diet or a protein-free diet and (2) to examine the reliability of chromic oxide or acid insoluble ash in the protein-free diet. Six ileal-cannulated pigs ($65{\pm}1.85 kg$ BW) with a simple T-cannula in the terminal ileum were used in a replicated $3{\times}3$ Latin square designed trial, after allowed a 14 d recuperation period. Each test period ran for 12 days comprised of a 10 d adjustment period and a 2 d collection period. The endogenous AA losses of His, Ile, Lys, Cys, Thr, Val, Trp, Asp, Glu, and Ser from pigs fed the casein diet were significantly higher than those of the protein-free diet (p<0.05). No significant difference was found in the amount of endogenous amino acid loss when determined with the different markers in the protein-free diet (p>0.05). These data suggest that endogenous amino acid loss could be underestimated when a protein-free diet is used. A direct effect of dietary peptides on the endogenous amino acid loss was found when the casein diet was fed. Our results also indicate that acid insoluble ash can be used as an inert marker as an alternative to chromic oxide when measuring endogenous amino acid loss.

• Tribology and Lubricants
• /
• v.30 no.5
• /
• pp.295-302
• /
• 2014

The tribological behavior of an Fe-based bulk amorphous alloy while sliding against a AISI 304 disc is investigated using a unidirectional pin-on-disc type tribometer in dry and distilled water environments. The rod-shaped bulk pins are fabricated by suction casting. The crystallinities of the bulk amorphous alloys before and after the friction tests are determined by X-ray diffraction. The friction coefficient and specific wear rate of the amorphous pin in the water environment are found to be twice and thrice as much as in the dry environment at a low applied pressure, respectively. However, at a higher pressure, the friction coefficient and specific wear rate are 0.4 and 1.02 mg/(Nm/s), respectively, in the water environment. A microstructure analysis shows that the worn surface of the alloy is characterized by delamination from the smooth friction surface, and thus delamination is the main wear mechanism during the friction test in dry sliding environment. In contrast, brittle fracture morphologies are apparent on the friction surface formed in distilled water environment. For the sample tested at a lower sliding speed, the XPS data from the oxide layer are similar to those of the pure element with weak suboxide peaks. For higher sliding speeds, all the main sharp peaks representing the core level binding energies are shifted to the oxide region.

• Transactions on Electrical and Electronic Materials
• /
• v.9 no.1
• /
• pp.6-11
• /
• 2008

In this study, we investigated effects of hydrogen annealing (HA) and plasma nitridation (PN) applied in order to improve $Si/SiO_2$ interface characteristics of TiN metal gate. In result, HA and PN showed a positive effect decreasing number of interface state $(N_{it})$ respectively. After FN stress for verifying reliability, however, we identified rapid increase of $N_{it}$ for TiN gate with HA, which is attributed to hydrogen related to a change of $Si/SiO_2$ interface characteristic. In contrast to HA, PN showed an improved Nit and gate oxide leakage characteristic due to several possible effects, such as blocking of Chlorine (Cl) diffusion and prevention of thermal reaction between TiN and $SiO_2$.

• Journal of Powder Materials
• /
• v.17 no.2
• /
• pp.148-153
• /
• 2010

Thermal barrier systems have been widely investigated over the past decades, in order to enhance reliability and efficiency of gas turbines at higher temperatures. Yttria-stabilized zirconia (YSZ) is one of the most leading materials as the thermal barriers due to its low thermal conductivity, thermodynamic stability, and thermal compatibility with metal substrates. In this work, rare-earth oxides with pyrochlore phases for thermal barrier systems were investigated. Pyrochlore phases were successfully formed via solid-state reactions started from rare-earth oxide powders. For the heat-treated samples, thermo-physical properties were examined. These rare-oxide oxides showed thermal expansion of $9{\sim}12{\times}10^{-6}/K$ and thermal conductivity of 1.2~2.4 W/mK, which is comparable with the thermal properties of YSZ.

• Journal of the Microelectronics and Packaging Society
• /
• v.27 no.2
• /
• pp.19-26
• /
• 2020

Flexible displays have been evolved into curved, foldable, and rollable as the degree of bending increases. Due to the presence of brittle electrodes (e.g. indium-tin oxide (ITO)) that easily cracked and delaminated under severe bending deformation, lowering mechanical stress of the electrodes has been critical issue. Because of this, mechanical stress of brittle electrode in flexible displays has been analyzed mostly in terms of bending radius. On the other hand, in order to make rollable display, various mechanical components such as roller and spring are needed to roll-up or extend the screen for the rollable display apparatus. By these mechanical components, brittle electrode in the rollable display is subjected to the excessive tensile stress due to the retracting force as well as the bending stress by the roller. In this study, mechanical deformation of rollable OLED display was modeled considering boundary conditions of the apparatus. An analytical modeling based on the classical beam theory was introduced in order to investigate the mechanical behavior of the rollable display. In addition, finite element analysis (FEA) was used to analyze the effect of mechanical components in the apparatus on the brittle electrode. Furthermore, a strategy for improving the mechanical reliability of the rollable display was suggested through controlling the stiffness of adhesives in the display panel.