• Title/Summary/Keyword: On-Chip Memory

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A Survey of the Index Schemes based on Flash Memory (NAND 플래쉬메모리 기반 색인에 관한 연구)

  • Kim, Dong-Hyun;Ban, Chae-Hoon
    • The Journal of the Korea institute of electronic communication sciences
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    • v.8 no.10
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    • pp.1529-1534
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    • 2013
  • Since a NAND-flash memory is able to store mass data in a small sized chip and consumes low power, it is exploited on various hand-held devices, such as a smart phone and a sensor node, etc. To process efficiently mass data stored in the flash memory, it is required to use an index. However, since the write operation of the flash memory is slower than the read operation and an overwrite operation is not supported, the usage of existing index schemes degrades the performance of the index. In this paper, we survey the previous researches of index schemes for the flash memory and classify the researches by the methods to solve problems. We also present the performance factor to be considered when we design the index scheme on the flash memory.

A design and implementation of Face Detection hardware (얼굴 검출을 위한 SoC 하드웨어 구현 및 검증)

  • Lee, Su-Hyun;Jeong, Yong-Jin
    • Journal of the Institute of Electronics Engineers of Korea SD
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    • v.44 no.4
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    • pp.43-54
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    • 2007
  • This paper presents design and verification of a face detection hardware for real time application. Face detection algorithm detects rough face position based on already acquired feature parameter data. The hardware is composed of five main modules: Integral Image Calculator, Feature Coordinate Calculator, Feature Difference Calculator, Cascade Calculator, and Window Detection. It also includes on-chip Integral Image memory and Feature Parameter memory. The face detection hardware was verified by using S3C2440A CPU of Samsung Electronics, Virtex4LX100 FPGA of Xilinx, and a CCD Camera module. Our design uses 3,251 LUTs of Xilinx FPGA and takes about 1.96${\sim}$0.13 sec for face detection depending on sliding-window step size, when synthesized for Virtex4LX100 FPGA. When synthesized on Magnachip 0.25um ASIC library, it uses about 410,000 gates (Combinational area about 345,000 gates, Noncombinational area about 65,000 gates) and takes less than 0.5 sec for face realtime detection. This size and performance shows that it is adequate to use for embedded system applications. It has been fabricated as a real chip as a part of XF1201 chip and proven to work.

A Study on the Development of Semi-automated Analog Cell Compiler for MML Library (MML(merged memory logic) 라이브러리 구축을 위한 반자동 아날로그 컴파일러 개발에 관한 연구)

  • 최문석;송병근곽계달
    • Proceedings of the IEEK Conference
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    • 1998.10a
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    • pp.695-698
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    • 1998
  • Today SOC(system on a chip) is a trend in VLSI design society. Especially MML(merged memory Logic) process provides designers with good chances to implement SOC which is consists of DRAM, SRAM, Logic and A/D mixed mode ciruit blocks. Designers need good circuit library which is reliable and easy to tune for specific design. For this need we present semi-automated analog compiler methodology. And we aplied this design methodology to resistor-string DAC design.

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Design of Communication Software Based on DSP and Implementation of Testbed (DSP 기반 통신 소프트웨어의 설계 및 테스트베드)

  • 황택규
    • Proceedings of the IEEK Conference
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    • 1999.06a
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    • pp.1137-1140
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    • 1999
  • In this thesis, we research about Communication System Construction and Test-Bed Realization Method and Software’s Design with written program into Embedded Micro Controller’s restricted memory region using a DSP Chip to deal with mainly high speed communication. Tools used for modern communication network control use TI or AMD general chip class, but nevertheless responsibility for the point at issue, Analog Device is architecture design model moderated for small communication system. In this thesis, we present extended model, and realize basic case.

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Word Speech Recognition System by Using TMS320C6711 (TMS320C6711을 이용한 어휘 인식기)

  • 최지혁;김상준;홍광석
    • Proceedings of the IEEK Conference
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    • 2003.07e
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    • pp.2240-2243
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    • 2003
  • In this paper. we present a new speech recognition system using DSP chip. DSP chip used TMS320c6711 of TI. We designed hardware system including acoustic model, word list and code book in flash memory. The word candidates are recognized based on CV, VCCV, and VC units HMM. This system can be applied to various electric & electronic devices: home automation, robotics etc.

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Advances in Package-on-Package Technology for Logic + Memory Integration

  • Scanlan Christopher
    • Proceedings of the International Microelectronics And Packaging Society Conference
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    • 2005.09a
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    • pp.111-129
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    • 2005
  • Pop provides OEMs and EMS with a platform to cost effectively expand options for logic + memory 3D integration - Expands device options by simplifying business logistics of stacking - Integration controlled at the system level to best match stacked combinations with system requirements - Eliminates margin stacking and expands technology reuse - Helps manage the huge cost impacts associated with increasing demand for multi media processing and memory. PoP is well timed to enable and leverage: - Mass customization of systems for different use (form, fit and function) requirements o Bband and apps processor + memory stack platforms - Logic transition to flip chip enables PoP size reduction o Area and height reduction. Industry standardization is progressing. Amkor provides full turn-key support for base package, memory package and full system integration.

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New Wafer Burn-in Method of SRAM in Multi Chip Package (MCP)

  • Kim, Hoo-Sung;Kim, Hwa-Young;Park, Sang-Won;Sung, Man-Young
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2004.11a
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    • pp.53-56
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    • 2004
  • This paper presents the improved burn-in method for the reliability of SRAM in MCP Semiconductor reliability is commonly improved through the burn-in process. Reliability problem is more significant in the Multi Chip Package, because of including over two devices in a package. In the SRAM-based Multi Chip Package, the failure of SRAM has a large effect on the yield and quality of the other chips - Flash Memory, DRAM, etc. So, the quality of SRAM must be guaranteed. To improve the quality of SRAM, we applied the improved wafer level burn-in process using multi cell selection method in addition to the current used methods. That method is effective in detecting special failure. Finally, with the composition of some kinds of methods, we could achieve the high qualify of SRAM in Multi Chip Package.

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Improving Parallel Testing Efficiency of Memory Chips using NOC Interconnect (NOC 인터커넥트를 활용한 메모리 반도체 병렬 테스트 효율성 개선)

  • Hong, Chaneui;Ahn, Jin-Ho
    • The Transactions of The Korean Institute of Electrical Engineers
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    • v.68 no.2
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    • pp.364-369
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    • 2019
  • Generally, since memory chips should be tested all, considering its volume, the reduction in test time for detecting faults plays an important role in reducing the overall production cost. The parallel testing of chips in one ATE is a competitive solution to solve it. In this paper, NOC is proposed as test interface architecture between DUTs and ATE. Because NOC can be extended freely, there is no limit on the number of DUTs tested at the same time. Thus, more memory can be tested with the same bandwidth of ATE. Furthermore, the proposed NOC-based parallel test method can increase the efficiency of channel usage by packet type data transmission.

Rapid Data Allocation Technique for Multiple Memory Bank Architectures (다중 메모리 뱅크 구조를 위한 고속의 자료 할당 기법)

  • 조정훈;백윤홍;최준식
    • Proceedings of the Korean Information Science Society Conference
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    • 2003.10a
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    • pp.196-198
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    • 2003
  • Virtually every digital signal processors(DSPs) support on-chip multi- memory banks that allow the processor to access multiple words of data from memory in a single instruction cycle. Also, all existing fixed-point DSPs have irregular architecture of heterogeneous register which contains multiple register files that are distributed and dedicated to different sets of instructions. Although there have been several studies conducted to efficiently assign data to multi-memory banks, most of them assumed processors with relatively simple, homogeneous general-purpose resisters. Therefore, several vendor-provided compilers fer DSPs were unable to efficiently assign data to multiple data memory banks. thereby often failing to generate highly optimized code fer their machines. This paper presents an algorithm that helps the compiler to efficiently assign data to multi- memory banks. Our algorithm differs from previous work in that it assigns variables to memory banks in separate, decoupled code generation phases, instead of a single, tightly-coupled phase. The experimental results have revealed that our decoupled algorithm greatly simplifies our code generation process; thus our compiler runs extremely fast, yet generates target code that is comparable In quality to the code generated by a coupled approach

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Concurrent Support Vector Machine Processor (Concurrent Support Vector Machine 프로세서)

  • 위재우;이종호
    • The Transactions of the Korean Institute of Electrical Engineers D
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    • v.53 no.8
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    • pp.578-584
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    • 2004
  • The CSVM(Current Support Vector Machine) that is a digital architecture performing all phases of recognition process including kernel computing, learning, and recall of SVM(Support Vector Machine) on a chip is proposed. Concurrent operation by parallel architecture of elements generates high speed and throughput. The classification problems of bio data having high dimension are solved fast and easily using the CSVM. Quadratic programming in original SVM learning algorithm is not suitable for hardware implementation, due to its complexity and large memory consumption. Hardware-friendly SVM learning algorithms, kernel adatron and kernel perceptron, are embedded on a chip. Experiments on fixed-point algorithm having quantization error are performed and their results are compared with floating-point algorithm. CSVM implemented on FPGA chip generates fast and accurate results on high dimensional cancer data.