• 제목/요약/키워드: Nano metal particles

검색결과 155건 처리시간 0.025초

Reduction Behaviors of Nitric Oxides on Copper-decorated Mesoporous Molecular Sieves

  • Cho, Ki-Sook;Kim, Byung-Joo;Kim, Seok;Kim, Sung-Hyun;Park, Soo-Jin
    • Bulletin of the Korean Chemical Society
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    • 제31권1호
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    • pp.100-103
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    • 2010
  • In this study, NO reduction behaviors of copper-loaded mesoporous molecular sieves (Cu/MCM-41) have been investigated. The Cu loading on MCM-41 surfaces was accomplished by a chemical reduction method with different Cu contents (5, 10, 20, and 40%). $N_2/77$ K adsorption isotherm characteristics, including the specific surface area and pore volume, were studied by BET's equation. NO reduction behaviors were confirmed by a gas chromatography. From the experimental results, the Cu loading amount on MCM-41 led to the increase of NO reduction efficiency in spite of decreasing the specific surface area of catalysts. This result indicates that highly ordered porous structure in the MCM-41 and the presence of active metal particles lead the synergistical NO reduction reactions due to the increase in adsorption energy of MCM-41 surfaces by the Cu particles.

실리콘 게이트전극을 갖는 고온소자와 금속 게이트전극을 갖는 P형 저온 다결정 실리콘 박막 트랜지스터의 전기특성 비교 연구 (A Research About P-type Polycrystalline Silicon Thin Film Transistors of Low Temperature with Metal Gate Electrode and High Temperature with Gate Poly Silicon)

  • 이진민
    • 한국전기전자재료학회논문지
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    • 제24권6호
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    • pp.433-439
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    • 2011
  • Poly Si TFTs (poly silicon thin film transistors) with p channel those are annealed HT (high temperature) with gate poly crystalline silicon and LT (low temperature) with metal gate electrode were fabricated on quartz substrate using the analyzed data and compared according to the activated grade silicon thin films and the size of device channel. The electrical characteristics of HT poly-Si TFTs increased those are the on current, electron mobility and decrease threshold voltage by the quality of particles of active thin films annealed at high temperature. But the on/off current ratio reduced by increase of the off current depend on the hot carrier applied to high gate voltage. Even though the size of the particles annealed at low temperature are bigger than HT poly-Si TFTs due to defect in the activated grade poly crystal silicon and the grain boundary, the characteristics of LT poly-Si TFTs were investigated deterioration phenomena those are decrease the electric off current, electron mobility and increase threshold voltage. The results of transconductance show that slope depend on the quality of particles and the amplitude depend on the size of the active silicon particles.

Nanomaterials for Advanced Electrode of Low Temperature Solid Oxide Fuel Cells (SOFCs)

  • Ishihara, Tatsumi
    • 한국세라믹학회지
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    • 제53권5호
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    • pp.469-477
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    • 2016
  • The application of nanomaterials for electrodes of intermediate temperature solid oxide fuel cells (SOFC) is introduced. In conventional SOFCs, the operating temperature is higher than 1073 K, and so application of nanomaterials is not suitable because of the high degradation rate that results from sintering, aggregation, or reactions. However, by allowing a decrease of the operating temperature, nanomaterials are attracting much interest. In this review, nanocomposite films with columnar morphology, called double columnar or vertically aligned nanocomposites and prepared by pulsed laser ablation method, are introduced. For anodes, metal nano particles prepared by exsolution from perovskite lattice are also applied. By using dissolution and exsolution into and from the perovskite matrix, performed by changing $P_{O2}$ in the gas phase at each interval, recovery of the power density can be achieved by keeping the metal particle size small. Therefore, it is expected that the application of nanomaterials will become more popular in future SOFC development.

디지털 프린팅을 위한 전도성 배선에 관한 연구 (Investigation of Conductive Pattern Line for Direct Digital Printing)

  • 김용식;서상훈;이로운;김태훈;박재찬;김태구;정경진;윤관수;박성준;정재우
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2007년도 하계학술대회 논문집 Vol.8
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    • pp.502-502
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    • 2007
  • Current thin film process using memory device fabrication process use expensive processes such as manufacturing of photo mask, coating of photo resist, exposure, development, and etching. However, direct printing technology has the merits about simple and cost effective processes because inks are directly injective without mask. And also, this technology has the advantage about fabrication of fine pattern line on various substrates such as PCB, FCPB, glass, polymer and so on. In this work, we have fabricated the fine and thick metal pattern line for the electronic circuit board using metal ink contains Ag nano-particles. Metal lines are fabricated by two types of printing methods. One is a conventional printing method which is able to quick fabrication of fine pattern line, but has various difficulties about thick and high resolution DPI(Dot per Inch) pattern lines because of bulge and piling up phenomenon. Another(Second) methods is sequential printing method which has a various merits of fabrication for fine, thick and high resolution pattern lines without bulge. In this work, conductivities of metal pattern line are investigated with respect to printing methods and pattern thickness. As a result, conductivity of thick pattern is about several un.

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광화학적 반응을 이용한 편극 패턴된 강유전체 표면에 금속 나노입자의 증착에 관한 연구 (Growth of Metal Nano-Particles on Polarity Patterned Ferroelectrics by Photochemical Reaction)

  • 박영식;김정훈;양우철
    • 한국진공학회지
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    • 제20권4호
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    • pp.300-306
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    • 2011
  • 본 연구는 편극 패턴된 강유전체 단결정 $LiNbO_3$ (0001) 기판에 광화학적 환원반응을 이용하여 금속(Au, Ag) 나노입자를 증착시키고, 금속 입자의 종류와 표면의 극성에 따른 나노입자의 표면 분포를 원자간력현미경(AFM)으로 조사하였다. 전극 인가에 의해 주기적으로 편극 패턴된 강유전체 단결정 $LiNbO_3$ (periodically polarity-patterned $LiNbO_3$: PPLN)을 기판으로 사용하였으며, PPLN의 각 영역의 편극 방향은 Piezoresponse force microscopy로 확인하였다. 금속(Ag, Au) 나노 입자는 금속이 포함된 수용액에 PPLN 기판을 넣고, 자외선 램프로 30초에서 3분간 노출시켜 광환원 반응으로 기판에 증착시켰다. 시료 성장후, 공기 중에서 AFM을 이용하여 나노입자의 형태, 크기, 및 표면분포를 조사하였다. Ag 입자의 경우, -Z 편극 영역보다 +Z 편극 영역에 크고 밀도가 높은 나노 입자가 증착되었으며, 특히 편극 경계 부분에 가장 큰 Ag 나노입자가 증착되어, 나노선 모양으로 성장됨이 확인되었다. 그러나 Au 입자의 경우는 편극 경계부분에 입자가 증착되는 경향이 없었다. 두 입자 모두 자외선 노출시간이 증가함에 따라, 증착된 나노입자의 크기는 증가하는 경향을 보였다. 이와 같이 증착된 금속 나노입자가 강유전체의 표면편극에 따라 다른 분포로 성장되는 것을 강유전체 표면 극성에 따른 표면 밴드구조 변화, 광전 효과 및 표면의 전기장의 불균일성에 의한 수용액 속의 금속 양이온과 자외선에 의해 생성된 전자와의 광화학적 반응에 대한 모델로 논의할 것이다.

연자성 복합체에서 파우더 크기 분포와 Epoxy Resin에 따른 Packing Density 변화 (The Variation of Packing Density According to Powder Size Distribution and Epoxy Resin in Soft Magnetic Composite)

  • 이창현;오세문;신효순;여동훈;김진호
    • 한국전기전자재료학회논문지
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    • 제30권12호
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    • pp.782-787
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    • 2017
  • There is growing interest in power inductors in which metal soft magnetic powder and epoxy resin are combined. In this field, the process technology for increasing the packing density of magnetic particles in an injection molding process is very important. However, little research has been reported in this regard. In order to improve the packing density, we investigated and compared the sedimentation heights of pastes for three types of soft magnetic alloy powders as a function of the mixing ratios and the type of resin used. Experimental results showed that the packing density was the highest (71.74%) when the mixing ratio was 80 : 16 : 4 (Sendust : Fe-S : CIP) according to the particle size using an SE-4125 resin. In addition, the packing density was found to be inversely related to the layer separation distance. As a result, it was confirmed that the dispersion of solid particles in the paste was important for curing; however, the duration of the curing process can greatly affect the packing density of the final composite.

용융 금속 TSV 충전을 위한 저열팽창계수 SiC 복합 충전 솔더의 개발 (Development of SiC Composite Solder with Low CTE as Filling Material for Molten Metal TSV Filling)

  • 고영기;고용호;방정환;이창우
    • Journal of Welding and Joining
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    • 제32권3호
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    • pp.68-73
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    • 2014
  • Among through silicon via (TSV) technologies, for replacing Cu filling method, the method of molten solder filling has been proposed to reduce filling cost and filling time. However, because Sn alloy which has a high coefficient of thermal expansion (CTE) than Cu, CTE mismatch between Si and molten solder induced higher thermal stress than Cu filling method. This thermal stress can deteriorate reliability of TSV by forming defects like void, crack and so on. Therefore, we fabricated SiC composite filling material which had a low CTE for reducing thermal stress in TSV. To add SiC nano particles to molten solder, ball-typed SiC clusters, which were formed with Sn powders and SiC nano particles by ball mill process, put into molten Sn and then, nano particle-dispersed SiC composite filling material was produced. In the case of 1 wt.% of SiC particle, the CTE showed a lowest value which was a $14.8ppm/^{\circ}C$ and this value was lower than CTE of Cu. Up to 1 wt.% of SiC particle, Young's modulus increased as wt.% of SiC particle increased. And also, we observed cross-sectioned TSV which was filled with 1 wt.% of SiC particle and we confirmed a possibility of SiC composite material as a TSV filling material.

Spray Pyrolysis에 의한 Manganese Oxide 입자의 제조 및 전기화학적 특성 (Preparation of Manganese Oxide Powders by Spray Pyrolysis and its Electrochemical Characterization)

  • 최원창;변동진;이중기;박달근;김현중
    • 한국재료학회지
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    • 제11권11호
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    • pp.936-940
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    • 2001
  • Spray pyrolysis is a favorable technique to form complex mixed-metal oxide powders with high purity in high temperature region. Manganese oxide powders were prepared by spray pyrolysis from an aqueous solution of $Mn(NO_3)_2$. Powders were formed in the temperature range of 500~$700^{\circ}C$ under the constant pressure of 300torr. All the powders have hydrous forms. When the temperature was increased, the size and the surface area of the particles decreased. An electrochemical capacitors were made with manganese oxide electrodes and KOH electrolyte. With the temperature decreased, capacitors showed high capacitance. Capacitor which was prepared with powders formed in the temperature $500^{\circ}C$ demonstrated specific capacitances as high as 83F/g.

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Experimental Studies on Plasmon Resonance of Ag Nanoparticles on Highly Ordered Pyrolytic Graphite (HOPG)

  • Lopez Salido, Ignacio;Bertram, Nils;Lim, Dong-Chan;Gantefor, Gerd;Kim, Young-Dok
    • Bulletin of the Korean Chemical Society
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    • 제27권4호
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    • pp.556-562
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    • 2006
  • Studies on Ag nanoparticles grown on Highly Ordered Pyrolytic Graphite (HOPG) using HREELS provide different results for smaller and larger particle sizes corresponding to Ag coverages below and above 4 monolayers, respectively. For the larger particles, a positive frequency shift with decreasing particle size and a broadening of the plasmon resonance were observed with decreasing particle size, in line with previous studies on Ag on alumina. For the smaller particles, in contrast, a shift to lower energy with decreasing particle size, and a narrowing of the plasmon resonance with decreasing particle size can be found. The asymmetry of the Ag-features present for Ag coverages above 4 monolayers disappears for Ag coverages below 4 monolayers. The result for the smaller particles can be rationalized in terms of change of the particle growth mode with increasing particle size, which corroborates our STM data, as well as electronic effects due to the metal/support charge transfer.

Ni-Al2O3 복합코팅의 마이크로 경도에 대한 공정변수의 영향 (Effect of Process Parameters on Microhardness of Ni-Al2O3 Composite Coatings)

  • 진영준
    • 한국산업융합학회 논문집
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    • 제25권6_2호
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    • pp.1037-1045
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    • 2022
  • In this study, nanoscale Al2O3 ceramic particles were used due its exceptionally high hardness characteristics, chemical stability, and wear resistance properties. These nanoparticles will be used to investigate the optimal process conditions for the electro co-deposition of the Ni-Al2O3 composite coatings. A Watts bath electrolytic solution of a controlled composition along with a fixed agitation speed was used for this study. Whereas the current density, the pH value, temperature and concentration of the nano Al2O3 particles of the electrolyte were designated as the manipulative variables. The experimental design method was based on the orthogonal array to find the optimum processing parameters for the electro co-deposition of Ni-Al2O3 composite coatings. The result of confirmation experimental based on the optimal processing condition through the analysis of variance ; EDX analysis found that the ratio of alumina increased to 8.65 wt.% and subsequently the overall hardness increased to 983 Hv. Specially, alumina were evenly distributed on Nickel matrix and particles were embedded more firmly and finely in Nickel matrix.