• 반도체디스플레이기술학회지
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• 제12권2호
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• pp.51-56
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• 2013

Even if transmissions through normal channel between ubiquitous devices and terminal readers are encrypted, any extra sources of information retrieved from encrypting module can be exploited to figure out the key parameters, so called side channel attack. Since side channel attacks are based on statistical methods, making side channel signal weak or complex is the proper solution to prevent the attack. Among many countermeasures, shielding the electromagnetic signal and adding noise to the EM signal were examined by applying different thicknesses of thin films of ferroelectric (BTO) and conductors (copper and gold). As a test vehicle, chip antenna was utilized to see the change in radiation characteristics: return loss and gain. As a result, the ferroelectric BTO showed no recognizable effect on both shielding and adding noise. Cu thin film showed increasing shielding effect with thickness. Nanometer Au exhibited possibility in adding noise by widening of bandwidth and red shifting of resonating frequencies.

• Journal of electromagnetic engineering and science
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• 제15권1호
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• pp.59-61
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• 2015

A wideband H-band detector operating near 300 GHz has been developed based on SiGe HBT technology. The detector consists of an on-chip antenna and a HBT differential pair for square-law detection. It showed responsivity of more than 1,700 V/W and noise equivalent power (NEP) smaller than $180pW/Hz^{0.5}$ for the measured frequency range of 250-350 GHz. The maximum responsivity and the minimum NEP were 5,155 V/W and $57pW/Hz^{0.5}$, respectively; both were obtained at 330 GHz with DC power dissipation at 9.1 W.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2001년도 하계학술대회 논문집
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• pp.968-971
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• 2001

In this paper, internal antennas for IMT-2000 handset(1.92∼2.17 GHz) were designed to be capable of being mounted on the circuit-board with a CPW(coplanar waveguide) feeding structure. The chip antennas were miniaturized to a greater extent by fabricating multilayer high dielectric ceramic($\varepsilon$$\sub$r/=7.8) hexahedron. The proposed antennas has λ/4 monopole element with helical structure in the multilayer dielectric ceramic hexahedron. The simulated and measured results were invesgated with width, length, and thickness of helical structure in the hexahedron.

• 한국국방경영분석학회지
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• 제31권1호
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• pp.58-72
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• 2005

RFID(Radio Frequency Identification) is one of key technologies in ubiquitous computing. RFID system comprises tag, reader, and computer application. The tag is a small electronic chip, which is attached to a thing such as item, pallet, container. The reader has an tiny antenna obtaining the identification information of the things by radio frequency, and provides the information to the computer application for a business. In this paper we have proposed the military application of RFID and its implementation policy for the Korean armed forces. We believe that The principle application area would be logistics TAV(total asset visibility) and resource management, and the implementation should be achieved step by step considering the advancement of RFID technology and government policy.

• 한국전기전자재료학회논문지
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• 제36권5호
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• pp.423-432
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• 2023

With the increasing demand for mobile devices featuring multi-touch operation, extensive research is being conducted on touch screen panel (TSP) Readout ICs (ROICs) that should possess low power consumption, compact chip size, and immunity to external noise. Therefore, this paper discusses capacitive touch sensors and their readout circuits, and it introduces research trends in various circuit designs that are robust against external noise sources. The recent state-of-the-art TSP ROICs have primarily focused on minimizing the impact of parasitic capacitance (Cp) caused by thin panel thickness. The large Cp can be effectively compensated using an area-efficient current compensator and Current Conveyor (CC), while a display noise reduction scheme utilizing a noise-antenna (NA) electrode significantly improves the signal-to-noise ratio (SNR). Based on these achievements, it is expected that future TSP ROICs will be capable of stable operation with thinner and flexible Touch Screen Panels (TSPs).

• 대한전자공학회논문지SD
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• 제49권6호
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• pp.25-34
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• 2012

본 논문에서는 near-field scanning (NFS) 시스템을 위한 새로운 보정 방법을 제시하였다. 제안된 교정 방법은 새로운 near-field probe (NFP)와 circular patch patterns (CPPs) and meander patterns (MPs) 같은 새로 고안된 패턴으로 구성되어 있다. 제안된 패턴들은 IEC61967-2과 6에 언급된 기존의 방법과 비교해 공간 해상도을 개선하고 NFP의 교정 절차를 단순화하기 위해 사용하였다. 또한 감쇄 특성에 대한 NFP의 길이 효과를 8mm와 30mm의 길이를 가지고 조사하였다. 이러한 특성을 위해 지름 (D)가 20, 40, 60, 그리고 100mm의 CPP를 만들었고 여러 가지 폭과 간격을 가지는 MP를 설계하고 제작하였다. 단순화된 교정 절차를 이용하여 공간 해상도와 측정 높이 사이의 역 관계를 발견하였다. 테스팅 결과는 측정 높이 $200{\mu}m$에서 $120{\mu}m$의 공간해상도를 복잡한 수정 알고리듬 없이 8GHz 아래에서 얻을 수 있음을 보였다. 제작 단가를 위해 모든 패턴과 NFP는 일반적인 고가의 LTCC 대신 저가의 PCB (FR-4)을 이용해 실현하였다. 이결과를 칩 수주 EMC 사용 가능성을 검증하기 Sub-micron scale 동작이 가능한 NFSS을 제작하였고, 제안된 NFP를 이용하여 사용 칩의 측정결과 $200{\mu}m$ 패턴의 형태를 정확하게 묘사가 가능한 수준의 해상도를 확보하여 칩 수준 EMC 검증에 사용 할 수 있음을 증명하였다.

• ETRI Journal
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• 제25권2호
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• pp.65-72
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• 2003

To achieve cost and size reductions, we developed a low cost manufacturing technology for RF substrates and a high performance passive process technology for RF integrated passive devices (IPDs). The fabricated substrate is a conventional 6" Si wafer with a 25${\mu}m$ thick $SiO_2$ surface. This substrate showed a very good insertion loss of 0.03 dB/mm at 4 GHz, including the conductive metal loss, with a 50 ${\Omega}$ coplanar transmission line (W=50${\mu}m$, G=20${\mu}m$). Using benzo cyclo butene (BCB) interlayers and a 10 ${\mu}m$ Cu plating process, we made high Q rectangular and circular spiral inductors on Si that had record maximum quality factors of more than 100. The fabricated inductor library showed a maximum quality factor range of 30-120, depending on geometrical parameters and inductance values of 0.35-35 nH. We also fabricated small RF IPDs on a thick oxide Si substrate for use in handheld phone applications, such as antenna switch modules or front end modules, and high-speed wireless LAN applications. The chip sizes of the wafer-level-packaged RF IPDs and wire-bondable RF IPDs were 1.0-1.5$mm^2$ and 0.8-1.0$mm^2$, respectively. They showed very good insertion loss and RF performances. These substrate and passive process technologies will be widely utilized in hand-held RF modules and systems requiring low cost solutions and strict volumetric efficiencies.

• 한국전자파학회논문지
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• 제30권4호
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• pp.314-319
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• 2019

본 논문에서는 정확한 고도를 측정하기 위해 송 수신 주파수 차를 이용해 고도를 탐지할 수 있는 W-대역 FMCW(Frequency Modulated Continuous Wave) 레이다 고도계 시스템을 설계 제작하고, 상대 고도를 탐지하여 장애물과 충돌을 방지할 수 있는 고도제어 알고리즘을 제안한다. 이 알고리즘을 탑재한 레이다 고도계를 드론에 장착하여 비행시킨 결과, 입력 고도 대비 최대 약 3 % 오차의 실제 고도 제어를 실험적으로 보였다. W-대역 송 수신기에 사용한 칩은 65 nm CMOS 공정을 이용해 제작하였으며, 칩 상에 도파관 급전기를 내장하여 혼 안테나를 직접 구동하였다. 이 레이다 고도계를 이용하여 흙, 잔디, 그리고 호수 상공에서의 하방 클러터 전력분포를 실측하고, 수분 함량에 따른 표면 측정 특성을 확인하였다.

• 대한전자공학회논문지TC
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• 제48권1호
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• pp.97-101
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• 2011

개인 휴대통신의 서비스 대역에 대응하는 4중 대역 p-HEMT SP6T 스위치를 구현하였다. 낮은 삽입손실과 높은 격리특성을 달성하기 위하여, 트랜지스터 단위소자의 최적화를 통해 On-Off간 상호 보완적 관계를 고려하였으며, 특히 송수선간 격리 특성의 경우, 큰 커패시터 삽입을 통하여 우수한 격리 특성을 달성하는 동시에 단일의 전압제어와 백비아를 사용한 접지를 통해 소형화를 달성하였다. 구현된 SP6T 스위치는 $950um{\times}100um$의 크기를 가지며 공정상 게이트 우물의 오류를 감안할 때, 각 주파수 대역에서 우수한 삽입손실 및 격리특성을 확인 할 수 있었다.

• 한국철도학회:학술대회논문집
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• 한국철도학회 2008년도 춘계학술대회 논문집
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• pp.535-544
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• 2008

Unlike MS(Magnetic Stripe), SMART CARD is equipped with COS(Chip Operating System) consisting of the Microprocessor and Memory where information can be stored and processed, and there are two types of cards according to the contact mode; the contact type that passes through a gold plated area and the contactless one that goes through the radio-frequency using an antenna embedded in the plastic card. the contactless IC card used for the transportation card was first introduced into local area buses in Seoul, and expanded throughout the country so that it has removed the inconvenience such as possession of cash, fare payment and collection. Focusing on the Seoul metropolitan area in 2004, prepaid and pay later cards were adopted and have been used interchangeably between a bus and subway. The card terminal compatible between a bus and subway is Proximity Integrated Circuit Card(PICC) as international standards(1443 Type A,B), communicates in the 13.56MHz dynamic frequency modulation-demodulation system, and adopts the Multi Secure Application Module(SAM). In the second half of 2009, the system avaliable nationwide will be built when the payment SAM standard is implemented.