• Composites Research
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• v.30 no.3
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• pp.181-187
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• 2017

The effect of nanoscopic and microscopic Fe, $Fe_3O_4$, and Ni particles and their shapes and substrate materials on the heating behavior of thermoplastic polyurethane (TPU) adhesive films was investigated via induction heating. The heat generation tendency of $Fe_3O_4$ particles was higher than that shown by Fe and Ni particles in the TPU adhesive films. When the Fe and Ni particle size was larger than the penetration skin depth, the initial heating rate and maximum temperature increased with an increase in the particle size. This is attributed to the eddy current heat loss. The heating behavior of the TPU films with Ni particles of different shapes was examined, and different hysteresis heat losses were observed depending on the particle shape. Consequently, the flake-shaped Ni particles showed the most favorable heat generation because of the largest hysteresis loss. The substrate materials also affected the heating behavior of the TPU adhesive films in an induction heating system, and the thermal conductivity of the substrate materials was determined to be the main factor affecting the heating behavior.

• Journal of the Korean Vacuum Society
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• v.16 no.5
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• pp.322-329
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• 2007

The interaction of oxygen with the ordered $Ni_3Al(111)$ alloy surface at 800 K and 1000 K has been investigated using LEED, STM, HREELS, UPS, and PAX. The clean $Ni_3Al(111)$ surface exhibits a "$2{\times}2$" LEED pattern corresponding to the ordered bulk-like terminated surface structure. For an adsorption of oxygen at 800 K, LEED shows an unrelated oxygen induced superstructure with a lattice spacing of $2.93\;{\AA}$ in addition to the ($1{\times}1$) substrate spots. The combined HREELS and the UPS data point to an oxygen chemisorption on threefold aluminum sites while PAX confirms an islands growth of the overlayer. Since such sites are not available on the $Ni_3Al(111)$ surface, we conclude the buildup of an oxygen covered aluminum overlayer. During oxygen exposure at 1000 K, however, we observe the growth of ${\gamma}'-Al_2O_3$ structure on the reordered $Ni_3Al(111)$ substrate surface. This structure has been identified by means of HREELS and STM. The HREELS data will show that at 800 K the oxidation shows a very characteristic behavior that cannot be described by the formation of an $Al_2O_3$ overlayer. Moreover, the STM image shows a "Strawberry" structure due to the oxide islands formation at 1000 K. Conclusively, from the oxygen interaction with $Ni_3Al(111)$ alloy surface at 800 K and 1000 K an islands growth of the aluminum oxide overlayer has been found.

• Journal of the Korean Magnetics Society
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• v.9 no.5
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• pp.245-250
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• 1999

The effect of substrate and oxidization time on $substrate /Py/Al_2O_3/Co\;(Py=Ni_{81}Fe_{19})$ tunnel junction was studied. Samples were prepared without breaking vacuum by changing shadow masks in-situ. The resistance of tunnel junctions increased, but measured MR decreased with oxidization time. Negative MR observed for samples of tunnel resistivity lower than 0.17 M$\Omega$ $({\mu}m)^2$. MR resistivity decreased with the change of substrates in the order of thermally oxidized Si(111), Si(100), Coring Glass 2948, Corning Glass 7059. Sign change and the variation of MR was explained with non uniform current effect.

• Journal of the Korean Society of Combustion
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• v.8 no.2
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• pp.27-33
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• 2003

Synthesis of carbon nanomaterials on a metal substrate by an ethylene fueled inverse diffusion flame was illustrated. Stainless steel plates were used for the catalytic metal substrate. The effects of catalyst metal particles were investigated through $Fe(NO_3){_3}$ (ferric nitrate, nonahydrate) and $Ni(NO_3){_2}$ (nickel nitrate, hexahydrate). Carbon nanotubes and nanofibers with diameters of $30{\sim}70nm$ were found on the substrate for the case of using SUS304 substrates only and using them with metal nitrates. In case of using metal nitrates, due to the easy activation of the metal particles, the formation and growth of carbon nanomaterials were occurred in the lower temperature region than that of using SUS304 substrates only.

• Proceedings of the Korean Vacuum Society Conference
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• 2016.02a
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• pp.156.1-156.1
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• 2016

Nickel sulfide (NiS) is one of the most promising candidates as an electrode material for supercapacitors due to its good capacitive properties, high electrical conductivity and low cost. In addition to the development of the new electrode materials, nanostructuring the electrode surface is one of the main issues in enhancing the capacitive performance of the supercapacitors because the increased surface area can improve the charge transfer and energy storage processes occurring at the electrode surface. However, most nanofabrication techniques require complicated and delicate nanoprocesses, and hence are not suitable for practical use. In this work, we developed a simple method to fabricate nanostructured NiS electrodes by depositing NiS onto $TiO_2$ nanoparticles. First, $TiO_2$ nanoparticles were spin-coated on a fluorine-doped tin oxide (FTO) substrate, and then NiS layers were deposited onto the $TiO_2$ nanoparticles by consecutive dip-coatings in the solutions containing nickel and sulfur precursors. This nanostructured NiS electrode showed significantly improved capacitive properties compared to the electrode of NiS films deposited without $TiO_2$ nanoparticles. The asymmetric full-cell supercapacitor with this nanostructured NiS electrode and activated carbon electrode was also fabricated and investigated.

• Transactions on Electrical and Electronic Materials
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• v.9 no.4
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• pp.137-142
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• 2008

The parasitic resistance is studied to silicon/metal contact junction for improving device performance and to lower contact/serial resistance silicide in natural sequence. In this paper constructs the stepwise Ni silicide process for parasitic resistance reduction for silicon/metal contact junction. We have investigated multi-step Ni silicide on SiGe substrate with stepwise annealing method as an alternative to compose more thermally reliable Ni silicide layer. Stepwise annealing for silicide formation is exposed to heating environment with $5^{\circ}C/sec$ for 10 seconds and a dwelling for both 10 and 30 seconds, and ramping-up and the dwelling was repeated until the final annealing temperature of $700\;^{\circ}C$ is achieved. Finally a direct comparison for single step and stepwise annealing process is obtained for 20 nm nickel silicide through stepwise annealing is $5.64\;{\Omega}/square$ at $600\;^{\circ}C$, and it is 42 % lower than that of as nickel sputtered. The proposed stepwise annealing for Ni silicidation can provide the least amount of NiSi at the interface of nickel silicide and silicon, and it provides lower resistance, higher thermal-stability, and superior morphology than other thermal treatment.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.21 no.1
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• pp.29-34
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• 2008

In this paper, we investigated electrical and physical characteristics of nickel silicide using rare-earth metals(Er, Yb, Tb, Dy), Incorporated Ytterbium into Ni-silicide is proposed to reduce work function of Ni-silicide for nickel silicided schottky barrier diode (Ni-silicided SBD). Nickel silicide makes ohmic-contact or low schottky barrier height with p-type silicon because of similar work function (${\phi}_M$) in comparison with p-type silicon. However, high schottky barrier height is formed between Ni-silicide and p-type substrate by depositing thin ytterbium layer prior to Ni deposition. Even though the ytterbium is deposited below nickel, ternary phase $Yb_xN_{1-x}iSi$ is formed at the top and inner region of Ni-silicide, which is believed to result in reduction of work function about 0.15 - 0.38 eV.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2002.05a
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• pp.183-188
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• 2002

With the contact pad consisted of $0.5{\mu}{\textrm}{m}$ $Au/5{\mu}{\textrm}{m}$ Ni/Cu layers on a conventional ball grid array(BGA) substrate, metallurgical reaction properties between the pad and In-15(wt.%)Pb-5Ag solder alloy were studied after reflow and solid aging. In as-reflow condition, thin AuIn$_2$or Ni$_{28}$In$_{72}$ intermetallic layer was formed at the solder/pad interface according to reflow time. Dissolution of the Au layer into the molten solder was remarkably limited in comparison with eutectic Sn-37Pb alloy. After solid aging of 300 hrs, thickness of In-Ni layer increased to about $2{\mu}{\textrm}{m}$ in the both as-reflow case. It was observed that In atoms diffuse through the AuIn$_2$phase to react with underlaying Ni layer. The metallurgical reaction properties between In-l5Pb-7Ag alloy and Au/Ni surface finish were analysed to result in suppression of Au-embrittlement in the solder joints.

• Bulletin of the Korean Chemical Society
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• v.33 no.12
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• pp.3993-3997
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• 2012

Three-dimensional porous nickel foam was used as a current collector to prepare a Co-Ni oxide/Ni foam electrode for a supercapacitor. The synthesized Co-Ni oxide was proven to consist of mixed oxide phases of $Co_3O_4$ and NiO. The Co-Ni oxide/Ni foam electrode prepared was characterized by morphological observation, crystalline property analysis, cyclic voltammetry, and impedance spectroscopy. Cyclic voltammetry for the electrode showed high specific capacitances, such as 936 F $g^{-1}$ at 5 mV $s^{-1}$ and 566 F $g^{-1}$ at 200 mV $s^{-1}$, and a comparatively good cycle performance. These improved results were mainly due to the dimensional stability of the nickel foam and its high electrical contact between the electrode material and the current collector substrate.

• Journal of Surface Science and Engineering
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• v.28 no.3
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• pp.142-151
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• 1995

In this research, a thin layer of Cr was coated on the pure Ni and Inconel 601 by PECVD (Plasma Enhanced Chemical Vapor Deposition) in order to study the effect of Cr on the oxidation behavior at high temperature. Cr coated Inconel 601, which was oxidized at $1100^{\circ}C$ for 24 hours, formed a protective $Cr_2O_3$ oxide layer and the resistance to isothermai oxidation was improved. On the other hand, oxidation resistance of Cr coated Inconel 601 at 100$0^{\circ}C$ was not significantly improved, probably due to the formation or insufficient $Cr_2O_3$ layer. But, when oxidized at $1000^{\circ}C$ and $1100^{\circ}C$ for 100 hours, Cr coated Inconel 601 improved isothermal oxidation resistance by the formation of continuous $Cr_2O_3$ external scale and by the development of $Al_2O_3$ subscales. Cr coated Ni formed inner layer of $Cr_2O_3$ within almost pure NiO, which provided additional cation vacancies, thus increasing the mobility of Ni ions in this region. It is believed that this doping effect resulted in an increase in the observed oxidation rate compared with pure Ni and did not improve the oxidation resistance.