• Title/Summary/Keyword: Nano-scale Process

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Development of Continuous UV Nano Imprinting Process Using Pattern Roll Stamper (패턴 롤 스템퍼를 이용한 연속 UV 나노 임프린팅 공정기술 개발)

  • Cha, J.;Ahn, S.;Han, J.;Bae, H.;Myoung, B.;Kang, S.
    • Proceedings of the Korean Society for Technology of Plasticity Conference
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    • 2006.05a
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    • pp.105-108
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    • 2006
  • It has been issued to fabricate nano-scale patterns with large-scale in the field of digital display. Also, large-scale fabrication technology of nano pattern is very important not only for the field of digital display but also for the most of applications of the nano-scale patterns in the view of the productivity. Among the fabrication technologies, UV nano imprinting process is suitable for replicating polymeric nano-scale patterns. However, in case of conventional UV nano imprinting process using flat mold, it is not easy to replicate large areal nano patterns. Because there are several problems such as releasing, uniformity of the replica, mold fabrication and so on. In this study, to overcome the limitation of the conventional UV nano imprinting process, we proposed a continuous UV nano imprinting process using a pattern roll stamper. A pattern roll stamper that has nano-scale patterns was fabricated by attaching thin metal stamper to a roll base. A continuous UV nano imprinting system was designed and constructed. As practical examples of the process, various nano patterns with pattern size of 500, 150 and 50nm were fabricated. Finally, geometrical properties of imprinted nano patterns were measured and analyzed.

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Fabrication of Nano-Size Specimens for Tensile Test Employing Nano-Indentation Device (나노 인장시험을 위한 압축 시험기용 인장시편 제작에 관한 연구)

  • Lim, Tae Woo;Yang, Dong-Yol
    • Journal of the Korean Society for Precision Engineering
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    • v.32 no.10
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    • pp.911-916
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    • 2015
  • In the nano/micro scale, material properties are dependent on the size-scale of a structure. However, conventional micro-scale tensile tests have limitations to obtain reliable values of nano-scale material properties owing to residual stress and elastic slippage in the gripping/aligning process. The indenter-driven nano-scale tensile test provides prominent advantages simple testing device, high-quality nano-scale metallic specimen with negligible residual stress. In this paper, two-types of specimens (a specimen with multi-testing parts and a specimen with a single-testing part) are discussed. Focused ion beam (FIB) is employed to fabricate a nano-scale specimen from a thin nickel film. Using the specimen with a single-testing part, we obtained a nano-scale stress-strain curve of electroplated nickel film.

Analysis of Size Effect of Nano Scale Machining Based on Normal Stress and Indentation Theories (수직응력과 압입이론에 기반한 나노스케일 기계가공에서의 크기효과 분석)

  • Jeon, Eun-chae;Lee, Yun-Hee;Je, Tae-Jin
    • Journal of the Korean Society of Manufacturing Process Engineers
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    • v.17 no.6
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    • pp.1-6
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    • 2018
  • Recently nano meter size pattern (sub-micro scale) can be machined mechanically using a diamond tool. Many studies have found a 'size effect' which referred to a specific cutting energy increase with the decrease in the uncut chip thickness at micro scale machining. A new analysis method was suggested in order to observe 'size effect' in nano scale machining and to verify the cause of the 'size effect' in this study. The diamond tool was indented to a vertical depth of 1,000nm depth in order to simplify the stress state and the normal force was measured continuously. The tip rounding was measured quantitatively by AFM. Based on the measurements and theoretical analysis, it was verified that the main cause of the 'size effect' in nano scale machining is geometrically necessary dislocations, one of the intrinsic material characteristics. st before tool failure.

Novel Environmentally Benign and Low-Cost Pd-free Electroless Plating Method Using Ag Nanosol as an Activator

  • Kim, Jun Hong;Oh, Joo Young;Song, Shin Ae;Kim, Kiyoung;Lim, Sung Nam
    • Journal of Electrochemical Science and Technology
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    • v.8 no.3
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    • pp.215-221
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    • 2017
  • The electroless plating process largely consists of substrate cleaning, seed formation (activator formation), and electroless plating. The most widely used activator in the seed formation step is Pd, and Sn ions are used to facilitate the formation of this Pd seed layer. This is problematic because the Sn ions interfere with the reduction of Cu ions during electroless plating; thus, the Sn ions must be removed by a hydrochloric acid cleaning process. This method is also expensive due to the use of Pd. In this study, Cu electroless plating was performed by forming a seed layer using a silver nanosol instead of Pd and Sn. The effects of the Ag nanosol concentration in the pretreatment solution and the pretreatment time on the thickness and surface morphology of the Cu layer were investigated. The degrees of adhesion to the substrate were similar for the electroless-plated Cu layers formed by conventional Pd activation and those formed by the Ag nanosol.

Using Electron-beam Resists as Ion Milling Mask for Fabrication of Spin Transfer Devices

  • Nguyen Hoang Yen Thi;Yi, Hyun-Jung;Shin, Kyung-Ho
    • Journal of Magnetics
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    • v.12 no.1
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    • pp.12-16
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    • 2007
  • Magnetic excitation and reversal by a spin polarized current via spin transfer have been a central research topic in spintronics due to its application potential. Special techniques are required to fabricate nano-scale magnetic layers in which the effect can be observed and studied. This work discusses the possibility of using electron-beam resists, the nano-scale patterning media, as ion milling mask in a subtractive fabrication method. The possibility is demonstrated by two resists, one positive tone, the ZEP 520A, and one negative tone, the ma-N2403. The advantage and the key points for success of this process will be also addressed.

Molecular Dynamics Simulation for Compression Test of PMMA Nano Pillars (PMMA 나노 기둥의 압축시험에 대한 분자동역학 해석)

  • Kim, Jung-Yup;Kim, Jae-Hyun;Choi, Byung-Ik
    • Proceedings of the KSME Conference
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    • 2007.05a
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    • pp.502-505
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    • 2007
  • PMMA has been extensively adopted in Nano Imprint Lithography(NIL). PMMA nano-structures experience severe mechanical load and deformation during NIL process, and understanding its mechanical behavior is very important in designing and optimizing NIL process. One of the most promising techniques for characterizing the mechanical behavior of nano structures is nano pillar compression test. In this study, the mechanical behaviors of PMMA pillars during compression test are analyzed using Molecular Dynamics. Two methods for simulation of PMMA nano pillars are proposed. The stress-strain relationship of nano-scale PMMA structure is obtained based on CVFF(Covalent Valence Force Fields) potential and the dependency of the applied strain rate on the stress-strain relationship is analyzed. The obtained stress-strain relationships can be useful in simulating nano-scale PMMA structures using Finite Element Method(FEM) and understanding the experimental results obtained by compression test of PMMA nano pillars.

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Alignment Algorithm for Nano-scale Three-dimensional Printing System (나노스케일 3 차원 프린팅 시스템을 위한 정렬 알고리즘)

  • Jang, Ki-Hwan;Lee, Hyun-Taek;Kim, Chung-Soo;Chu, Won-Shik;Ahn, Sung-Hoon
    • Journal of the Korean Society for Precision Engineering
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    • v.31 no.12
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    • pp.1101-1106
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    • 2014
  • Hybrid manufacturing technology has been advanced to overcome limitations due to traditional fabrication methods. To fabricate a micro/nano-scale structure, various manufacturing technologies such as lithography and etching were attempted. Since these manufacturing processes are limited by their materials, temperature and features, it is necessary to develop a new three-dimensional (3D) printing method. A novel nano-scale 3D printing system was developed consisting of the Nano-Particle Deposition System (NPDS) and the Focused Ion Beam (FIB) to overcome these limitations. By repeating deposition and machining processes, it was possible to fabricate micro/nano-scale 3D structures with various metals and ceramics. Since each process works in different chambers, a transfer process is required. In this research, nanoscale 3D printing system was briefly explained and an alignment algorithm for nano-scale 3D printing system was developed. Implementing the algorithm leads to an accepted error margin of 0.5% by compensating error in rotational, horizontal, and vertical axes.

Injection molding using porous nano-scale patterned master with Pettier devices (펠티어 소자를 이용한 다공성 나노패턴의 사출에 대한 연구)

  • Hong, N.P.;Kwon, J.T.;Shin, H.G.;Seo, Y.H.;Kim, B.H.
    • Proceedings of the Korean Society for Technology of Plasticity Conference
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    • 2008.05a
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    • pp.513-516
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    • 2008
  • We have replicated nanopillar arrays using injection molding process of active heating and cooling method by several peltier devices. The injection melding has a high accuracy ed good reproducibility that are essential for mass production at low cost. Conventional molding processes widely use the water-based mold heating and air cooling methods. However, in case of replication for nano-patterned structures, it caused several defects such as air-flow mark, non-fill, sticking and tearing. In this study, periodic nano-scale patterns are replicated by using injection molding with Peltier devices. Porous nano-scale patterns, which have pore diameter range from 120nm to 150nm, were fabricated by using anodizing process. Periodic nano-pore structures ( $20mm\;{\times}\;20mm$) were used as a mold stamp of injection molding. Finally, PMMA with nanopillar arrays was obtained by injection molding process. By using the Peltier devices, the temperature of locally adiabatic molds can be dramatically controlled and the quality of the molded patterns can be slightly improved.

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Numerical Simulation of NIL Process Based on Continuum Hypothesis (연속체 가정을 통한 NIL 공정의 전산모사)

  • Kim, Seung-Mo;Lee, Woo-Il
    • Proceedings of the KSME Conference
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    • 2007.05a
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    • pp.532-537
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    • 2007
  • Nano imprint lithography(NIL) is a cost-efficient, high-throughput processing technique to transfer nano-scale patterns onto thin polymer films. Polymers used as the resist include UV cured resins as well as thermoplastics such as polymethyl-methacrylate(PMMA). In this study, an analytic investigation was performed for the NIL process of transferring nano scale patterns onto polymeric films. Process optimization calls for a thorough understanding of resist flow during the process. We carried out 2D and 3D numerical analyses of resist flow during NIL process. The simulation incorporated continuum-hypothesis and the effects of surface tension were taken into account. For a more effective prediction of free surface, fixed grid scheme with the volume of fluid (VOF) method were used. The simulation results were verified with experimental results qualitatively. And the parametric study was performed for various process conditions.

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