• Title/Summary/Keyword: Ni$_3$B

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The Electrochemical Behavior of Ni-base Metallic Glasses Containing Cr in H2SO4 Solutions

  • Arab, Sanaa.T.;Emran, Khadijah.M.;Al-Turaif, Hamad A.
    • Journal of the Korean Chemical Society
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    • v.56 no.4
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    • pp.448-458
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    • 2012
  • In order to develop alloy resistance in aggressive sulphat ion, the corrosion behavior of metallic glasses $Ni_{92{\cdot}3}Si_{4.5}B_{32}$, $Ni_{82,3}Cr_7Fe_3Si_{4.5}B_{3.2}$ and $Ni_{75.5}Cr_{13}Fe_{4.2}Si_{4.5}B_{2.8}$ (at %) at different concentrations of $H_2SO_4$ solutions was examined by electrochemical methods and Scanning Electron Microscope (SEM) and X-ray Photoelectron Microscopy (XPS) analyses. The corrosion kinetics and passivation behavior was studied. A direct proportion was observed between the corrosion rate and acid concentration in the case of $Ni_{92{\cdot}3}Si_{4.5}B_{32}$ and $Ni_{75.5}Cr_{13}Fe_{4.2}Si_{4.5}B_{2.8}$ alloys. Critical concentration was observed in the case of $Ni_{82,3}Cr_7Fe_3Si_{4.5}B_{3.2}$ alloy. The influence of the alloying element is reflected in the increasing resistance of the protective film. XPS analysis confirms that the protection film on the $Ni_{92{\cdot}3}Si_{4.5}B_{32}$ alloy was NiS which is less protective than that formed on Cr containing alloys. The corrosion rate of $Ni_{82,3}Cr_7Fe_3Si_{4.5}B_{3.2}$ and $Ni_{75.5}Cr_{13}Fe_{4.2}Si_{4.5}B_{2.8}$. alloys containing 7% and 13% Cr are $7.90-26.1{\times}10^{-3}$ mm/y which is lower about 43-54 times of the alloy $Ni_{92{\cdot}3}Si_{4.5}B_{32}$ (free of Cr). The high resistance of $Ni_{75.5}Cr_{13}Fe_{4.2}Si_{4.5}B_{2.8}$ alloy at the very aggressive media may due to thicker passive film of $Cr_2O_3$ which hydrated to hydrated chromium oxyhydroxide.

Phase Transformation by Cu Diffusion of Electrolessly Deposited Ni-B Diffusion Barrier for Cu Interconnect (Cu 미세 배선을 위한 무전해 Ni-B 확산 방지막의 Cu 확산에 따른 상변태 거동)

  • Choi J. W.;Hwang G. H.;Song J. H.;Kang S. G.
    • Korean Journal of Materials Research
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    • v.15 no.11
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    • pp.735-740
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    • 2005
  • The phase transformation of Ni-B diffusion barrier by Cu diffusion was studied. The Ni-B diffusion barrier, thickness of 10(Inn, was electrolessly deposited on the electroplated Cu interconnect. The specimens were annealed either in Ar atmosphere or in $H_2$ atmosphere from $300^{\circ}C\;to\;800^{\circ}C$ for 30min, respectively. Although the Ni-B coated specimens showed the decomposition of $Ni_3B$ above $400^{\circ}C$ in both Ar atmosphere and $H_2$ atmosphere, Ni-B powders did not show the decomposition of $Ni_3B$. The $Ni_3B$ was decomposed to Ni and B in hi atmospherr: and the metallic Ni formed the solid solution with Cu and the free B was oxidized to $B_2O_3$. However, both the boron hydride and free B were not observed in the diffusion barrier after the annealing in $H_2$ atmos There. These results revealed that the decomposition of $Ni_3B$ by Cu made the Cu diffusion continued toward the Ni-B diffusion barrier.

A Study on Synthesis of Ni-Ti-B Alloy by Mechanical Alloying from Elemental Component Powder

  • Kim, Jung Geun;Park, Yong Ho
    • Journal of Powder Materials
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    • v.23 no.3
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    • pp.202-206
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    • 2016
  • A Ni-Ti-B alloy powder prepared by mechanical alloying (MA) of individual Ni, Ti, and B components is examined with the aim of elucidating the phase transitions and crystallization during heat treatment. Ti and B atoms penetrating into the Ni lattice result in a Ni (Ti, B) solid solution and an amorphous phase. Differential thermal analysis (DTA) reveals peaks related to the decomposition of the metastable Ni (Ti, B) solid solution and the separation of equilibrium $Ni_3Ti$, $TiB_2$, and ${\tau}-Ni_20Ti_3B_6$ phases. The exothermal effects in the DTA curves move to lower temperatures with increasing milling time. The formation of a $TiB_2$ phase by annealing indicates that the mechanochemical reaction of the Ni-Ti-B alloy does not comply with the alloy composition in the ternary phase diagram, and Ti-B bonds are found to be more preferable than Ni-B bonds.

Influence of B Content on Properties of Ni-B Electrodeposit (전기도금법에 의해 생성된 Ni-B 합금도금층의 물성에 미치는 B 함량의 영향)

  • 이규환;장도일;권식철
    • Journal of the Korean institute of surface engineering
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    • v.37 no.4
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    • pp.208-214
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    • 2004
  • The influence of the boron content on the various properties of Ni-B alloy films produced by electrodeposition was investigated. The considerable reduction in grain size was observed with increasing boron content. The internal stress was tensile and increased linearly with increasing boron content. Hardness increased up to $750H_{v}$ at 2 at% boron and then kept the value to 11 at% boron for as-plated Ni-B coatings. The hardness of Ni-B films increased up to $1,250H_{v}$ due to the intermetallic$ Ni_3$B precipitation by the heat treatment, and maximum hardness of each coating increases with boron content. Wear resistance decreased with increasing the boron content because of high friction coefficient and brittle fracture of film which has higher content of boron.

Effect of Surfactant in Electroless Ni-B Plating for Coating on the Diamond Powder (다이아몬드 분말상에 무전해 Ni-B 도금을 위한 계면활성제의 영향)

  • Yang, Changyol;Yu, Si-Young;Moon, Hwan-Gyun;Lee, Jung-Ho;Yoo, Bongyoung
    • Journal of the Korean institute of surface engineering
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    • v.50 no.3
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    • pp.177-182
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    • 2017
  • The properties of electroless Ni-B thin film on diamond powder with different parameters (temperature, pH, surfactant etc.) were studied. The surface morphology, structure and composition distribution of the Ni-B film were observed by field effect scanning electron microscope (FE-SEM), energy-dispersive spectrometer (EDS), X-ray diffraction (XRD) and Auger electron spectroscopy (AES). The growth rate of Ni-B film was increased with increase of bath temperature. The B content in Ni-B film was reduced with increase of bath pH. As a result the structure of Ni-B film was changed from amorphous to crystalline structure. The PVP in solution plays multi-functional roles as a dispersant and a stabilizer. The Ni-B film deposited with adding 0.1 mM-PVP was strongly introduced an amorphous structure with higher B content (25 at.%). Also the crystallite size of Ni-B film was reduced from 12.7 nm to 5.4 nm.

A Study on the Width of Liquid Layer of Ni/B/Ni Diffusion Bonding System (Ni/B/Ni 액상확산접합계의 액상폭에 관한 연구)

  • ;;Kang, C. S.
    • Journal of Welding and Joining
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    • v.13 no.4
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    • pp.147-154
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    • 1995
  • In order to study the bonding mechanism of Ni/B/Ni transient liquid phase bonding system, width of liquid layers were calculated, where in this system melting point of insert material(B) is higher than bonding temperature and melting point of base metal(Ni). Caclulated values were compared with experimental ones which were measured by bonding Ni/B/Ni system at 1433-1474K under vacuum atmosphere. As results, the width of initial liquid layer of Ni/B/Ni system was calculated as $W_{IL}$ = $W_{o}$[1 + {2.100..rho.$_{S/}$ ( $X_{3}$ + $X_{4}$)..rho.$_{Ni}$ }-.rho.$_{S/}$.rho. Ni/], and it was nearly same with experimental values. Maximum width of liquid layer, width of liquid layer during isothermal solidification and isothermal solidification time were calculated also.o.o.o.

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Effect of Brazing Condition on Tensile Properties in Brazing Joints of Inconel-625/Ni-201 Using MBF-30 (MBF-30을 사용한 Inconel-625/Ni-201 브레이징 접합부의 인장성질에 미치는 접합조건의 영향)

  • Yu, Jeong-Woo;Park, Sang-Hyun;Kim, Chang-Su;Kang, Chung-Yun
    • Journal of Welding and Joining
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    • v.30 no.6
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    • pp.106-112
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    • 2012
  • This study was carried out to investigate the effect of bonding temperature and holding time on microstructure and mechanical properties in brazing joints of Ni-base superalloy using MBF-30 (Ni-4.5Si-3.2B [wt.%]). The heating rate was $20^{\circ}C$/min to the bonding temperatures $1050^{\circ}C$, $1070^{\circ}C$, $1090^{\circ}C$ under high vacuum condition. The holding times were 100s, 400s, 900s and 1600s. $Ni_3B$ phases and proeutectic Ni were observed in the interlayer of Ni-201. Then, Ni3B and Ni3Si were found in the middle region of brazing joint. Cr-boride phase appeared in the interlayer of Inconel-625. Tensile strength and elongation were decreased at $1050^{\circ}C$-1600s, $1070^{\circ}C$-900s and $1090^{\circ}C$-400s. After observation the fracture specimens, There was Ni3B which is very brittle phase in the grain boundary of Ni201.

Effect of Addition of Other Componene (B4C, Mn, TiB2, B) on TiC-Ni3Al Cermet (TiC-Ni3Al Cermet에 타성분(B4C, Mn, TiB2, B) 첨가의 영향)

  • 김지헌;이완재
    • Journal of Powder Materials
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    • v.9 no.5
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    • pp.352-358
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    • 2002
  • The effects of boron or manganese added as $B_4C$, Mn, $TiB_2$, B on TiC-30vo1.%$Ni_3Al$ cermet sintered at 1380 and $1400^{\circ}C$ for 1 hour, were examined in relation with shrinkage, relative density, microstructure, lattice parameter, hardness and fracture toughness ($K_{IC}$). The results are summarized as follows: 1) The highest shrink-age showed about 30.5% in the specimen added B$_4$C and the maximum relative density was about 99% in the specimen added $TiB_2$; 2) The grains of TiC were grown during sintering and made the surrounding structure by adding boron and manganese. The largest grain size showed about $2.8\mutextrm{m}$ in the specimen with boron sintered at $1400^{\circ}C$;3) The lattice parameter of TiC was about $4.325\AA$ and $Ni_3Al$ about $3.592\AA$ by adding other elements; 4) The highest hardness was about $1100kgf/\textrm{mm}^2$ in the specimen with B4C; 5) The fracture toughness ($K_{IC}$) showed about $15MNm^{-3/2}$ in the specimen added $TiB_2$.

Phase Transformation and Reversible Shape Memory Effect of Ti-Ni-Cu Alloys (Ti-Ni-Cu 합금의 상변태 및 가역형상기억효과)

  • Hong, S.W.;Lee, O.Y.;Kim, D.K.
    • Journal of the Korean Society for Heat Treatment
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    • v.5 no.3
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    • pp.149-156
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    • 1992
  • Transformation behavior and reversible shape memory effct of Ti-Ni-Cu alloys with various Cu content has been investigated by means of electrical resistivity measurement, differential scanning calorimetry. X-ray diffraction and strain gage sensor. The transformation sequence in Ti-Ni-Cu alloys substituted by Cu for Ni up to 5at.% occurs to $B2{\leftrightarrow}B19^{\prime}$ and it proceeds in two stages by addition of 10 at.%Cu. i.e. $B2{\leftrightarrow}B19{\leftrightarrow}B19^{\prime}$. But the content of Cu increases up to 20at.%, it has been transformed in one stage ; $B2{\leftrightarrow}B19$. The shape change of Ti-40Ni-10Cu alloy which was constrain aged in circular form bended in $B2{\leftrightarrow}B19$ transformation but it spreaded out in $B19{\leftrightarrow}B19^{\prime}$ transformation. The amount of reversible shape change (${\Delta}{\varepsilon}$) of Ti-47Ni-3Cu alloy constrain aged at $400^{\circ}C$ after solution treatment has a maximum value of about $5.6{\times}10^{-3}$, but that of cold rolled and constrain aged specimens exhibits a little value independent of Cu concentrations.

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Characteristics of Magnetic Tunnel Junctions Comprising Ferromagnetic Amorphous NiFeSiB Layers (강자성 비정질 NiFeSiB 자유층을 갖는 자기터널접합의 스위칭 특성)

  • Hwang, J.Y.;Rhee, S.R.
    • Journal of the Korean Magnetics Society
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    • v.16 no.6
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    • pp.279-282
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    • 2006
  • Magnetic tunnel junctions (MTJs), which consisted of amorphous ferromagnetic NiFeSiB free layers, were investigated. The NiFeSiB layers were used to substitute for the traditionally used CoFe and/or NiFe layers with the emphasis being given to obtaining an understanding of the effect of the amorphous free layer on the switching characteristics of the MTJs. $Ni_{16}Fe_{62}Si_{8}B_{14}$ has a lower saturation magnetization ($M_{s}:\;800\;emu/cm^{3}$) than $Co_{90}Fe_{10}$ and a higher anisotropy constant ($K_{u}:\;2700\;erg/cm^{3}$) than $Ni_{80}Fe_{20}$. The $Si/SiO_{2}/Ta$ 45/Ru 9.5/IrMn 10/CoFe $7/AlO_{x}/CoFeSiB\;(t)/Ru\;60\;(in\;nanometers)$structure was found to be beneficial for the switching characteristics of the MTJ, leading to a reduction in the coercivity ($H_{c}$) and an increase in the sensitivity resulted from its lower saturation magnetization and higher uniaxial anisotropy. Furthermore, by inserting a very thin CoFe layer at the tunnel barrier/NiFeSiB interface, the TMR ratio and switching squareness were improved more with the increase of NiFeSiB layer thickness up to 11 nm.