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Effect of Surfactant in Electroless Ni-B Plating for Coating on the Diamond Powder

다이아몬드 분말상에 무전해 Ni-B 도금을 위한 계면활성제의 영향

  • Yang, Changyol (Department of Materials and Chemical Engineering, Hanyang University) ;
  • Yu, Si-Young (Iljin Diamond Co., Ltd.) ;
  • Moon, Hwan-Gyun (Iljin Diamond Co., Ltd.) ;
  • Lee, Jung-Ho (Department of Materials and Chemical Engineering, Hanyang University) ;
  • Yoo, Bongyoung (Department of Materials and Chemical Engineering, Hanyang University)
  • 양창열 (한양대학교 첨단신소재공학과) ;
  • 유시영 (일진다이아몬드) ;
  • 문환균 (일진다이아몬드) ;
  • 이정호 (한양대학교 첨단신소재공학과재료화학공학과) ;
  • 유봉영 (한양대학교 첨단신소재공학과재료화학공학과)
  • Received : 2017.05.03
  • Accepted : 2017.05.22
  • Published : 2017.06.30

Abstract

The properties of electroless Ni-B thin film on diamond powder with different parameters (temperature, pH, surfactant etc.) were studied. The surface morphology, structure and composition distribution of the Ni-B film were observed by field effect scanning electron microscope (FE-SEM), energy-dispersive spectrometer (EDS), X-ray diffraction (XRD) and Auger electron spectroscopy (AES). The growth rate of Ni-B film was increased with increase of bath temperature. The B content in Ni-B film was reduced with increase of bath pH. As a result the structure of Ni-B film was changed from amorphous to crystalline structure. The PVP in solution plays multi-functional roles as a dispersant and a stabilizer. The Ni-B film deposited with adding 0.1 mM-PVP was strongly introduced an amorphous structure with higher B content (25 at.%). Also the crystallite size of Ni-B film was reduced from 12.7 nm to 5.4 nm.

Keywords

References

  1. ITRPV 2016, International Technology Roadmap for Photovoltaic (ITRPV), Results 2015, Seventh Edition (2016) 2-19.
  2. A. Bidiville, K. Wasmer, R. Kraft, C. Ballif, Diamond Wire-Sawn Silicon Wafers from the Lab to the Cell Production, Proceedings of 24th European Photovoltaic Solar Energy Conference and Exhibition, Hamburg, Germany (2009) 1297-1302.
  3. H. Li, H. Li, W. L. Dai, W. Wang, Z. Fang, J. F. Deng, XPS studies on surface electronic characteristics of Ni-B and Ni-P amorphous alloy and its correlation to their catalytic properties, Appl. Surf. Sci., 152 (1999) 25-34. https://doi.org/10.1016/S0169-4332(99)00294-9
  4. J. G. Ahn, D. J. Kim, H. T. Hai, J. R. Lee, I. K. Lee, H. S. Chung, Characteristics of Nickel-Diamond Composite Powders by Electroless Nickel Plating, J. Korean Powder Metall. Inst., 11(3) (2004) 224-232. https://doi.org/10.4150/KPMI.2004.11.3.224
  5. M. Paunovic, M. Schlesinger, Fundamentals of Electrochemical Deposition, John Wiley, second Ed, Wiley, New Jersey, (2006) 153-155.
  6. G. O. Mallory, Electroless Plating, William Andrew, first Ed, AESF, New York, (1990) 88-93.
  7. C. R. Lee, H. D. Park, S. G. Kang, A study on Electroless Ni-B Plating with DMAB as Reducing Agent, J. Korean inst. surf. Eng., 32(2) (1999) 172-181.
  8. T. Watanabe, Nano-Plating, first Ed, Elsevier, Tokyo, (2004) 659-664.
  9. H. S. Chu, D. K. Kim, A study on the Functional Electroless Ni plating for Controlled Morphology on the CBN Powder, J. Korean inst. surf. Eng., 41(6) (2008) 312-324. https://doi.org/10.5695/JKISE.2008.41.6.312
  10. S. Q. Guo, L. F. Hou, C. L. Guo, Y. H. Wei, Characteristics and corrosion behavior of nickel-phosphorus coatings deposited by a simplified bath, Mater. Corros., 4 (2017) 68.
  11. Q. L. Rao, G. Bi, Q. H. Lua, H. W. Wang, X.L. Fan, Microstructure evolution of electroless Ni-B film during its deposition process, Appl. Surf. Sci., 240 (2005) 28-33. https://doi.org/10.1016/j.apsusc.2004.07.059