• Journal of the Microelectronics and Packaging Society
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• v.22 no.1
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• pp.1-5
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• 2015

Recently, data throughput of smart electric devices increases dramatically. There is a great interest in a new technology which exceeds the limit of electrical transmission method. Optical PCB can supplement the weakness of electrical signal processing, the research for optical PCB is very active. In this paper, we propose the thermal imprint lithography process to fabrication optical layer of optical PCB and experiment to optimize the process conditions. We confirm process time, pressure, process temperature, demolding temperature and fabricate optical interconnection structure which has $45^{\circ}$ tilted mirror surface for confirm the interconnection efficiency.

• Journal of the Microelectronics and Packaging Society
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• v.18 no.1
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• pp.7-13
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• 2011

According to increasing of data transfer rate, printed circuit board (PCB) is required improvement of transmission speed. Optical PCB and its packaging technology can be one of the solutions that overcome the limitations of conventional electrical PCB. The data transmission capacity will be increased 10 Tbps at 2015. To this end, studies on various OPCB technologies are being conducted. For cost-effective and high- performance OPCB, studies of optical coupling by polymer replication process are conducted. In this work, optical waveguide and optical fiber array block were sequentially fabricated by polymer pattern replication method. Using this method we successfully demonstrate low loss optical fiber coupling between optical waveguide and optical fiber arrays. And researches on flip chip bonding process and using electro-optic connectors for packaging are conducted.

• Journal of the Microelectronics and Packaging Society
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• v.19 no.2
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• pp.47-53
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• 2012

Recently, by the increasing of data transmission rates, PCB is required high-speed data transmission rates and thin packaging. So optical PCB which is the combination of electrical layer and optical layer can be one of the solution to overcome the limitations of conventional electrical PCB. The most important factor in the implementation of optical PCB is optical interconnection. So the research on high-efficiency and passive alignment has been active. In this paper, we suggest built-in lens pluggable waveguide and we simulate its coupling efficiency and structural stability. Optical simulation results show that the proposed structure has higher efficiency than no lens structure about 1.86 times in transmitter and about 1.42 times in receiver. In structure simulation, inner lens has no damage in desorption process. Therefore, we shown that the proposed structure has a high coupling efficiency and structural stability.

• Proceedings of the Optical Society of Korea Conference
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• 2006.07a
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• pp.469-471
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• 2006

This paper describes a efficient insepction method of PCB PADs for AFVI. The methods for PCB inspection have been tried to detect the defects in PCB PADs, but their low detection rate results from pattern variations that are originating from etching, printing and handling processes. The adaptive inspection method has been newly proposed to extract minute defects based on dynamic segments and filters. The vertexes are extracted from CAM master images of PCB and then a lot of segments are constructed in master data. The proposed method moves these segments to optimal directions of a PAD contour and so adaptively matches segments to PAD contours of inspected images, irrespectively of various pattern variations. It makes a fast, accurate and reliable inspection of PCB patterns. Experimental results show that proposed methods are found to be effective for flexible defects detection.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.23 no.1
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• pp.29-33
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• 2010

As the demands for the higher data transmission speed and capacity as well as integration density grow throughout the network, much works have being done in order to integrate the Electrical PCB with Optical PCB. However, one of the most troublesome problems in the commercial bonding process is to need the high temperature for the bonding. Due to the high temperature bonding process, lots of side problems are followed such as warpage and crack, etc. In this paper, we tried to develop the new bonding technology with low temperature around $100^{\circ}C$. As a result of this study, the PCB bonding technology with high bonding strength is demonstrated with the value of bonding strength from 7 to 8 MPa at the temperature of $100^{\circ}C$.

• Journal of the Microelectronics and Packaging Society
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• v.21 no.1
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• pp.25-29
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• 2014

In this study, an optical PCB was proposed which can overcome the limitations of the conventional PCB, and a new structure with pluggable lens was considered for a high-efficient passive alignment. The structure was a lens-added optical waveguide for the improvement of misalignment between the lens and the waveguide in the alignment. Also, as it had a barrier-type structure to prevent the surface damage of the lens by desorption, the high-efficient passive alignment can be realized. The structure was designed by optimizing the simulation and the fabrication process of the pluggable lens structure was conducted using the repetitive photolithography and the thermal reflow. The optical waveguide with the lens-integrated pluggable interconnection was fabricated by the imprint process using the polydimethylsiloxane(PDMS) replica mold. Therefore, we confirmed the possibility of pluggable lens-added optical waveguide structure fabrication for high-efficient passive alignment.

• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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• 2004.05a
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• pp.362-365
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• 2004

'Coil' occupies a much important position in delivering driving force of optical pick-up actuators. Up to now the main stream has been a winding coil type actuator, but actuators using FP-Coil(Fine Pattern Coil) have been considered for the more compacted and simple manufacturing process and have variously spreaded the application fields by product. We have tried to design actuators using PCB-Coil(Printed Circuit Board Coil) which has benefits in terms of price and manufacturing process. Especially this research has two main things those are to reduce the vibration of sub-resonance and to assure the do sensitivity in the performance of asymmetric optical pick-up actuator with PCB-Coil.

• Journal of the Microelectronics and Packaging Society
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• v.19 no.4
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• pp.13-18
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• 2012

By the need for high-speed data transmission in PCB, the studies on the optical PCB has been conducted with optical interconnection and its packaging technology. Particularly, the polymer-based optical interconnection has been extensively studied with the advantages such as cost-effective and ease of process. For high-efficiency and passive alignment, the studies were performed using the 45 degree mirrors, MT connector, and etc. In this work, integrated PLC device and fiber alignment array block was fabricated by using imprint technology to solve the alignment and array problem of optical device and the optical fiber. The fabricated integrated block for optical interconnection of PLC device has achieved higher precision of decreasing the dimensional error of the patterns by optimization of process and its insertion loss has an average value of 4.03dB, lower than criteria specified by international standard. In addition, a optical waveguide with built-in lens has been proposed for high-efficiency and passive alignment. By simulation, it was confirmed that the proposed structure has higher coupling efficiency than conventional no-lens structure and has the broad tolerance for the spatial offset of optical waveguide.

• 제어로봇시스템학회:학술대회논문집
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• 2000.10a
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• pp.302-302
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• 2000

This paper presents the measurement and correction of PCB alignment errors for PCB-manufacturing machines. The conventional PCB-manufacturing machine doesn't have enough accuracy to accommodate the demand for high-resolution circuit pattern and high-density mounting capacity of electronic chips. It is because of alignment errors of PCB loaded to the PCB-manufacturing machine. Therefore, this study focuses on the development of the system which is able to measure and correct alignment errors whit high-accuracy. An automatic optical inspection part measures the PCB alignment error using two cameras, and the high-accuracy 3-axis stage makes correct of these error. The operating system is run in the environment of Window 98 (or NT). Finally we implemented this system to PCB screen printer and PCB exposure system.

• Journal of Institute of Control, Robotics and Systems
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• v.15 no.8
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• pp.772-777
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• 2009

The geometric distortion of image is one of the most important parameters that take effect on the accuracy of optical inspection systems. We propose a new correction method of the image distortion to increase the accuracy of PCB inspection systems. The model-free method is applied to correct the randomly distorted image that cannot be represented by mathematical model. To reduce the correction time of inspection system, we newly propose a grid reduction algorithm that minimize the number of grids by the quad-tree approach. We apply the proposed method to a PCB inspection system, and verify its usefulness through experiments using actual inspection images.