Browse > Article
http://dx.doi.org/10.5695/JKISE.2017.50.3.177

Effect of Surfactant in Electroless Ni-B Plating for Coating on the Diamond Powder  

Yang, Changyol (Department of Materials and Chemical Engineering, Hanyang University)
Yu, Si-Young (Iljin Diamond Co., Ltd.)
Moon, Hwan-Gyun (Iljin Diamond Co., Ltd.)
Lee, Jung-Ho (Department of Materials and Chemical Engineering, Hanyang University)
Yoo, Bongyoung (Department of Materials and Chemical Engineering, Hanyang University)
Publication Information
Journal of the Korean institute of surface engineering / v.50, no.3, 2017 , pp. 177-182 More about this Journal
Abstract
The properties of electroless Ni-B thin film on diamond powder with different parameters (temperature, pH, surfactant etc.) were studied. The surface morphology, structure and composition distribution of the Ni-B film were observed by field effect scanning electron microscope (FE-SEM), energy-dispersive spectrometer (EDS), X-ray diffraction (XRD) and Auger electron spectroscopy (AES). The growth rate of Ni-B film was increased with increase of bath temperature. The B content in Ni-B film was reduced with increase of bath pH. As a result the structure of Ni-B film was changed from amorphous to crystalline structure. The PVP in solution plays multi-functional roles as a dispersant and a stabilizer. The Ni-B film deposited with adding 0.1 mM-PVP was strongly introduced an amorphous structure with higher B content (25 at.%). Also the crystallite size of Ni-B film was reduced from 12.7 nm to 5.4 nm.
Keywords
Diamond wire saw; Diamond powder; Electroless deposition; Reducing agent; Complexing agent; Dispersant; Surfactant etc;
Citations & Related Records
Times Cited By KSCI : 2  (Citation Analysis)
연도 인용수 순위
1 H. Li, H. Li, W. L. Dai, W. Wang, Z. Fang, J. F. Deng, XPS studies on surface electronic characteristics of Ni-B and Ni-P amorphous alloy and its correlation to their catalytic properties, Appl. Surf. Sci., 152 (1999) 25-34.   DOI
2 J. G. Ahn, D. J. Kim, H. T. Hai, J. R. Lee, I. K. Lee, H. S. Chung, Characteristics of Nickel-Diamond Composite Powders by Electroless Nickel Plating, J. Korean Powder Metall. Inst., 11(3) (2004) 224-232.   DOI
3 M. Paunovic, M. Schlesinger, Fundamentals of Electrochemical Deposition, John Wiley, second Ed, Wiley, New Jersey, (2006) 153-155.
4 G. O. Mallory, Electroless Plating, William Andrew, first Ed, AESF, New York, (1990) 88-93.
5 C. R. Lee, H. D. Park, S. G. Kang, A study on Electroless Ni-B Plating with DMAB as Reducing Agent, J. Korean inst. surf. Eng., 32(2) (1999) 172-181.
6 T. Watanabe, Nano-Plating, first Ed, Elsevier, Tokyo, (2004) 659-664.
7 H. S. Chu, D. K. Kim, A study on the Functional Electroless Ni plating for Controlled Morphology on the CBN Powder, J. Korean inst. surf. Eng., 41(6) (2008) 312-324.   DOI
8 S. Q. Guo, L. F. Hou, C. L. Guo, Y. H. Wei, Characteristics and corrosion behavior of nickel-phosphorus coatings deposited by a simplified bath, Mater. Corros., 4 (2017) 68.
9 Q. L. Rao, G. Bi, Q. H. Lua, H. W. Wang, X.L. Fan, Microstructure evolution of electroless Ni-B film during its deposition process, Appl. Surf. Sci., 240 (2005) 28-33.   DOI
10 A. Bidiville, K. Wasmer, R. Kraft, C. Ballif, Diamond Wire-Sawn Silicon Wafers from the Lab to the Cell Production, Proceedings of 24th European Photovoltaic Solar Energy Conference and Exhibition, Hamburg, Germany (2009) 1297-1302.
11 ITRPV 2016, International Technology Roadmap for Photovoltaic (ITRPV), Results 2015, Seventh Edition (2016) 2-19.