• Proceedings of the KIEE Conference
• /
• 1992.07b
• /
• pp.832-834
• /
• 1992

Using the PECVD method, the silicon nitride films were deposited by changing the $SiH_4/NH_3$ gas flow ratio from 0.2 to 1.4 at an interval of 0.2, AES, FTIR, and Spectroscopic Ellipsomter were used to analyze the film composition and structure, the refractive index, and the deposition rate. Also the C-V analysis was used to estimate the memory performance in the capacitor type MNOS memory devices, which utilized native oxide as the tunneling barrier, with the silicon nitride by the above deposition conditions. As a result, it was confirmed that the performance of MNOS memory devices with PECVD silicon nitride was comparable to that with LPCVD or APCVD silion nitride.

• Transactions of the Korean Society of Mechanical Engineers B
• /
• v.35 no.5
• /
• pp.533-538
• /
• 2011

A plastic-compatible low-temperature metal deposition and patterning process is essential for the fabrication of flexible electronics because they are usually built on a heat-sensitive flexible substrate, for example plastic, fabric, paper, or metal foil. There is considerable interest in solution-processible metal nanoparticle ink deposition and patterning by selective laser sintering. It provides flexible electronics fabrication without the use of conventional photolithography or vacuum deposition techniques. We summarize our recent progress on the selective laser sintering of metals and metal oxide nanoparticles on a polymer substrate to realize flexible electronics such as flexible displays and flexible solar cells. Future research directions are also discussed.

• Proceedings of the Korean Vacuum Society Conference
• /
• 2013.02a
• /
• pp.497-497
• /
• 2013

Semiconducting amorphous InGaZnO (a-IGZO) has attracted significant research attention as improved deposition techniques have made it possible to make high-quality a-IGZO thin films. IGZO thin films have several advantages over thin film transistors (TFTs) based on other semiconducting channel layers.The electron mobility in IGZO devices is relatively high, exceeding amorphous Si (a-Si) by a factor of 10 and most organic devices by a factor of $10^2$. Moreover, in contrast to other amorphous semiconductors, highly conducting degenerate states can be obtained with IGZO through doping, yet such a state cannot be produced with a-Si. IGZO thin films are capable of mobilities greaterthan 10 $cm^2$/Vs (higher than a-Si:H), and are transparent at visible wavelengths. For oxide semiconductors, carrier concentrations can be controlled through oxygen vacancy concentration. Hence, adjusting the oxygen partial pressure during deposition and post-deposition processing provides an effective method of controlling oxygen concentration. In this study, we deposited IGZO thinfilms at optimized conditions and then analyzed the film's electrical properties, surface morphology, and crystal structure. Then, we explored how to generate IGZO thin films using DC magnetron sputtering. We also describe the construction and characteristics of a bottom-gate-type TFT, including the output and transfer curves and bias stress instability mechanism.

• Korean Journal of Materials Research
• /
• v.13 no.5
• /
• pp.309-312
• /
• 2003

Tin dioxide($_SnO2$) thin films were deposited on alumina substrate by metal-organic chemical vapor deposition (MOCVD) as a function of temperature and time. Thin films were fabricated from di-n-butyltin diacetate as a precursor and oxygen as an oxidation. The microstructure of deposited films was characterized by X-ray diffraction and field emission scanning electron microscopy(FE-SEM). The thickness was linearly increased with deposition time and $SnO_2$structure was found from $375^{\circ}C$ for the deposition time of 32 min. The maximum sensitivity to 500ppm CO gas was observed for the specimens deposited at $375^{\circ}C$ for 2 min at the operating temperature of $350^{\circ}C$. Gas sensitivity to CO increased with decreasing the film thickness. The sensing properties of response time, recovery and sensitivity of CO were changed with variations of substrate temperature and time.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2008.11a
• /
• pp.149-149
• /
• 2008

Metal-Insulator-Metal(MIM) capacitors have been studied extensively for next generation of high-density dynamic random access memory (DRAM) devices. Of several candidates for metal electrodes, Ru or its conducting oxide $RuO_2$ is the most promising material due to process maturity, feasibility, and reliability. ALD can be used to form the Ru and RuO2 electrode because of its inherent ability to achieve high level of conformality and step coverage. Moreover, it enables precise control of film thickness at atomic dimensions as a result of self-limited surface reactions. Recently, ALD processes for Ru and $RuO_2$, including plasma-enhanced ALD, have been studied for various semiconductor applications, such as gate metal electrodes, Cu interconnections, and capacitor electrodes. We investigated Ru/$RuO_2$ thin films by thermal ALD with various deposition parameters such as deposition temperature, oxygen flow rate, and source pulse time. Ru and $RuO_2$ thin films were grown by ALD(Lucida D150, NCD Co.) using RuDi as precursor and O2 gas as a reactant at $200\sim350^{\circ}C$.

• JSTS:Journal of Semiconductor Technology and Science
• /
• v.5 no.2
• /
• pp.120-126
• /
• 2005

We have proposed a characteristic method to estimate real composition when multi component oxide films are deposited by ALD. Final atomic concentration ratio was theoretically calculated from the film densities and growth rates for $HfO_2$ and $Al_2O_3$ using ALD processed HfxAhOz mms.W e have transformed initial source feeding ratio during deposition to fins] atomic ratio in $Hf_xAl_yO_z$ films through thickness factors ($R_{HFO_2}$ ami $R_{Al_2O_3}$) ami concentration factor(C) defined in our experiments. Initial source feeding ratio could be transformed into the thickness ratio by each thickness factor. Final atomic ratio was calculated from thickness ratio by concentration factor. It has been successfully confirmed that the predicted atomic ratio was in good agreement with the actual measured value by ICP-MS analysis.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.29 no.7
• /
• pp.440-444
• /
• 2016

Titanium oxide ($TiO_2$) thin films were synthesized on polymer insulator and Si substrates by atomic layer deposition (ALD) method. The surface and electrical properties of $TiO_2$ films synthesized at various ALD cycle numbers were investigated. The synthesized $TiO_2$ films exhibited higher contact angle and smooth surface. The contact angle of $TiO_2$ films was increased with the increase of ALD-cycle number. Also, the rms surface roughness of films was slightly rough with the increase of ALD-cycle number. The leakage current on $TiO_2$ film surface synthesized at various conditions were uniformed, and the values were decreased with the increase of ALD-cycle number. In the results, the performance of $TiO_2$ films for self-cleaning critically depended on a number of ALD-cycle.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.30 no.1
• /
• pp.32-36
• /
• 2017

The Ag thin film of YBCO (yttrium barium copper oxide) CC (coated conductor) protect the YBCO layer and, at the same time, affects the electrical characteristics of the YBCO CC. Therefore, YBCO CC with the commercialization of the Ag thin film layers makes it easy to establish a process, it can lead to a variety of characteristic changes in YBCO CC. In this paper, plasma surface treatment was carried out to facilitate the deposition of the Ag thin film and the deposition process of YBCO CC. Surface roughness from the test results was increased as the time of the plasma surface treatment increased from 5 to 20 minutes. On the other hand, the surface roughness was decreased for the time of the plasma surface treatment over 20 minutes. Furthermore, after depositing, the increasing of deposit amount and reduced lifting phenomenon showed a similar tendency with the rise time of surface roughness.

• Proceedings of the KIEE Conference
• /
• 2002.07c
• /
• pp.1482-1484
• /
• 2002

Transparent conductive oxides (TCO) are necessary as front electrode for most thin film solar cell. In our paper, transparent conducting aluminum-doped Zinc oxide films (ZnO:Al) were prepared by rf magnetron sputtering on glass (Corning 1737) substrate as a variation of the deposition condition. After deposition, the smooth ZnO:Al films were etched in diluted HCI (0.5%) to examine the electrical and surface morphology properties as a variation of the time. The most important deposition condition of surface-textured ZnO films by chemical etching is the processing pressure and the substrate temperature. In low pressures (0.9mTorr) and high substrate temperatures $({\leq}300^{\circ}C)$, the surface morphology of films exhibits a more dense and compact film structure with effective light-trapping to apply the silicon thin film solar cells.

• Proceedings of the Korean Society for Technology of Plasticity Conference
• /
• 2005.10a
• /
• pp.83-86
• /
• 2005

In this study, SAM (self-assembled monolayer) was applied as an anti-adhesion layer in the nano molding process, to reduce the surface energy between the nano-stamper and the moldeded polymeric nano patterns. Before depositing SAM on the stamper, the nickel stamper was pretreated to remove oxide on the nickel stamper surface. Then, using the solution deposition method, alkanethiol SAM as an anti-adhesion layer was deposited on nickel surface. To examine the effectiveness of the SAM deposition on the metallic nano stamper, the contact angle and the lateral friction force were measured at the actual processing temperature and pressure for the case of nano compression molding and at the actual UV dose for the case of nano UV molding. The surface energy due to SAM deposition on the nickel nano stamper markedly decreased and the high hydrophobic quality of SAM on the nickel stamper maintained under the actual molding environments.