Development of SiC Composite Solder with Low CTE as Filling Material for Molten Metal TSV Filling |
Ko, Young-Ki
(Micro-Joining Center, Korea Institute of Industrial Technology (KITECH))
Ko, Yong-Ho (Micro-Joining Center, Korea Institute of Industrial Technology (KITECH)) Bang, Jung-Hwan (Micro-Joining Center, Korea Institute of Industrial Technology (KITECH)) Lee, Chang-Woo (Micro-Joining Center, Korea Institute of Industrial Technology (KITECH)) |
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