• Transactions on Electrical and Electronic Materials
• /
• 제5권6호
• /
• pp.227-232
• /
• 2004

We investigated a nonvolatile nanomemory element based on boron nitride nanopeapods using molecular dynamics simulations. The studied system was composed of two boron-nitride nanotubes filled Cu electrodes and fully ionized endo-fullerenes. The two boron-nitride nanotubes were placed face to face and the endo-fullerenes came and went between the two boron-nitride nanotubes under alternatively applied force fields. Since the endo-fullerenes encapsulated in the boron-nitride nanotubes hardly escape from the boron-nitride nanotubes, the studied system can be considered to be a nonvolatile memory device. The minimum potential energies of the memory element were found near the fullerenes attached copper electrodes and the activation energy barrier was $3{\cdot}579 eV$. Several switching processes were investigated for external force fields using molecular dynamics simulations. The bit flips were achieved from the external force field of above $3.579 eV/{\AA}$.

• 한국소성가공학회:학술대회논문집
• /
• 한국소성가공학회 2005년도 춘계학술대회 논문집
• /
• pp.245-248
• /
• 2005

This paper is concerned with manufacturing technology of thin foil tensile specimen using CIP(Cold Isostatic Press) and measurement of precision mechanical property. This thin foil tensile specimen manufacturing technology is a method that can make a metal thin foil specimen for micro tensile testing. We can get a burr free micro metallic thin foil specimen using this technology. For testing mechanical property of this micro thin foil, we use a nano scale material testing machine that was developed by KITECH. In this paper, micro tensile specimens of nickel and copper thin foil are fabricated with CIP and precision mechanical properties of these materials could be measured. We will expect that precision mechanical property of micro/nano material and component. Micro and Nano mechanical property can be measured using this technology and mechanical property data base of micro/nano material and component can be constructed.

• 한국기계가공학회지
• /
• 제19권12호
• /
• pp.49-55
• /
• 2020

In order to improve the electromagnetic shielding rate of Carbon Fiber (CF), it was produced using the nickel nano-powder impregnating method. Using two types of nickel powder having thicknesses of 50 ㎛ and 100 ㎛, and a thermoplastic elastomer resin, a compound containing 10-20% nickel content was mixed and then manufactured through an extruder. The CF coated with the compound was woven and manufactured using a 1-ply specimen. The final nickel content of the specimen was verified using TGA and the distribution of nickel powder on the CF surface was verified using SEM. The metal shows a high shielding rate in the low-frequency band, but the shielding rate decreases at higher-frequency bands. The CF improves at the higher frequency band, and metals reflect electromagnetic waves while carbon absorbs electromagnetic waves. The study of shielding materials, which are stronger and lighter than metal, by using CF lighter than metal and enabling the shielding rate from low-frequency band to high-frequency band, confirmed that the larger the area coated with nickel nano-powder, the better the electromagnetic shielding performance. In particular, CF coated with a thickness of 100 ㎛ has a shielding rate similar to that of copper and can also be used for EV/HEV automotive cables and other applications in the future.

• 한국표면공학회지
• /
• 제56권5호
• /
• pp.335-340
• /
• 2023

Quinary component of 3㎛ thick Ti-Al-Si-Cu-N films were deposited onto WC-Co and Si wafer substrates by using an arc ion plating(AIP) system. In this study, the influence of copper(Cu) contents on the mechanical properties and microstructure of the films were investigated. The hardness of the films with 3.1 at.% Cu addition exhibited the hardness value of above 42 GPa due to the microstructural change as well as the solid-solution hardening. The instrumental analyses revealed that the deposited film with Cu content of 3.1 at.% was a nano-composites with nano-sized crystallites (5-7 nm in dia.) and a thin layer of amorphous Si₃N₄ phase.

• Bulletin of the Korean Chemical Society
• /
• 제32권spc8호
• /
• pp.2981-2987
• /
• 2011

A comparative study of the photodynamic and antioxidant activities of methyl pheophorbide-a (MPa, 1) and its transition metal(II) complexes (2-5) is described. Four transition metal complexes (palladium(II): 2, zinc(II): 3, cobalt(II): 4 and copper(II): 5) of MPa were prepared by reaction between the corresponding transition metal and 1, respectively, and were characterized by $^1H$-NMR and UV-vis spectroscopic and mass spectrometric analyses. In vitro results show a photodynamic therapy (PDT) efficacy with A549 cells might be attributed to a heavy atom effect of the transition metal complexes of MPa. Among them, 4 and 5 showed higher photodynamic activity than that of 1 at the concentration of 5 ${\mu}M$ at 24 h incubation after photoirradiation. The images of morphological change for 2-5 show evidence for the PDT effect with A549 cells. And the all transition metal complexes of MPa showed higher antioxidant activity than that of MPa, in which 4 showed the highest antioxidant activity.

• 마이크로전자및패키징학회지
• /
• 제15권2호
• /
• pp.29-36
• /
• 2008

본 연구에서는 MEMS 소자의 직접화 및 소형화에 필수적인 through-wafer via interconnect의 신뢰성 문제를 연구하였다. 이를 위하여 Au-Sn eutectic 접합 기술을 이용하여 밀봉(hermetic) 접합을 한 웨이퍼 레벨 MEMS 패키지 소자를 개발하였으며, 전기도금법을 이용하여 수직 through-hole via 내부를 구리로 충전함으로써 전기적 연결을 시도하였다. 제작된 MEMS 패키지의 크기는 $1mm{\times}1mm{\times}700{\mu}m$이었다. 제작된 MEMS패키지의 신뢰성 수행 결과 비아 홀(via hole)주변의 크랙 발생으로 패키지의 파손이 발생하였다. 구리 through-via의 기계적 신뢰성에 영향을 줄 수 있는 여러 인자들에 대해서 수치적 해석 및 실험적인 연구를 수행하였다. 분석 결과 via hole의 크랙을 발생시킬 수 있는 파괴 인자로서 열팽창 계수의 차이, 비아 홀의 형상, 구리 확산 현상 등이 있었다. 궁극적으로 구리 확산을 방지하고, 전기도금 공정의 접합력을 향상시킬 수 있는 새로운 공정 방식을 적용함으로써 비아 홀 크랙으로 인한 패키지의 파괴를 개선할 수 있었다.

• 한국재료학회지
• /
• 제22권7호
• /
• pp.335-341
• /
• 2012

Recently, the demand for the miniaturization of printed circuit boards has been increasing, as electronic devices have been sharply downsized. Conventional multi-layered PCBs are limited in terms their use with higher packaging densities. Therefore, a build-up process has been adopted as a new multi-layered PCB manufacturing process. In this process, via-holes are used to connect each conductive layer. After the connection of the interlayers created by electro copper plating, the via-holes are filled with a conductive paste. In this study, a desmear treatment, electroless plating and electroplating were carried out to investigate the optimum processing conditions for Cu via filling on a PCB. The desmear treatment involved swelling, etching, reduction, and an acid dip. A seed layer was formed on the via surface by electroless Cu plating. For Cu via filling, the electroplating of Cu from an acid sulfate bath containing typical additives such as PEG(polyethylene glycol), chloride ions, bis-(3-sodiumsulfopropyl disulfide) (SPS), and Janus Green B(JGB) was carried out. The desmear treatment clearly removes laser drilling residue and improves the surface roughness, which is necessary to ensure good adhesion of the Cu. A homogeneous and thick Cu seed layer was deposited on the samples after the desmear treatment. The 2,2'-Dipyridyl additive significantly improves the seed layer quality. SPS, PEG, and JGB additives are necessary to ensure defect-free bottom-up super filling.

• 대한금속재료학회지
• /
• 제46권3호
• /
• pp.182-188
• /
• 2008

Carbon nanotubes(CNTs) have outstanding mechanical, thermal, and electrical properties. Thus, by placing nanotubes into appropriate matrix, it is postulated that the resulting composites will have enhanced properties. Cold spray can produce thick metal-based composite coatings with very high density, low oxygen content, and phase purity, which leads to excellent physical properties. In this study, we applied cold spray coating process for the consolidation of Cu/CNT composite powder. The precursor powder mixture, in which CNTs were filled into copper particles, was prepared to improve the distribution of the CNT in copper matrix. Pure copper coating was also conducted by cold spraying as a reference. Annealing heat treatment was applied to the coating to examine its effect on the properties of the composite coating. The hardness of Cu/CNT composite coating represented similar value to that of pure copper coating. It was importantly found that the electrical conductivity of the Cu/CNT composite coating significantly increased from 53% for the standard condition to almost 55% in the optimized condition, taking annealed ($500^{\circ}C/1hr$.) copper coating as a reference (100%). The thermal conductivity of Cu/CNT composite coating layer was higher than that of pure Cu coating. It was also found that the electrical and thermal conductivities of Cu/CNT composite could be improved through annealing heat treatment. The microstructural evolution of Cu/CNT coating was also investigated and related to the macroscopic properties.

• 한국해양공학회지
• /
• 제23권3호
• /
• pp.35-39
• /
• 2009

The main objective of this study was to investigate fiber reinforced composite materials (FRCM) with electromagnetic shielding characteristics using aluminum (Al) film and copper (Cu) meshes. This study investigated the electromagnetic interference (EMI) shielding effectiveness (SE) of fiber reinforced composites filled with Al film, Cu meshes, and nano carbon black as hybrid conductive fillers to provide the electromagnetic shielding property of the fiber reinforced composites. The coaxial transmission line method of ASTM D 4935-89 was used to measure the EMI shielding effectiveness of composites in the frequency range of 300 MHz to 1.5 GHz. The variations of SE of FRCM with Al film, fine Cu, and general Cu meshes are described. The results indicate that the FRCM having Al film exhibited up to 75 dB of SE at 1.5 GHz.

• 한국분말재료학회지
• /
• 제10권6호
• /
• pp.443-447
• /
• 2003

Nano-sized $TiB_2$ was in situ synthesized in copper matrix through self-propagating high temperature synthesis (SHS) with high-energy ball milled Ti-B-Cu elemental mixtures as powder precursors. The size of $TiB_2$ particles in the product of SHS reaction decreases with time of preliminary mechanical treatment ranging from 1 in untreated mixture to 0.1 in mixtures milled for 3 min. Subsequent mechanical treatment of the product of SHS reaction allowed the $TiB_2$ particles to be reduced down to 30-50 nm. Microstructural change of $TiB_2$-Cu nanocomposite during spark plasma sintering (SPS) was also investigated. Under simultaneous action of pressure, temperature and electric current, titanium diboride nanoparticles distributed in copper matrix move, agglomerate and form a interpenetrating phase composite with a fine-grained skeleton.