• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 1996년도 춘계학술대회 논문집
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• pp.819-823
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• 1996

In the large steel ingosts, void defects exhibiting microvoid shapes are inevitably formed in the V-segregation zone of the ingots during solidification. In the hot open-die forging process, material properties are improved by eliminating internal porosity. The void size is practically very small as compared with the huge large ingot. Thus, for deformation analysis of a large ingot, a massive number of elements are needed in order to describe a void surface and to uniform mesh sturcture. In the present work the Global/Local scheme has been introduced in order to reduce the computational time and to easily generate the mesh system as a void module of local mesh for obtaining the accurate solution around a void. The procedure of the global- local method consists of two steps. In the first step global analysis is carried out which seeks a reasonably good solution with a cpurse mesh system without describing a void. Then, a local analysis is performed locally with a fine mesh system under the size-criterion of a local region. The computational time has been greatly reduced. Though the work it has been shown that large ingot forging incorporation small voids can be effectively analyzed by using the proposed Global/Local scheme.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2003년도 International Symposium
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• pp.109-119
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• 2003

o In order to start SIP Project .Marketing (& ASIC team) should present biz planning, schedule, device/SIP specs., in SIP TFT prior to request SIP development for package development project. .In order to prevent (PCB) revision, test, burn-in, & quality strategy should be fixed by SIP TFT (PE/Test, QA) prior to request for PKG development. .Target product price/cost, package/ test cost should be delivered and reviewed. o Minimum Information for PCB Design, Package Size, and Cost .(Required) package form factor: size, height, type (BGA, QFP), Pin count/pitch .(Estimated) each die size including scribe lane .(Estimated) pad inform. : count, pitch, configuration(in-line/staggered), (open) size .(Estimated) each device (I/O & Core) power (especially for DRAM embedded SIP) .SIP Block diagram, and net-list using excel sheet format o Why is the initial evaluation important\ulcorner .The higher logic power resulted in spec. over of DRAM Tjmax. This caused business drop longrightarrow Thermal simulation of some SIP product is essential in the beginning stage of SIP business planning (or design) stage. (i.e., DRAM embedded SIP) .When SIP is developed using discrete packages, the I/O driver Capa. of each device may be so high for SIP. Since I/O driver capa. was optimized to discrete package and set board environment, this resulted in severe noise problem in SIP. longrightarrow In this case, the electrical performance of product (including PKG) should have been considered (simulated) in the beginning stage of business planning (or design).

• 한국정밀공학회지
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• 제32권11호
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• pp.945-952
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• 2015

In drawing sheet metal, the blank holding force is applied to prevent wrinkling of the product and to add a tensile stress to the material for the plastic deformation. Applying an inappropriate blank holding force can cause wrinkling or fracture. Therefore, it is important to determine the appropriate blank holding force. Recent developments of the servo cushion open up the possibility to reduce the possibility of fracture and wrinkling by controlling the blank holding force along the stroke. In this study, a method is presented to find the optimal variable blank holding force curve, which uses statistical analysis with consideration of the nonlinear deformation path. The optimal blank holding force curve was numerically and experimentally applied to door inner parts. Consequently, it was shown that the application of the variable blank holding force curve to door inner parts could effectively reduce the possibility of fracture and wrinkling.

• Design & Manufacturing
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• 제14권4호
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• pp.25-39
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• 2020

In this study, an edge device that monitors the injection molding process by measuring the mold vibration(acceleration) signal and the mold surface temperature was developed and evaluated its performance. During injection molding, signals of the injection start, V/P switchover, and packing end sections were obtained through the measurement of the mold vibration and the injection time and packing time were calculated by using the difference between the times of the sections. Then, the mold closed and mold open signals were obtained using a magnetic hall sensor, and cycle time was calculated by using the time difference between the mold closed time each process. As a result of evaluating the performance by comparing the process data monitored by the edge device with the shot data recorded on the injection molding machine, the cycle time, injection time, and packing time showed very small error of 0.70±0.38%, 1.40±1.17%, and 0.69±0.82%, respectively, and the values close to the actual were monitored and the accuracy and reliability of the edge device were confirmed. In addition, it was confirmed that the mold surface temperature measured by the edge device was similar to the actual mold surface temperature.

• 산업경영시스템학회지
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• 제46권2호
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• pp.1-12
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• 2023

To make semiconductor chips, a number of complex semiconductor manufacturing processes are required. Semiconductor chips that have undergone complex processes are subjected to EDS(Electrical Die Sorting) tests to check product quality, and a wafer bin map reflecting the information about the normal and defective chips is created. Defective chips found in the wafer bin map form various patterns, which are called defective patterns, and the defective patterns are a very important clue in determining the cause of defects in the process and design of semiconductors. Therefore, it is desired to automatically and quickly detect defective patterns in the field, and various methods have been proposed to detect defective patterns. Existing methods have considered simple, complex, and new defect patterns, but they had the disadvantage of being unable to provide field engineers the evidence of classification results through deep learning. It is necessary to supplement this and provide detailed information on the size, location, and patterns of the defects. In this paper, we propose an anomaly detection framework that can be explained through FCDD(Fully Convolutional Data Description) trained only with normal data to provide field engineers with details such as detection results of abnormal defect patterns, defect size, and location of defect patterns on wafer bin map. The results are analyzed using open dataset, providing prominent results of the proposed anomaly detection framework.

• 소성∙가공
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• 제32권1호
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• pp.20-27
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• 2023

In this study, the deformation of materials was measured using the video and tracking API of OpenCV. Circular markers attached to the material were selected the region of interests (ROIs). The position of the marker was measured from the area center of the circular marker. The position and displacement of the center point was measured along the image frames. For the verification, tensile tests were conducted. In the tensile test, four circular markers were attached along the longitudinal and transverse directions. The strain was calculated using the distance between markers both in the longitudinal and transverse direction. As a result, the stress-strain curve obtained using machine vision is compared to the stress-strain curve obtained from the DIC results. RMSE values of the strain from the machine vision and DIC were less than 0.005. In addition, as a measurement example, a bending angle and springback measurement according to bending deformation, and a moving position measurement of a punch, a blank holder, and a die by time change were performed. Using the proposed method, the deformation and displacement of the materials were measured precisely and easily.

• International Journal of Naval Architecture and Ocean Engineering
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• 제6권2호
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• pp.187-205
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• 2014

The global price of oil, which is both finite and limited in quantity, has been rising steadily because of the increasing requirements for energy in both developing and developed countries. Furthermore, regulations have been strengthened across all industries to address global warming. Many studies of hull resistance, propulsion and operation of ships have been performed to reduce fuel consumption and emissions. This study examined the design parameters of the propeller boss cap fin (PBCF) and hub cap for 6,000TEU container ships to improve the propulsion efficiency. The design parameters of PBCF have been selected based on the geometrical shape. Computational fluid dynamics (CFD) analysis with a propeller open water (POW) test was performed to check the validity of CFD analysis. The design of experiment (DOE) case was selected as a full factorial design, and the experiment was analyzed by POW and CFD analysis. Analysis of variance (ANOVA) was performed to determine the correlation among design parameters. Four design alternatives of PBCF were selected from the DOE. The shape of a propeller hub cap was selected as a divergent shape, and the divergent angle was determined by the DOE. Four design alternatives of PBCF were attached to the divergent hub cap, and the POW was estimated by CFD. As a result, the divergent hub cap with PBCF has a negative effect on the POW, which is induced by an increase in torque coefficient. A POW test and cavitation test were performed with a divergent hub cap with PBCF to verify the CFD result. The POW test result showed that the open water efficiency was increased approximately 2% with a divergent hub cap compared to a normal cap. The POW test result was similar to the CFD result, and the divergent hub cap with the PBCF models showed lower open water efficiency. This was attributed to an increase in the torque coefficient just like the CFD results. A cavitation test was performed using the 2 models selected. The test result showed that the hub vortex is increased downstream of the propeller.

• 전자공학회논문지D
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• 제35D권9호
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• pp.26-34
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• 1998

본 논문은 주사전자현미경(SEM)의 전자총을 이용하여 MCM 또는 PCB 회로기판의 신호연결선에서 전압차를 유도시켜 개방/단락 등의 결함을 측정 검사하는 방법을 제시한다. 본 실험에서는 주사전자현미경의 구조를 변형시키지 알고 회로기판의 개방/단락 검사를 실시할 수 있는 이중전위전자빔(Dual Potential) 검사방법을 사용한다. 이중전위전자빔(Dual Potential) 측정검사 방법은 이차전자수율 값 δ의 차이를 유기시키는 δ < 1 인 충전 전자빔과 δ > 1 인 읽기 전자빔을 사용하여 한 개의 전자총이 각각 다른 가속전압에 의해 생성된 두 개의 전자빔으로 측정하는 방법으로 특정 회로네트에 대한 개방/단락 등의 측정 검사가 가능하다. 또한 읽기 전자빔을 이용할 경우 검사한 회로 네트를 방전시킬 수 있어 기판 도체에 유기된 전압차를 없앨 수 있는 방전시험도 실시할 수 있어, 많은 수의 회로네트를 지닌 회로 기판에 대해 측정 검사할 때 충전되어 있는 회로네트에 대한 측정오류를 줄일 수 있다. 측정검사를 실시한 결과 glass-epoxy 회로기판 위에 실장된 구리(Cu) 신호연결선은 7KeV의 충전 전자빔으로 충전시키고 10초 이내에 주사전자현미경을 읽기 모드로 바꾸어 2KeV의 읽기 전자빔으로 구리표면에서의 명암 밝기 차이를 읽어 개방/단락 상태를 검사할 수 있었다. 또한 IC 칩의 Au 패드와 BGA의 Au 도금된 Cu 회로패드를 검사한 결과도 7KeV 충전 전자빔과 2KeV 읽기 전자빔으로 IC칩 내부회로에서의 개방 단락 상태를 쉽게 검사할 수 있었다. 이 검사방법은 주사전자현미경에 있는 한 개의 전자총으로 비파괴적으로 회로 기판의 신호 연결선의 개방/단락 상태를 측정 검사할 수 있음을 보여 주었다.

• 보건행정학회지
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• 제27권2호
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• pp.167-176
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• 2017

Background: This study aimed to analyze the impact of community health care resources on the place of death of older adults with dementia compared to those with cancer in South Korea, using public administrative big data. Methods: Based on a literature review, we selected person- and community-level variables that can affect older people's decisions about where to die. Data on place-of-death and person-level attributes were obtained from the 2013 death certification micro data from Statistics Korea. Data on the population and economic and health care resources in the community where the older deceased resided were obtained from various open public administrative big data including databases on the local tax and resident population statistics, health care resources and infrastructure statistics, and long-term care (LTC) insurance statistics. Community-level data were linked to the death certificate micro data through the town (si-gun-gu) code of the residence of the deceased. Multi-level logistic regression models were used to simultaneously estimate the impacts of community as well as individual-level factors on the place of death. Results: In both the dementia (76.1%) and cancer (87.1%) decedent groups, most older people died in the hospital. Among the older deceased with dementia, hospital death was less likely to occur when the older person resided in a community with a higher supply of LTC facility beds, but hospital death was more likely to occur in communities with a higher supply of LTC hospital beds. Similarly, among the cancer group, the likelihood of a hospital death was significantly lower in communities with a higher supply of LTC facility beds, but was higher in communities with a higher supply of acute care hospital beds. As for individual-level factors, being female and having no spouse were associated with the likelihood of hospital death among older people with dementia. Conclusion: More than three in four older people with dementia die in the hospital, while home is reported to be the place of death preferred by Koreans. To decrease this gap, an increase in the supply of end-of-life (EOL) care at home and in community-based service settings is necessary. EOL care should also be incorporated as an essential part of LTC. Changes in the perception of EOL care by older people and their families are also critical in their decisions about the place of death, and should be supported by public education and other related non-medical, social approaches.

• 대한전자공학회논문지SD
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• 제43권5호
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• pp.54-63
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• 2006

본 논문에서는 4세대 이동 통신 시스템에서 요구되는 사양을 위해, 해상도, 동작속도, 칩 면적 및 소모 전력을 최적화한 14b 100MS/s 0.18um CMOS ADC를 제안한다. 제안하는 ADC는 동작 모델 시뮬레이션을 통해 최적화된 구조를 분석 및 검증하여 3단 파이프라인 구조로 설계하였으며, Nyquist 입력에서도 14 비트 수준의 유효비트 수를 가지는 광대역 저잡음 SHA 회로를 기반으로 하고, MDAC에 사용되는 커패시터의 소자 부정합에 의한 영향을 최소화하기 위하여 3차원 완전 대칭 구조를 갖는 레이아웃 기법을 적용하였다. 또한, 100MS/s의 동작 속도에서 6 비트의 해상도와 소면적을 필요로 하는 최종단의 flash ADC는 오픈 루프 오프셋 샘플링 및 인터폴레이션 기법을 사용하였다. 제안하는 시제품 ADC는 SMIC 0.18um CMOS 공정으로 제작되었으며, 측정된 DNL과 INL은 14비트 해상도에서 각각 1.03LSB, 5.47LSB 수준을 보이며, 100MS/s의 샘플링 속도에서 SNDR 및 SFDR이 각각 59dB, 72dB의 동적 성능을 보여준다. 시제품 ADC의 칩 면적은 $3.4mm^2$이며 소모 전력은 1.8V 전원전압에서 145mW이다.