• Journal of the Microelectronics and Packaging Society
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• v.20 no.4
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• pp.65-68
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• 2013

A novel bumping process using solder bump maker (SBM) is developed for fine-pitch flip chip bonding. It features maskless screen printing process. A selective solder bumping mechanism without the mask is based on the material design of SBM. Maskless screen printing process can implement easily a fine-pitch, low-cost, and lead-free solder-on-pad (SoP) technology. Its another advantage is ternary or quaternary lead-free SoP can be formed easily. The process includes two main steps: one is the thermally activated aggregation of solder powder on the metal pads on a substrate and the other is the reflow of the deposited powder on the pads. Only a small quantity of solder powder adjacent to the pads can join the first step, so a quite uniform SoP array on the substrate can be easily obtained regardless of the pad configurations. Through this process, an SoP array on an organic substrate with a pitch of 130 ${\mu}m$ is, successfully, formed.

• Advances in nano research
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• v.15 no.1
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• pp.1-13
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• 2023

Ti₃C₂T_x MXene, a 2D material, is known to exhibit unique characteristics that are strongly dependent on surface termination groups. Here, we developed a novel annealing approach with Ca as a reducing agent to simultaneously remove F and O groups from the surface of multilayered MXene powder. Unlike H₂ annealing that removes F effectively but has difficulty in removing O, annealing with Ca effectively removed both O and F. X-ray photoelectron spectroscopy (XPS) and energy dispersive X-ray spectroscopy revealed that the proposed approach effectively removed F and O from the MXene powder. The results of O/N analyses showed that the O concentration decreased by 57.5% (from 2.66 to 1.13 wt%). In addition, XPS fitting showed that the volume fraction of metal oxides (TiO₂ and Al₂O₃) decreased, while surface termination groups (-O and -OH) were enhanced, which could increase the hydrophilic and adsorption properties of the MXene. These findings suggest that when F and O are removed from the MXene powder, the interlayer spacing of its lattice structure increases. The proposed treatment also resulted in an increase in the specific surface area (from 5.17 to 10.98 m²/g), with an increase in oxidation resistance temperature in air from ~436 to ~667 ℃. The benefits of this novel technology were verified by demonstrating the significantly improved cyclic charge-discharge characteristics of a lithium-ion battery with a Ca-treated MXene electrode.

• Membrane and Water Treatment
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• v.9 no.2
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• pp.95-104
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• 2018

Copper pollution around the world has caused serious public health problems recently. The heavy metal adsorption on traditional membranes from wastewater is limited by material properties. Different adsorptive materials are embedded in the membrane matrix and act as the adsorbent for the heavy metal. The carbonized leaf powder has been proven as an effective adsorbent material in removing aqueous Cu(II) because of its relative high specific surface area and inherent beneficial groups such as amine, carboxyl and phosphate after carbonization process. Factors affecting the adsorption of Cu(II) include: adsorbent dosage, initial Cu(II) concentration, solution pH, temperature and duration. The kinetics data fit well with the pseudo-first order kinetics and the pseudo-second order kinetics model. The thermodynamic behavior reveals the endothermic and spontaneous nature of the adsorption. The adsorption isotherm curve fits Sips model well, and the adsorption capacity was determined at 61.77 mg/g. Based on D-R model, the adsorption was predominated by the form of physical adsorption under lower temperatures, while the increased temperature motivated the form of chemical adsorption such as ion-exchange reaction. According to the analysis towards the mechanism, the chemical adsorption process occurs mainly among amine, carbonate, phosphate and copper ions or other surface adsorption. This hypothesis is confirmed by FT-IR test and XRD spectra as well as the predicted parameters calculated based on D-R model.

• Journal of the Society of Cosmetic Scientists of Korea
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• v.32 no.1 s.55
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• pp.45-51
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• 2006

In the field of makeup cosmetics, especially, powder-based foundations such as two-way cake, pact and face powder, the quality of which is known to be strongly influenced by the properties of powder, surface treatment technology is widely used as a method to improve the various characteristics of powder texture, wear properties, dispersion ability and so on. The two-way cake or pressed-powder foundation is one of the familiar makeup products in Asian market for deep covering and finishing purpose. In spite of the relent progress in surface modification method such as composition of powders with different characteristics and application of a diversity of coating ingredient (metal soap, amino acid, silicone and fluorine), this product possess a technical difficulty to enhance both of the adhesion power and spreadability on the skin in addition to potential claim of consumer about heavy or thick feeling. This article is covering the preparation and coating method of nano-vesicle that mimic the double-layered lipid lamellar structure existing between the corneocytes of the stratum corneum in the skin for the purpose of improving both of two important physical characteristic of two-way cake, spreadability and adhering force to skin, and obtining better affinity to skin. Nano-vesicle was prepared using the high-pressure emulsifying process of lecithin, pseudo ceramide, butylene glycol and tocopheryl acetate. This nano-sized emulsion was added to powder-dispersed aqueous phase together with bivalent metal salt solution and then the filtering and drying procedure was followed to yield the nano-vesicle coated powder. The amount of nano-vesicle coated on the powder was able to regulated by the concentration of metal salt and this novel powder showed the lower friction coefficient, more uniform condition of application and higher adhesive powder comparing with the alkyl silane treated powder from the test result of spreadability and wear properties using friction meter and air jet method. Two-wav cake containing newly developed coated powder with nano-vesicle showed the similar advantages in the frictional and adhesive characteristics.

• Journal of Powder Materials
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• v.23 no.3
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• pp.213-220
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• 2016

In this study, bulk nickel-carbon nanotube (CNT) nanocomposites are synthesized by a novel method which includes a combination of ultrasonication, electrical explosion of wire in liquid and spark plasma sintering. The mechanical characteristics of the bulk Ni-CNT composites synthesized with CNT contents of 0.7, 1, 3 and 5 wt.% are investigated. X-ray diffraction, optical microscopy and field emission scanning electron microscopy techniques are used to observe the different phases, morphologies and structures of the composite powders as well as the sintered samples. The obtained results reveal that the as-synthesized composite exhibits substantial enhancement in the microhardness and values more than 140 HV are observed. However an empirical reinforcement limit of 3 wt.% is determined for the CNT content, beyond which, there is no significant improvement in the mechanical properties.

• Proceedings of the KWS Conference
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• 2002.10a
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• pp.545-550
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• 2002

In order to ensure the signal could be transported cocrrectly, the microwave devices made of Aluminmn alloys must be assembled and brazed flaw-freely. In this paper, a new approach of using contact reactive brazing (CRB) process to realize the compact brazing of Aluminum alloys was put forward. The reason for this is that CRB, which realizes bonding depending on the liquid alloy produced by metallurgy reaction between the materials to be joined, overcomes the limitation of traditional brazing that the macroscopically disorganized filling flow of liquid filler metal would result in defects in brazed seam. Joint ofLF21 (AA3003) with the compactness of over 95% was brazed by the method of CRB using Si powder as an interlayer. At last, the influence of the physical parameter related to the Si powder interlayer on the compactness of the joints was investigated in detail.

• Bulletin of the Korean Chemical Society
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• v.26 no.4
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• pp.594-598
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• 2005

Treatment of a solution of $CuCl_2$ in dimethyl phosphate (DMP) with DMSO under nitrogen atmosphere afforded to a light blue fluorescence powder. Slow evaporation of $H_2O$-DMSO solution of this powder resulted in blue-sky crystals of a new polymeric Cu(II) complex, with a unit cell composed of $Cu_2(DMP)_4$(DMSO), (1). The crystal and molecular structure of the complex acquired crystallographically. Compound (1) crystallizes in the monoclinic space group $P2_1$/n with a = 12.8920(11) $\AA$, b = 13.1966(11) $\AA$, c = 14.7926(13) $\AA$, $\alpha$ = 90$^{\circ}$, $\beta$ = 98.943(2)$^{\circ}$, $\gamma$ = 90$^{\circ}$, V= 2486.1(4) ${\AA}^3$, and Z = 4. A square pyramidal environment for the metal center was established by coordination of oxygen atoms of four bridging DMP ligands in the basal positions and binding a tri-centered oxygen atom of DMSO in the apical disposition of Cu(II). The sixth position was also affected by a weak interaction with the sulfur atom of another DMSO. The phosphorous atom in the bridging DMP was arranged in a deformed tetrahedron with (gg) conformation for methyl esters with $C_{2v}$ symmetry.

• ETRI Journal
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• v.33 no.6
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• pp.864-870
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• 2011

As an isotropic conductive adhesive, that is, a hybrid Cu paste composed of Cu powder, solder powder, and a fluxing resin system, has been quantitatively characterized. The mechanism of an electrical connection based on a novel concept of electrical conduction is experimentally characterized using an analysis of a differential scanning calorimeter and scanning electron microscope energy-dispersive X-ray spectroscopy. The oxide on the metal surface is sufficiently removed with an increase in temperature, and intermetallic compounds between the Cu and melted solder are simultaneously generated, leading to an electrical connection. The reliability of the hybrid Cu paste is experimentally identified and compared with existing Ag paste. As an example of a practical application, the hybrid Cu paste is used for LED packaging, and its electrical and thermal performances are compared with the commercialized Ag paste. In the present research, it is proved that, except the optical function, the electrical and thermal performances are similar to pre-existing Ag paste. The hybrid Cu paste could be used as an isotropic conductive adhesive due to its low production cost.

• Journal of Powder Materials
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• v.29 no.3
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• pp.233-239
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• 2022

Aluminum alloys are extensively employed in several industries, such as automobile, aerospace, and architecture, owing to their high specific strength and electrical and thermal conductivities. However, to meet the rising industrial demands, aluminum alloys must be designed with both excellent mechanical and thermal properties. Computer-aided alloy design is emerging as a technique for developing novel alloys to overcome these trade-off properties. Thus, the development of a new experimental method for designing alloys with high-throughput confirmation is gaining focus. A new approach that rapidly manufactures aluminum alloys with different compositions is required in the alloy design process. This study proposes a combined approach to rapidly investigate the relationship between the microstructure and properties of aluminum alloys using a direct energy deposition system with a dual-nozzle metal 3D printing process. Two types of aluminum alloy powders (Al-4.99Si-1.05Cu-0.47Mg and Al-7Mg) are employed for the 3D printing-based combined method. Nine types of Al-Si-Cu-Mg alloys are manufactured using the combined method, and the relationship between their microstructures and properties is examined.

• Journal of Korea Foundry Society
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• v.22 no.5
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• pp.265-270
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• 2002

A novel jewelry master pattern manufacturing process which reduce manufacturing steps by employing a Duraform rapid prototyping mold and a low melting alloy has been suggested. The novel process follows the steps of 'jewelry 3D CAD design ${\rightarrow}$ Durafrom RP mold ${\rightarrow}$ low melting alloy master pattern' while the previous process follows more complicated steps of 'jewelry idea sketch ${\rightarrow}$ detailed drawing ${\rightarrow}$ wax carving ${\rightarrow}$ flask ${\rightarrow}$ silver master pattern.' An upper and a lower part of molds have been manufactured of Duraform powder, of which melting point is $190^{\circ}C$. A maser pattern was manufactured by pouring a low melting alloy of Pb-Sn-Bi-Cd, so called Woods Metal, of which melting point is $70^{\circ}C$, into the mold. The master pattern is a shape of a disk of 20mm diameter that contains various design factors. The variations of dimensions, surface roughness, surface pore ratio were measured by an optical microscope, a surface roughness profilometer, and a Rockwell hardness tester. The pattern made of were maeasured by an optical microscope, a surface roughness profilometer, and a Rockwell hardness tester. The pattern made of low melting alloy has sufficient surface hardness, and surface pore ratio to be used as the jewelry master pattern.