• Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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• v.26 no.8
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• pp.96-101
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• 2012

A surge protection device of the metal oxide varistor(MOV) has been commonly used for preventing electrical damage in many electronic equipments. The MOV has a property that leakage current is increased and might be permanently damaged when it is exposed continuously to the electrical stresses such as lightening surges. In this paper, we propose a novel surge protection circuit adopting a silicon controlled rectifier(SCR) in the traditional protection circuits using the MOV device simultaneously. When lightning surges are injected to the proposed circuit, the MOV lets the surge pulses bypassing through the ground at first up to the level that SCR begins to operate. Above the threshold level of turning on the SCR, the SCR operates bypasses large surge currents to the ground. Proposed circuit was verified with a leakage current experiment and PSpice circuit simulations under the repeated surge injection environment.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2002.07a
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• pp.26-31
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• 2002

To realize a high integrated Flash memory utilizing SONOS memory devices, the NOR type 1TC(one Transistor Cell) SONOS Flash arrays are fabricated and characterized. This SONOS Flash arrays with common source lines are designed and fabricated by conventional 0.35$\mu\textrm{m}$ CMOS process. The thickness of ONO for memory cell is tunnel oxide of 34${\AA}$, nitride of 73${\AA}$ and blocking oxide of 34${\AA}$. To investigate operating characteristics, CHEI(Channel Hot Electron Injection) method and Bit line erase method are selected as the write operation and the erase method, respectively. The disturbance characteristics according to the write/erase/read cycling are also examined. The degradation characteristics are investigated and then the reliability of SONOS flash memory is guaranteed.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.11a
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• pp.199-202
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• 2004

NFGM(Nano-Floating Gate Memory) is a very prospective candidate memory for the next generation with MRAM, PRAM, PoRAM. Among these memory devices for the next generation, NFGM has a lot of merits such as a simple low cost fabrication process, improved retention time, lower operating voltages, high speed program/erase time and so on. Therefore, many intensive researches for NFGM have been performed to improve device performance and reliability, which depends on the ability to control particle size, size distribution, crystallity, areal particle density and tunneling oxide quality. In this paper, we investigate the researches for NFGM up to recently.

• Journal of the Microelectronics and Packaging Society
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• v.17 no.3
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• pp.59-63
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• 2010

Immersion Sn plating was produced on Cu foil by distributing nano-sized diamonds (ND). The ND distributed on the coating surface broke the continuity of Sn-oxide layer, therefore leading to penetrate the molten solder through the oxide and retarding the wettability degradation during a reflow process. Furthermore, the ND in the Sn coating played a role of diffusion barrier for Sn atoms and decreased the growth rate of intermetallic compound ($Cu_6Sn_5$) layer during the solid-state aging. The study confirmed the importance of ND to improve the wettability and reliability of the Sn plating. Complete dispersion of the ND within the immersion Sn plating needs to be further developed for the electronic packaging applications.

• Journal of Environmental Health Sciences
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• v.8 no.1
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• pp.81-97
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• 1982

Ethylene oxide gas has been used as a cold sterilant for heat-sensitive medical equipments and as a fumigant for food for more than 30 years, and it is used more widely than radiation although radiation sterilization has made significant inroads in recent years. But according to recent studies of toxicities such as mutagenicity, haemolytic effect and possible carcinogenicity of Ethylene oxide (ETO) and its two main reaction products, Ethylene chlorohydrin (ETCH) and Ethylene glycol (ETG), Environmental Protection Agency in U.S.A. has suggested some regulations on residual gas in drug products and medical devices for human use. The mutagenic activity of ETO compared with that of X-ray has an equivalency of 1 ppm/hr for ETO as compared to 20 mrad for X-ray, and one could suggest the present maximum allowable concentration for ETO (50 ppm) should be 400 times lower than the radiation standard (2.5 mrad/hr). Although radiation sterilization has advantages of simplicity of operation and complete reliability, changes of physico-chemical properties with possible formation of toxic substances may occur. It is therefore necessary to make some regulations of our own for residual toxicities orginated from each sterilization method.

• Journal of Information Display
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• v.5 no.4
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• pp.23-26
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• 2004

A limitation of oxide cathode is the high current density, caused by low electrical conductivity of an emitter layer. This limitation can be overcome by increasing the conductivity, and uniform dispersion of Ni powder and pore agent could be achieved by using the screen-printing method. This new cathode has shown not only high current density reliability but also improved performance characteristics and as such given the name "Multi-Function cathode". It is expected to be a good replacement of the impregnated cathode.

• The Transactions of the Korean Institute of Electrical Engineers C
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• v.53 no.4
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• pp.208-212
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• 2004

In this paper, the characteristics of co-sputtered Ru-Zr metal alloy as gate electrode of MOS capacitors have been investigated. The atomic compositions of alloy were varied by using the combinations of relative sputtering power of Ru and .Zr. C-V and I-Vcharacteristics of MOS capacitors were measured to find the effective oxide thickness and work function. The alloy made of about 50% of Ru and 50% of Zr exhibited an adequate work function for nMOS. C-V and I-V measurements after 600 and $700^{\circ}C$ rapid thermal annealing were performed to prove the thermal and chemical stability of the Ru-Zr alloy film. Negligible changes in the accumulated capacitance and work function before and after annealing were observed. Sheet resistance of Ru-Zr alloy was lower than that of poly-silicon. It can be concluded that the Ru-Zr alloy can be a possible substitute for the poly-silicon used as a gate of nMOS.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.16 no.5
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• pp.372-377
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• 2003

To realize a high integrated flash memory utilizing SONOS memory devices, the NOR type ITC(one Transistor Cell) SONOS flash arrays are fabricated and characterized. This SONOS flash arrays with the common source lines are designed and fabricated by conventional 0.35$\mu\textrm{m}$ CMOS process. The thickness of ONO for memory cells is tunnel oxide of 34${\AA}$, nitride of 73${\AA}$ and blocking oxide of 34${\AA}$ . To investigate operating characteristics, CHEI(Channel Hot Electron Injection) method and bit line method are selected as the program and 4he erase operation, respectively. The disturbance characteristics ,according to the program/erase/read cycling are also examined. The degradation characteristics are investigated and then the reliability of SONOS flash memory is guaranteed.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.16 no.7
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• pp.569-572
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• 2003

In this study, we evaluated the dilute HF cleaning to reduce residual defects made by metal CMP process. The purpose of this test is to observe the existence of barrier metal damage during DHF cleaning on condition that it should not affect metal thin film reliability, so we will get rid of slurry residual particles as a main defect of the metal CMP process for the better yield. In-line defect data showed us that slurry residual particles were removed by DHF application. The HF rinse significantly reduced metal contamination levels and surface roughness. The best effect by additional oxide loss was discovered when Dilute HF condition is 10".

• Nuclear Engineering and Technology
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• v.51 no.5
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• pp.1381-1389
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• 2019

Stress corrosion cracking (SCC) widely found in both primary and secondary sides of steam generator (SG) tubing in pressurized water reactors (PWR) has become an important safety issue. Using eddy-current tests (ECTs), non-destructive evaluations are performed for the integrity management of SG tubes against intergranular SCC. To enhance the reliability of ECT, this study investigates the effects of oxide films on ECT's detection capabilities for SCC in laboratory-degraded SG tubing in high temperature and high pressure aqueous environment.