Phase Transformation by Cu Diffusion of Electrolessly Deposited Ni-B Diffusion Barrier for Cu Interconnect |
Choi J. W.
(Div. of Materials Science and Engineering, hanyang Univ.)
Hwang G. H. (Div. of Materials Science and Engineering, hanyang Univ.) Song J. H. (Div. of Materials Science and Engineering, hanyang Univ.) Kang S. G. (Div. of Materials Science and Engineering, hanyang Univ.) |
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