• Journal of the Institute of Electronics Engineers of Korea SD
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• v.48 no.8
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• pp.25-32
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• 2011

Networks-on-chip (NoC) is emerging as a key technology to overcome severe bus traffics in ever-increasing complexity of the Multiprocessor systems-on-chip (MPSoC); however traditional electrical interconnection based NoC architecture would be faced with technical limits of bandwidth and power consumptions in the near future. In order to cope with these problems, a hybrid optical NoC architecture which use both electrical interconnects and optical interconnects together, has been widely investigated. In the hybrid optical NoCs, wormhole switching and simple deterministic X-Y routing are used for the electrical interconnections which is responsible for the setup of routing path and optical router to transmit optical data through optical interconnects. Optical NoC uses circuit switching method to send payload data by preset paths and routers. However, conventional hybrid optical NoC has a drawback that concurrent transmissions are not allowed. Therefore, performance improvement is limited. In this paper, we propose a new routing algorithm that uses circuit switching and adaptive algorithm for the electrical interconnections to transmit data using multiple paths simultaneously. We also propose an efficient method to prevent livelock problems. Experimental results show up to 60% throughput improvement compared to a hybrid optical NoC and 65% power reduction compared to an electrical NoC.

• Journal of the Korean Institute of Telematics and Electronics A
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• v.32A no.9
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• pp.114-120
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• 1995

It is important to test the various kinds of interconnect faults between chips on a card/module. When boundary scan design techniques are adopted, the chip to chip interconnection test generation and application of test patterns is greatly simplified. Various test generation algorithms have been developed for interconnect faults. A new interconnect test generation algorithm is introduced. It reduces the number of test patterns by half over present techniques. It also guarantees the complete diagnosis of mutiple interconnect faults.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.25 no.4
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• pp.483-486
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• 2014

Although flip-chip interconnects have smaller parasitics than bonding wires, they should be carefully designed at 60 GHz. Insertion loss at a flip-chip transition may differ as much as 2 dB depending on design parameters. In this paper we present a comprehensive sensitivity analysis to optimize the flip-chip transition.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2003.09a
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• pp.93-100
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• 2003

The continuing scaling trend in microelectronic circuit technology has a significant impact on the different IC interconnection and packaging technologies. These latter technologies have not kept pace with the IC scaling trends, resulting in a so-called“interconnect technology gap”. Multilayer thin film technology is proposed as a“bridge”- technology between the very high density IC technology and the coarse standard PCB technology. It is also a key enabling technology for the realisation of true“System-in-a-Package”(SIP) solutions, combining multiple“System-on-a-Chip”(SOC) IC's with other components and also integrating passive components in its layers. A further step is to use this technology to realise new functionalities on top of active wafers. These additional“above-IC”processed layers may e.g. be used for low loss, high speed on chip interconnects, clock distribution circuits, efficient power/ground distribution and to realize high Q inductors on chip.

• ETRI Journal
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• v.40 no.6
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• pp.759-773
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• 2018

Uncore components such as on-chip memory systems and on-chip interconnects consume a large amount of energy in emerging embedded applications. Few studies have focused on next-generation analytical models for future chip-multiprocessors (CMPs) that simultaneously consider the impacts of the power consumption of core and uncore components. In this paper, we propose a convex-optimization approach to design heterogeneous uncore architectures for embedded CMPs. Our convex approach optimizes the number and placement of memory banks with different technologies on the memory layer. In parallel with hybrid memory architecting, optimizing the number and placement of through silicon vias as a viable solution in building three-dimensional (3D) CMPs is another important target of the proposed approach. Experimental results show that the proposed method outperforms 3D CMP designs with hybrid and traditional memory architectures in terms of both energy delay products (EDPs) and performance parameters. The proposed method improves the EDPs by an average of about 43% compared with SRAM design. In addition, it improves the throughput by about 7% compared with dynamic RAM (DRAM) design.

• The Transactions of the Korean Institute of Electrical Engineers C
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• v.52 no.3
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• pp.116-122
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• 2003

This paper proposes an efficient method for computing the 3-dimensional capacitance of complex structures. The proposed method Is based on Finite Element Method(FEM) and expands the conventional FEM by adopting variable division. This method improves the extraction efficiency 50 times when compared to the conventional FEM with equal division. The proposed method can be used efficiently to extract electrical parameters of on/off-chip interconnects in VLSI systems.

• Proceedings of the IEEK Conference
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• 2001.06b
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• pp.353-356
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• 2001

This paper proposes an efficient method for 3-dimensional capacitance extraction based on Finite Element Method(FEM). This method expands the conventional FEM by adopting variable division. This method improves the extraction efficiency 2 to 100 times and even the accuracy 1% to 3% when compared to the conventional FEM with equal division. The Proposed method can be used efficiency to extract electrical parameters of on/off-chip interconnects in VLSI systems.

• ETRI Journal
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• v.39 no.3
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• pp.428-436
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• 2017

State-of-the-art processors require increasingly complicated memory services for high performance and low power consumption. In particular, they request transfers within a burst in a wrap-around order to minimize the miss penalty of a cache. However, synchronous dynamic random access memories (SDRAMs) do not always generate transfers in the wrap-round order required by the processors. Thus, a memory subsystem rearranges the SDRAM transfers in the wrap-around order, but the rearrangement process may increase memory latency and waste the bandwidth of on-chip interconnects. In this paper, we present a memory subsystem that is effective for the wrapping bursts of a cache. The proposed memory subsystem makes SDRAMs generate transfers in an intermediate order, where the transfers are rearranged in the wrap-around order with minimal penalties. Then, the transfers are delivered with priority, depending on the program locality in space. Experimental results showed that the proposed memory subsystem minimizes the memory performance loss resulting from wrapping bursts and, thus, improves program execution time.

• JSTS:Journal of Semiconductor Technology and Science
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• v.1 no.4
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• pp.209-215
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• 2001

In this paper a method for analysis and modelling of coplanar transmission interconnect lines that are placed on top of silicon-silicon oxide substrates is presented. The potential function is expressed by series expansions in terms of solutions of the Laplace equation for each homogeneous region of layered structure. The expansion coefficients of different series are related to each other and to potentials applied to the conductors via boundary conditions. In the plane of conductors, boundary conditions are satisfied at $N_d$ discrete points with $N_d$ being equal to the number of terms in the series expansions. The resulting system of inhomogeneous linear equations is solved by matrix inversion. No iterations are required. A discussion of the calculated line admittance parameters as functions of width of conductors, thickness of the layers, and frequency is given. The interconnect capacitance and conductance per unit length results are given and compared with those obtained using full wave solutions, and good agreement have been obtained in all the cases treated

• Proceedings of the Materials Research Society of Korea Conference
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• 2011.10a
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• pp.9-9
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• 2011

The transfer of nano-science accomplishments into technology is severely hindered by a lack of understanding of barriers to nanoscale manufacturing. The NSF Center for High-rate Nanomanufacturing (CHN) is developing tools and processes to conduct fast massive directed assembly of nanoscale elements by controlling the forces required to assemble, detach, and transfer nanoelements at high rates and over large areas. The center has developed templates with nanofeatures to direct the assembly of carbon nanotubes and nanoparticles (down to 10 nm) into nanoscale trenches in a short time (in seconds) and over a large area (measured in inches). The center has demonstrated that nanotemplates can be used to pattern conducting polymers and that the patterned polymer can be transferred onto a second polymer substrate. Recently, a fast and highly scalable process for fabricating interconnects from CMOS and other types of interconnects has been developed using metallic nanoparticles. The particles are precisely assembled into the vias from the suspension and then fused in a room temperature process creating nanoscale interconnect. The center has many applications where the technology has been demonstrated. For example, the nonvolatile memory switches using (SWNTs) or molecules assembled on a wafer level. A new biosensor chip (0.02 $mm^2$) capable of detecting multiple biomarkers simultaneously and can be in vitro and in vivo with a detection limit that's 200 times lower than current technology. The center has developed the fundamental science and engineering platform necessary to manufacture a wide array of applications ranging from electronics, energy, and materials to biotechnology.