• Title/Summary/Keyword: Nano sensor

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A Sensor Device Manager Supporting Sensor Transparency (센서 투명성을 지원하는 센서 디바이스 매니저)

  • Sang-Ho, Bang;Seongbae Eun
    • Proceedings of the Korea Information Processing Society Conference
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    • 2008.11a
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    • pp.998-1000
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    • 2008
  • 센서 노드 운영체제는 응용 프로그래머의 개발 지원 및 체계적인 센서 관리를 위하여 센서 투명성을 지원해야 한다. 하지만 기존 센서 노드 운영체제들은 센서투명성을 지원하지 못한다. 센서 디바이스 드라이버를 응용이 직접 작성해야 하며 다양한 센서를 위한 공통 인터페이스를 제공하지 못한다. 본 논문에서는 센서 투명성을 지원하는 센서 디바이스 매니저를 제안한다. ETRI에서 개발한 Nano-Q+에서 센서 디바이스 매니저 기능을 구현하기 위하여 센서노드 플랫폼, 응용 API, 디바이스 매니저, HAL을 설계하고 구현하였다. 또한, 기존 Nano-Q+와 성능을 비교하고 평가하였다. 센서디바이스 매니저를 구현하여도 처리 속도 및 용량에 대한 성능 저하가 없음을 확인하였다.

Hydrogen sulfide gas sensing mechanism study of ZnO nanostructure and improvement of sensing property by surface modification

  • Kim, Jae-Hyeon;Yong, Gi-Jung
    • Proceedings of the Korean Vacuum Society Conference
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    • 2011.02a
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    • pp.450-450
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    • 2011
  • This study reports the hydrogen sulfide gas sensing properties of ZnO nanorods bundle and the investigation of gas sensing mechanism. Also the improvement of sensing properties was also studied through the application of ZnO heterstructured nanorods. The 1-Dimensional ZnO nano-structure was synthesized by hydrothermal method and ZnO nano-heterostructures were prepared by sonochemical reaction. Scanning electron microscopy (SEM) and X-ray diffraction (XRD) spectra confirmed a well-crystalline ZnO of hexagonal structure. The gas response of ZnO nanorods bundle sensor increased with increasing temperature, which is thought to be due to chemical reaction of nanorods with gas molecules. Through analysis of X-ray photoelectron spectroscopy (XPS), the sensing mechanism of ZnO nanorods bundle sensor was explained by well-known surface reaction between ZnO surface atoms and hydrogen sulfide. However at high sensing temperature, chemical conversion of ZnO nanorods becomes a dominant sensing mechanism in current system. In order to improve the gas sensing properties, simple type of gas sensor was fabricated with ZnO nano-heterostructures, which were prepared by deposition of CuO, Au on the ZnO nanorods bundle. These heteronanostructures show higher gas response and higher current level than ZnO nanorods bundle. The gas sensing mechanism of the heteronanostructure can be explained by the chemical conversion of sensing material through the reaction with target gas.

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Characteristics of Indium-Tin-Oxide electrode for continuous-flow PCR chip (연속흐름 중합효소연쇄반응칩 제작을 위한 인듐 산화막 전극의 특성분석)

  • Joung, Seung-Ryong;Yi, In-Je;Kim, Jun-Hyuk;Kim, Han-Soo;Kim, Jae-Wan;Choi, Y.J.;Kang, C.J.;Kim, Yong-Sang
    • Proceedings of the KIEE Conference
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    • 2006.07c
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    • pp.1386-1387
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    • 2006
  • PDMS와 ITO 유리를 이용하여 continuous-flow PCR chip을 제작하였다. PDMS를 이용하여 microchannel을 형성하여 주었고, ITO electrode를 heater와 sensor로 사용하기 위하여 반도체 공정을 통해 패턴을 형성하였다. microchannel내에 흐르는 시료의 온도를 제어하기 위하여 heater와 sensor를 calibration을 하였다. ITO heater는 인가된 전압에 대해 매우 선형적인 발열을 하였으며, ITO sensor는 온도에 대해 선형적인 저항 변화를 나타낸 바, 그 결과 continuous-flow PCR chip의 정확한 온도 제어가 가능하였다.

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An Integrated Sensor for Pressure, Temperature, and Relative Humidity Based on MEMS Technology

  • Won Jong-Hwa;Choa Sung-Hoon;Yulong Zhao
    • Journal of Mechanical Science and Technology
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    • v.20 no.4
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    • pp.505-512
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    • 2006
  • This paper presents an integrated multifunctional sensor based on MEMS technology, which can be used or embedded in mobile devices for environmental monitoring. An absolute pressure sensor, a temperature sensor and a humidity sensor are integrated in one silicon chip of which the size is $5mm\times5mm$. The pressure sensor uses a bulk-micromachined diaphragm structure with the piezoresistors. For temperature sensing, a silicon temperature sensor based on the spreading-resistance principle is designed and fabricated. The humidity sensor is a capacitive humidity sensor which has the polyimide film and interdigitated capacitance electrodes. The different piezoresistive orientation is used for the pressure and temperature sensor to avoid the interference between sensors. Each sensor shows good sensor characteristics except for the humidity sensor. However, the linearity and hysteresis of the humidity sensor can be improved by selecting the proper polymer materials and structures.

Photo Sensitive Chaotic Signal Generator with Light Controllability (광감지 제어성을 갖는 카오스 신호 생성회로)

  • Oh, Se-Jin;Song, Han-Jung
    • Journal of Sensor Science and Technology
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    • v.21 no.5
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    • pp.389-393
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    • 2012
  • A chaotic oscillator with light controllability was designed. The proposed chaotic oscillator consists of a photo sensor, two phase clock driven MOS switches, nonlinear function blocks for chaotic signal generation. SPICE circuit analysis using a 0.35 um CMOS process parameters was performed for its chaotic dynamics. And we confirmed that chaotic behaviors of the circuit can be controlled according to light intensity. By SPICE simulation, chaotic dynamics by time waveforms, frequency analysis was analyzed. SPICE results showed that proposed circuit can make various light-controlled chaotic signals.

Characterization of Magnetic Abrasive Finishing Using Sensor Fusion (센서 융합을 이용한 MAF 공정 특성 분석)

  • Kim, Seol-Bim;Ahn, Byoung-Woon;Lee, Seoung-Hwan
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.33 no.5
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    • pp.514-520
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    • 2009
  • In configuring an automated polishing system, a monitoring scheme to estimate the surface roughness is necessary. In this study, a precision polishing process, magnetic abrasive finishing (MAF), along with an in-process monitoring setup was investigated. A magnetic tooling is connected to a CNC machining to polish the surface of stavax(S136) die steel workpieces. During finishing experiments, both AE signals and force signals were sampled and analysed. The finishing results show that MAF has nano scale finishing capability (upto 8nm in surface roughness) and the sensor signals have strong correlations with the parameters such as gap between the tool and workpiece, feed rate and abrasive size. In addition, the signals were utilized as the input parameters of artificial neural networks to predict generated surface roughness. Among the three networks constructed -AE rms input, force input, AE+force input- the ANN with sensor fusion (AE+force) produced most stable results. From above, it has been shown that the proposed sensor fusion scheme is appropriate for the monitoring and prediction of the nano scale precision finishing process.

Polarity Index Dependence of M13 Bacteriophage-based Nanostructure for Structural Color-based Sensing

  • Lee, Yujin;Moon, Jong-Sik;Kim, Kyujung;Oh, Jin-Woo
    • Current Optics and Photonics
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    • v.1 no.1
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    • pp.12-16
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    • 2017
  • Color sensor systems based on M13 bacteriophage are being considerably researched. Although many studies on M13 bacteriophage-based chemical sensing of TNT, endocrine disrupting chemicals, and antibiotics have been undertaken, the fundamental physical and chemical properties of M13 bacteriophage-based nanostructures require further research. A simple M13 bacteriophage-based colorimetric sensor was fabricated by a simple pulling technique, and M13 bacteriophage was genetically engineered using a phage display technique to exhibit a negatively charged surface. Arrays of structurally and genetically modified M13 bacteriophage that can determine the polarity indexes of various alcohols were found. In this research, an M13 bacteriophage-based color sensor was used to detect various types of alcohols, including methanol, ethanol, and methanol/butanol mixtures, in order to investigate the polarity-related property of the sensor. Studies of the fundamental chemical sensing properties of M13 bacteriophage-based nanostructures should result in wider applications of M13 bacteriophage-based colorimetric sensors.

Comparison of the Characteristics of Metal Membrane Pressure Sensors Depending on the Shape of the Piezoresistive Patterns (금속 멤브레인 압력 센서에서 압저항체 패턴 형태에 따른 특성 비교)

  • Jun Park;Chang-Kyu Kim
    • Journal of Sensor Science and Technology
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    • v.33 no.3
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    • pp.173-178
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    • 2024
  • Development of pressure sensors for harsh environments with high pressure, humidity, and temperature is essential for many applications in the aerospace, marine, and automobile industries. However, existing materials such as polymers, adhesives, and semiconductors are not suitable for these conditions and require materials that are less sensitive to the external environment. This study proposed a pressure sensor that could withstand harsh environments and had high durability and precision. The sensor comprised a piezoresistor pattern and an insulating film directly formed on a stainless-steel membrane. To achieve the highest sensitivity, a pattern design method was proposed that considered the stress distribution in a circular membrane using finite element analysis. The manufacturing process involved depositing and etching a dielectric insulating film and metal piezoresistive material, resulting in a device with high linearity and slight hysteresis in the range of a maximum of 40 atm. The simplicity and effectiveness of this sensor render it a promising candidate for various applications in extreme environments.

Nano-delamination monitoring of BFRP nano-pipes of electrical potential change with ANNs

  • Altabey, Wael A.;Noori, Mohammad;Alarjani, Ali;Zhao, Ying
    • Advances in nano research
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    • v.9 no.1
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    • pp.1-13
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    • 2020
  • In this work, the electrical potential (EP) technique with an artificial neural networks (ANNs) for monitoring of nanostructures are used for the first time. This study employs an expert system to identify size and localize hidden nano-delamination (N.Del) inside layers of nano-pipe (N.P) manufactured from Basalt Fiber Reinforced Polymer (BFRP) laminate composite by using low-cost monitoring method of electrical potential (EP) technique with an artificial neural networks (ANNs), which are combined to decrease detection effort to discern N.Del location/size inside the N.P layers, with high accuracy, simple and low-cost. The dielectric properties of the N.P material are measured before and after N.Del introduced using arrays of electrical contacts and the variation in capacitance values, capacitance change and node potential distribution are analyzed. Using these changes in electrical potential due to N.Del, a finite element (FE) simulation model for N.Del location/size detection is generated by ANSYS and MATLAB, which are combined to simulate sensor characteristic, therefore, FE analyses are employed to make sets of data for the learning of the ANNs. The method is applied for the N.Del monitoring, to minimize the number of FE analysis in order to keep the cost and save the time of the assessment to a minimum. The FE results are in excellent agreement with an ANN and the experimental results available in the literature, thus validating the accuracy and reliability of the proposed technique.

Wafer-level Vacuum Packaging of a MEMS Resonator using the Three-layer Bonding Technique (3중 접합 공정에 의한 MEMS 공진기의 웨이퍼레벨 진공 패키징)

  • Yang, Chung Mo;Kim, Hee Yeoun;Park, Jong Cheol;Na, Ye Eun;Kim, Tae Hyun;Noh, Kil Son;Sim, Gap Seop;Kim, Ki Hoon
    • Journal of Sensor Science and Technology
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    • v.29 no.5
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    • pp.354-359
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    • 2020
  • The high vacuum hermetic sealing technique ensures excellent performance of MEMS resonators. For the high vacuum hermetic sealing, the customization of anodic bonding equipment was conducted for the glass/Si/glass triple-stack anodic bonding process. Figure 1 presents the schematic of the MEMS resonator with triple-stack high-vacuum anodic bonding. The anodic bonding process for vacuum sealing was performed with the chamber pressure lower than 5 × 10-6 mbar, the piston pressure of 5 kN, and the applied voltage was 1 kV. The process temperature during anodic bonding was 400 ℃. To maintain the vacuum condition of the glass cavity, a getter material, such as a titanium thin film, was deposited. The getter materials was active at the 400 ℃ during the anodic bonding process. To read out the electrical signals from the Si resonator, a vertical feed-through was applied by using through glass via (TGV) which is formed by sandblasting technique of cap glass wafer. The aluminum electrodes was conformally deposited on the via-hole structure of cap glass. The TGV process provides reliable electrical interconnection between Si resonator and aluminum electrodes on the cap glass without leakage or electrical disconnection through the TGV. The fabricated MEMS resonator with proposed vacuum packaging using three-layer anodic bonding process has resonance frequency and quality factor of about 16 kHz and more than 40,000, respectively.