• 제목/요약/키워드: Multiple Package

검색결과 395건 처리시간 0.025초

장교 출신별 진출율을 고려한 다목표 인력계획모형 (Multiple Objective Manpower planing Model Considered with Advance Rate for Officer's Native)

  • 민계료
    • 한국국방경영분석학회지
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    • 제24권1호
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    • pp.157-175
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    • 1998
  • This paper develops multiple objective manpower planning model in order to design and adjust manpower structure and flow when advance rate for officer's native is considered. The state transition in manpower structure is analyzed using Markov chains. Multiple objectives in the model are security of advance rate, satisfaction of rank's number of personnel, and stability of the number of recruit personnel for officer's native. Trade - off of these objectives is made to evaluate manpower structure and flow. Solutions of this model are obtained by LINGO package.

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LED 패키지 솔더 접합부의 기계적 신뢰성에 미치는 리플로우 횟수의 영향 (Effect of Multiple Reflows on the Mechanical Reliability of Solder Joint in LED Package)

  • 이영철;김광석;안지혁;윤정원;고민관;정승부
    • 대한금속재료학회지
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    • 제48권11호
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    • pp.1035-1040
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    • 2010
  • The research efforts on GaN-based light-emitting diodes (LEDs) keep increasing due to their significant impact on the illumination industry. Surface mount technology (SMT) is widely used to mount the LED packages for practical application. In surface mount soldering both the device body and leads are intentionally heated by a reflow process. We studied on the effects of multiple reflows on microstructural variation and joint strength of the solder joints between the LED package and the substrate. In this study, Pb-free Sn-3.0Ag-0.5Cu solder and a finished pad with organic solderability preservatives (OSP) were employed. A $Cu_6Sn_5$ intermetallic compound (IMC) layer was formed during the multiple reflows, and the thickness of the IMC layerincreased with an increasing number of reflows. The shear force decreased after three reflows. From the observation of the fracture surface after a shear test, partially brittle fractures were observed after five reflows.

EPON망에서 ONU기반 멀티캐스트를 이용한 IPTV 채널 패키지 전송 서비스 (IPTV Channel Package Delivery in EPONs Using ONU-Based Multicast Emulation)

  • 최수일
    • 한국통신학회논문지
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    • 제33권4B호
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    • pp.224-231
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    • 2008
  • EPON은 가입자망의 병목현상을 해결할 경제적인 광대역 가입자망이다. EPON은 점대점 통신과 공유랜을 제공하기 위하여 다중점제어 프로토콜(MPCP)을 이용한다. 다중점제어 프로토콜은 논리적 링크 식별자(LLID)를 사용하여 점대다중점 형태로 연결된 ONU들을 논리적으로 구분한다. 본 논문에서는, 복수의 공유랜 또는 ONU기반 멀티캐스트를 제공하기 위하여 논리적 그룹 식별자(LGID)를 이용한다. 논리적 그룹 식별자를 활용하여 ONU기반 VLAN 서비스를 제공하면, EPON은 공급자와 가입자 사이에 설정된 채널들을 분리할 수 있다. 더불어, ONU기반 VLAN 서비스와 IGMP 스누핑을 통해 가입자에게 IPTV 채널 패키지를 제공하는 방안을 제안한다. 시뮬레이션을 통해 제안된 방안이 빠른 채널 전환 시간을 제공함을 보임으로써 EPON망에서 효과적인 IPTV 서비스 제공방안임을 보인다.

알루미늄 양극산화를 사용한 LED COB 패키지 (ED COB Package Using Aluminum Anodization)

  • 김문정
    • 한국산학기술학회논문지
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    • 제13권10호
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    • pp.4757-4761
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    • 2012
  • 알루미늄 기판 및 양극산화 공정을 사용하여 LED Chip on Board(COB) 패키지를 제작하였다. 선택적 양극산화 공정을 적용하여 알루미늄 기판 상에 알루미나를 형성하고 이를 COB 패키지 절연층으로 사용하였으며, 비아홀 내부가 충진된 구조의 Thermal Via를 구현하였다. 패키지 기판 종류에 따른 열저항 및 발광효율 변화를 파악하기 위해 알루미늄 기판과 알루미나 기판을 제작하고 이를 각각 비교 분석하였다. Thermal Via가 적용된 알루미늄 기판이 51%의 열저항 개선 및 14%의 발광효율 향상 특성을 보여주었다. 이러한 결과는 선택적 양극산화 공정 및 Thermal Via 구조적용으로 COB 패키지의 방열 특성이 향상되었음을 의미한다. 또한 동일한 전력 소모시 LED 칩 개수에 따른 COB 패키지의 열저항 및 발광효율 변화를 분석함으로써 다수 칩의 효율적인 배치가 열저항 및 발광효율을 증가시킬 수 있음을 확인하였다.

CSP의 Multi-sorting을 위한 pick and place 시스템의 개발 (The development of Pick and place system for multi-sorting of CSP)

  • 김찬용;곽철훈;이은상
    • 한국정밀공학회:학술대회논문집
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    • 한국정밀공학회 1997년도 추계학술대회 논문집
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    • pp.171-174
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    • 1997
  • The great development of semiconductor industry demands the high efficiency and performance of related device, but the pick and place system of semiconductor packaging device can load a few units until nowdays. Although the system can load a lot of units, it can work multiple sort operation. The defect like that causes a low efficiency. Therefore, this paper represents the development of pick and place system which can work multiple sort operation.

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CSpeech(Version 3.1)

  • Sik, Choe-Hong
    • 대한음성언어의학회:학술대회논문집
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    • 대한음성언어의학회 1995년도 제4회 학술대회 심포지움 및 워크샵
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    • pp.141-153
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    • 1995
  • CSpeech is a software package that implements an audio waveform/speech analysis workstation on an IBM Personal Computer or hardware compatible computer. Features include digitizing audio waveforms on single or multiple channels, displaying the digitized waveforms, playing back audio waveforms from selected intervals of sing1e channels, saving and retrieving waveforms from binary format disk files, and analysing audio waveforms for their temporal and spectral properties. The distinguishing characteristics of CSpeech are its support for multiple channels, minimal restrictions on sample rate and waveform duration support fur a variety of hardware configurations, fast graphics display, and its user- extensible menu- based command structure.

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물리치료학에서의 PBL 학습교재 개발 및 적용 (The Development and Implementation of Problem-Based Learning Package in Physical Therapy)

  • 황현숙;정진우;임종수
    • 대한물리치료과학회지
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    • 제9권4호
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    • pp.83-94
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    • 2002
  • Within physical therapy education, there has been increased attention to curricula and course that emphasize problem solving, clinical reasoning, and synthesis of information across traditional discipline-specific boundaries. This article describes the development implementation, and outcomes of a problem-based learning course in Physical therapy. The course was designed to help students to integrate the various elements of a physical therapy curriculum and to enhance their abilities to respond to an ever-changing health care environment. An evaluation of the course by the first 50 students who completed it revealed both strengths and weaknesses. Students responded that the course enhanced their professional behavior, including interpersonal communication skills, team work, and follow-through with professional responsibilities. The learning package was developed by the authors and implemented to a college students during three weeks of the first semester of 2001. Most studies which conducted PBL module development were short period or temporary PBL package application and evaluation rather than a whole semester's. While, this study carried on partial integrated PBL curriculum development and application with recomposing content of the two subjects to one subject Physical therapy which includes four PBL packages. This package was developed from a simple concept to complex and partial integrated PBL curriculum application systematically variable learning methods such as discussion, practice, lecture, video. There are 2 classes, each class has 25 students, in the college. Each class has 5 small groups consisting 5 students. Two tutors proceeded discussion charging each class also, they used multiple methods and materials like tutorials, self-directed learning, lecture, and video. The package is 5 grades and 5 hours per week and the rate of discussion, lecture is 4, 1 respectively. One of the most change is the increase of interaction between students and tutors. Whenever students need information and suggestion, they can visit tutors who provide reading materials and guide for the direction of self learning. Therefore, this study describes the PBL package development process and application during one semester recomposing contents of two subjects to Physical therapy concepts. Besides, it will contribute to active application of existing each subject to tutors who intend to convert as PBL methods. The study has significant meaning to show potentiality of partially integrated PBL application, using systematic PBL package development from two subjects contents. However, when students' need of yearning is over the extent of Introduction of Physical therapy and Rehabilitation medicine, tutors should set learning extent. So, there is limitation to attain completely integrated PBL education within one subject, therefore, it is high lighted to proceed development of integrated curriculum to maximize learning effects of PBL. It is exected that partial integrated PBL package development and application will distribute to prosper excellent physiotherapist in practice.

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여행 패키지의 묶음판매 전략에 관한 연구 (Effect of Bundling Strategy on Tourists' Evaluation of Tour Packages)

  • 김승리;이동희
    • 국제지역연구
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    • 제16권1호
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    • pp.53-74
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    • 2012
  • 묶음판매(bundling) 전략이란 2개 이상의 제품이나 서비스를 단일 가격으로 판매하는 마케팅 방법으로 여행사들은 적은 비용으로 많은 상품을 판매하위 위한 수단으로 여행 패키지라는 묶음판매 전략을 사용하고 있다. 본 논문은 여행 패키지의 묶음판매(bundling) 전략에 관하여 연구하였다. 이를 위해 美 북동부와 캐나다를 10일간 여행하는 여행 패키지 상품을 상정하였다. 연구자들은 여행 패키지를 2(pure bundling vs. mixed bundling) ${\times}$ 3(0% lower than sum, 10% lower than sum, 20% lower than sum) ${\times}$ 3(not at all related, somewhat related, very related)의 54개의 여행 패키지로 디자인 하였다. 조사 자료에 대한 분석방법은 변수들의 신뢰도와 타당도를 검증하기 위해 실뢰도 계수인 Cronbach's ${\alpha}$ 계수와 요인분석을 이용하였고 가설검증을 위하여 t-test와 ANOVA를 사용하여 실증분석 하였다. 실증 분석결과 연구자들의 예상대로 여행 패키지를 구성하는 개별적인 여행 구성상품들의 개수와 구성상품들의 할인율 그리고 여행 패키지 구성상품들 사이의 기능적인(functional) 관계가 관광객들의 인식에 차이를 미쳤다. 결과적으로 관광객들은 할인율의 폭이 크던 작던 일정 정도의 여행 패키지에 대한 할인을 기대하였으며, 여행 패키지를 구성하는 개별상품들의 개수가 많아지는 방향을 선호하였다. 또한 여행 패키지를 구성하는 개별상품들 간의 관계가 이질적인 여행 패키지를 선호하는 것으로 밝혀졌다.

Board Level Reliability Evaluation for Package on Package

  • 황태경
    • 한국마이크로전자및패키징학회:학술대회논문집
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    • 한국마이크로전자및패키징학회 2007년도 SMT/PCB 기술세미나
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    • pp.37-47
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    • 2007
  • Factor : Structure Metal pad & SMO size Board level TC test : - Large SMO size better Board level Drop test : - Large SMO size better Factor : Structure Substrate thickness Board level TC test : - Thick substrate better Board level Drop test : - Substrate thickness is not a significant factor for drop test Factor : Material Solder alloy Board level TC test : - Not so big differences over Pb-free solder and NiAu, OSP finish Board level Drop test : - Ni/Au+SAC105, CuOSP+LF35 are better Factor : Material Pad finish Board level TC test : - NiAu/NiAu is best Board livel Drop test : - CuOSP is best Factor : Material Underfill Board level TC test - Several underfills (reworkable) are passed TCG x500 cycles Board level Drop test : - Underfill lots have better performance than non-underfill lots Factor : Process Multiple reflow Board level TC test : - Multiple reflow is not a significant actor for TC test Board level Drop test : N/A Factor : Process Peak temp Board level TC test : - Higher peak temperature is worse than STD Board level Drop test : N/A Factor : Process Stack method Board level TC test : - No big difference between pre-stack and SMT stack Board level Drop test : - Flux dipping is better than paste dipping but failure rate is more faster

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Dynamic stability and structural improvement of vibrating electrically curved composite screen subjected to spherical impactor: Finite element and analytical methods

  • Xiao, Caiyuan;Zhang, Guiju
    • Steel and Composite Structures
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    • 제43권5호
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    • pp.533-552
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    • 2022
  • The current article deals with the dynamic stability, and structural improvement of vibrating electrically curved screen on the viscoelastic substrate. By considering optimum value for radius curvature of the electrically curved screen, the structure improvement of the system occurs. For modeling the electrically system, the Maxwell's' equation is developed. Hertz contact model in employed to obtain contact forces between impactor and structure. Moreover, variational methods and nonlinear von Kármán model are used to derive boundary conditions (BCs) and nonlinear governing equations of the vibrating electrically curved screen. Galerkin and Multiple scales solution approach are coupled to solve the nonlinear set of governing equations of the vibrating electrically curved screen. Along with the analytical solution, 3D finite element simulation via ABAQUS package is provided with the aid of a FE package for simulating the current system's response. The results are categorized in 3 different sections. First, effects of geometrical and material parameters on the vibrational performance and stability of the curves panel. Second, physical properties of the impactor are taken in to account and their effect on the absorbed energy and velocity profile of the impactor are presented. Finally, effect of the radius and initial velocity on the mode shapes of the current structure is demonstrated.