• 마이크로전자및패키징학회지
• /
• 제22권1호
• /
• pp.1-5
• /
• 2015

Recently, data throughput of smart electric devices increases dramatically. There is a great interest in a new technology which exceeds the limit of electrical transmission method. Optical PCB can supplement the weakness of electrical signal processing, the research for optical PCB is very active. In this paper, we propose the thermal imprint lithography process to fabrication optical layer of optical PCB and experiment to optimize the process conditions. We confirm process time, pressure, process temperature, demolding temperature and fabricate optical interconnection structure which has $45^{\circ}$ tilted mirror surface for confirm the interconnection efficiency.

• 마이크로전자및패키징학회지
• /
• 제18권1호
• /
• pp.7-13
• /
• 2011

According to increasing of data transfer rate, printed circuit board (PCB) is required improvement of transmission speed. Optical PCB and its packaging technology can be one of the solutions that overcome the limitations of conventional electrical PCB. The data transmission capacity will be increased 10 Tbps at 2015. To this end, studies on various OPCB technologies are being conducted. For cost-effective and high- performance OPCB, studies of optical coupling by polymer replication process are conducted. In this work, optical waveguide and optical fiber array block were sequentially fabricated by polymer pattern replication method. Using this method we successfully demonstrate low loss optical fiber coupling between optical waveguide and optical fiber arrays. And researches on flip chip bonding process and using electro-optic connectors for packaging are conducted.

• 마이크로전자및패키징학회지
• /
• 제19권2호
• /
• pp.47-53
• /
• 2012

최근 정보전송량이 증대됨에 따라 PCB는 고속 정보전송 및 박형화가 요구되고 있다. 하지만 기존의 전기적 PCB는 EMI, 실장밀도 등의 문제로 고속전송에 한계가 있어 기존의 전기 회로층에 광 회로층을 접목한 광 PCB가 그 해결책으로 대두되고 있다. 광 PCB 구현에서 가장 중요한 요소는 광 접속기술로 고효율, 수동정렬에 관한 연구가 활발히 이루어지고 있다. 따라서 본 논문에서는 광도파로에 렌즈를 일체형으로 제작하고 이를 보호하는 구조물을 정렬키로 사용한 장착형 광도파로 구조를 제안하였고, 광 및 구조 시뮬레이션을 통해 제안한 구조의 접속효율 및 구조적 안정성을 해석하였다. 광 시뮬레이션 결과 제안된 구조는 렌즈가 없는 구조와 비교해 송신부에서 약 1.86배, 수신부에서 약 1.42배의 높은 접속효율을 가지며, 구조 해석에서는 탈착과정에서 내부의 렌즈에 응력 및 변형이 발생하지 않음을 확인하였다. 따라서 본 논문에서 제안된 구조가 높은 접속효율을 가지고, 구조적 안정성을 가짐을 보였다.

• 한국광학회:학술대회논문집
• /
• 한국광학회 2006년도 하계학술발표회 논문집
• /
• pp.469-471
• /
• 2006

This paper describes a efficient insepction method of PCB PADs for AFVI. The methods for PCB inspection have been tried to detect the defects in PCB PADs, but their low detection rate results from pattern variations that are originating from etching, printing and handling processes. The adaptive inspection method has been newly proposed to extract minute defects based on dynamic segments and filters. The vertexes are extracted from CAM master images of PCB and then a lot of segments are constructed in master data. The proposed method moves these segments to optimal directions of a PAD contour and so adaptively matches segments to PAD contours of inspected images, irrespectively of various pattern variations. It makes a fast, accurate and reliable inspection of PCB patterns. Experimental results show that proposed methods are found to be effective for flexible defects detection.

• 마이크로전자및패키징학회지
• /
• 제21권1호
• /
• pp.25-29
• /
• 2014

본 연구에서는 기존의 PCB의 한계를 극복할 수 있는 광 PCB에 대한 연구를 수행하였으며, 고효율 수동정렬을 위한 플러거블 렌즈구조를 제안하였다. 제안된 구조는 광 도파로 수동 정렬시 발생할 수 있는 렌즈와 도파로 간의 정렬 오차를 개선하고자 도파로와 렌즈를 합한 형태이다. 또한 탈착에 의해 손상되는 렌즈표면을 보호하기 위한 보호벽 형태를 지님으로써, 고효율의 수동정렬이 가능하게 하였다. 최적화 시뮬레이션을 통하여 구조를 설계하였고, 반복적 포토 리소그래피와 열적 리플로우 공정을 통하여 플러거블 렌즈 구조 제작을 위한 공정 연구를 수행하였다. 렌즈일체형 플러거블 접속구조의 광도파로를 PDMS복제공정으로 제작된 mold를 이용하여 임프린트 공정을 통해 제작하였다. 따라서 본 논문에서는 수동정렬이 가능한 광PCB접속용 플러거블 렌즈 구조의 제작이 가능함을 확인하였다.

• 한국전기전자재료학회논문지
• /
• 제23권1호
• /
• pp.29-33
• /
• 2010

As the demands for the higher data transmission speed and capacity as well as integration density grow throughout the network, much works have being done in order to integrate the Electrical PCB with Optical PCB. However, one of the most troublesome problems in the commercial bonding process is to need the high temperature for the bonding. Due to the high temperature bonding process, lots of side problems are followed such as warpage and crack, etc. In this paper, we tried to develop the new bonding technology with low temperature around $100^{\circ}C$. As a result of this study, the PCB bonding technology with high bonding strength is demonstrated with the value of bonding strength from 7 to 8 MPa at the temperature of $100^{\circ}C$.

• 한국소음진동공학회:학술대회논문집
• /
• 한국소음진동공학회 2004년도 춘계학술대회논문집
• /
• pp.362-365
• /
• 2004

'Coil' occupies a much important position in delivering driving force of optical pick-up actuators. Up to now the main stream has been a winding coil type actuator, but actuators using FP-Coil(Fine Pattern Coil) have been considered for the more compacted and simple manufacturing process and have variously spreaded the application fields by product. We have tried to design actuators using PCB-Coil(Printed Circuit Board Coil) which has benefits in terms of price and manufacturing process. Especially this research has two main things those are to reduce the vibration of sub-resonance and to assure the do sensitivity in the performance of asymmetric optical pick-up actuator with PCB-Coil.

• 마이크로전자및패키징학회지
• /
• 제19권4호
• /
• pp.13-18
• /
• 2012

By the need for high-speed data transmission in PCB, the studies on the optical PCB has been conducted with optical interconnection and its packaging technology. Particularly, the polymer-based optical interconnection has been extensively studied with the advantages such as cost-effective and ease of process. For high-efficiency and passive alignment, the studies were performed using the 45 degree mirrors, MT connector, and etc. In this work, integrated PLC device and fiber alignment array block was fabricated by using imprint technology to solve the alignment and array problem of optical device and the optical fiber. The fabricated integrated block for optical interconnection of PLC device has achieved higher precision of decreasing the dimensional error of the patterns by optimization of process and its insertion loss has an average value of 4.03dB, lower than criteria specified by international standard. In addition, a optical waveguide with built-in lens has been proposed for high-efficiency and passive alignment. By simulation, it was confirmed that the proposed structure has higher coupling efficiency than conventional no-lens structure and has the broad tolerance for the spatial offset of optical waveguide.

• 제어로봇시스템학회:학술대회논문집
• /
• 제어로봇시스템학회 2000년도 제15차 학술회의논문집
• /
• pp.302-302
• /
• 2000

This paper presents the measurement and correction of PCB alignment errors for PCB-manufacturing machines. The conventional PCB-manufacturing machine doesn't have enough accuracy to accommodate the demand for high-resolution circuit pattern and high-density mounting capacity of electronic chips. It is because of alignment errors of PCB loaded to the PCB-manufacturing machine. Therefore, this study focuses on the development of the system which is able to measure and correct alignment errors whit high-accuracy. An automatic optical inspection part measures the PCB alignment error using two cameras, and the high-accuracy 3-axis stage makes correct of these error. The operating system is run in the environment of Window 98 (or NT). Finally we implemented this system to PCB screen printer and PCB exposure system.

• 제어로봇시스템학회논문지
• /
• 제15권8호
• /
• pp.772-777
• /
• 2009

The geometric distortion of image is one of the most important parameters that take effect on the accuracy of optical inspection systems. We propose a new correction method of the image distortion to increase the accuracy of PCB inspection systems. The model-free method is applied to correct the randomly distorted image that cannot be represented by mathematical model. To reduce the correction time of inspection system, we newly propose a grid reduction algorithm that minimize the number of grids by the quad-tree approach. We apply the proposed method to a PCB inspection system, and verify its usefulness through experiments using actual inspection images.