• Title/Summary/Keyword: Multiple Package

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Multiple Objective Manpower planing Model Considered with Advance Rate for Officer's Native (장교 출신별 진출율을 고려한 다목표 인력계획모형)

  • 민계료
    • Journal of the military operations research society of Korea
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    • v.24 no.1
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    • pp.157-175
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    • 1998
  • This paper develops multiple objective manpower planning model in order to design and adjust manpower structure and flow when advance rate for officer's native is considered. The state transition in manpower structure is analyzed using Markov chains. Multiple objectives in the model are security of advance rate, satisfaction of rank's number of personnel, and stability of the number of recruit personnel for officer's native. Trade - off of these objectives is made to evaluate manpower structure and flow. Solutions of this model are obtained by LINGO package.

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Effect of Multiple Reflows on the Mechanical Reliability of Solder Joint in LED Package (LED 패키지 솔더 접합부의 기계적 신뢰성에 미치는 리플로우 횟수의 영향)

  • Lee, Young-Chul;Kim, Kwang-Seok;Ahn, Ji-Hyuk;Yoon, Jeong-Won;Ko, Min-Kwan;Jung, Seung-Boo
    • Korean Journal of Metals and Materials
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    • v.48 no.11
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    • pp.1035-1040
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    • 2010
  • The research efforts on GaN-based light-emitting diodes (LEDs) keep increasing due to their significant impact on the illumination industry. Surface mount technology (SMT) is widely used to mount the LED packages for practical application. In surface mount soldering both the device body and leads are intentionally heated by a reflow process. We studied on the effects of multiple reflows on microstructural variation and joint strength of the solder joints between the LED package and the substrate. In this study, Pb-free Sn-3.0Ag-0.5Cu solder and a finished pad with organic solderability preservatives (OSP) were employed. A $Cu_6Sn_5$ intermetallic compound (IMC) layer was formed during the multiple reflows, and the thickness of the IMC layerincreased with an increasing number of reflows. The shear force decreased after three reflows. From the observation of the fracture surface after a shear test, partially brittle fractures were observed after five reflows.

IPTV Channel Package Delivery in EPONs Using ONU-Based Multicast Emulation (EPON망에서 ONU기반 멀티캐스트를 이용한 IPTV 채널 패키지 전송 서비스)

  • Choi, Su-Il
    • The Journal of Korean Institute of Communications and Information Sciences
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    • v.33 no.4B
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    • pp.224-231
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    • 2008
  • EPONs are a low cost, high speed solution to the bottleneck problem of broadband access networks. To support point-to-point and shared LAN emulation, EPONs use the multi-point control protocol (MPCP), which uses logical link identification (LLID) for frame tagging and filtering between the OLT and ONUs. In this paper, ONU-based multicast or multiple shared LAN emulation is used for IPTV channel package delivery services. Using ONU-based VLAN services, EPONs can support separate and secure connections between providers and subscribers in a simple manner. Also, IPTV channel packages can be delivered through EPONs by implementing ONU-based VLAN and IGMP snooping mechanisms. By showing fast channel zapping time of proposed architecture, I show that EPONs is suitable for IPTV channel package delivery service.

ED COB Package Using Aluminum Anodization (알루미늄 양극산화를 사용한 LED COB 패키지)

  • Kim, Moonjung
    • Journal of the Korea Academia-Industrial cooperation Society
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    • v.13 no.10
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    • pp.4757-4761
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    • 2012
  • LED chip on board(COB) package has been fabricated using aluminum substrate and aluminum anodization process. An alumina layer, used as a dielectric in COB substrate, is produced on aluminum substrate by selective anodization process. Also, selective anodization process makes it possible to construct a thermal via with a fully-filled via hole. Two types of the COB package are fabricated in order to analyze the effects of their substrate types on thermal resistivity and luminous efficiency. The aluminum substrate with the thermal via shows more improved measurement results compared with the alumina substrate. These results demonstrate that selective anodization process and thermal via can increase heat dissipation of COB package in this work. In addition, it is proved experimentally that these parameters also can be enhanced using efficient layout of multiple chip in the COB package.

The development of Pick and place system for multi-sorting of CSP (CSP의 Multi-sorting을 위한 pick and place 시스템의 개발)

  • 김찬용;곽철훈;이은상
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 1997.10a
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    • pp.171-174
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    • 1997
  • The great development of semiconductor industry demands the high efficiency and performance of related device, but the pick and place system of semiconductor packaging device can load a few units until nowdays. Although the system can load a lot of units, it can work multiple sort operation. The defect like that causes a low efficiency. Therefore, this paper represents the development of pick and place system which can work multiple sort operation.

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CSpeech(Version 3.1)

  • Sik, Choe-Hong
    • Proceedings of the KSLP Conference
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    • 1995.11a
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    • pp.141-153
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    • 1995
  • CSpeech is a software package that implements an audio waveform/speech analysis workstation on an IBM Personal Computer or hardware compatible computer. Features include digitizing audio waveforms on single or multiple channels, displaying the digitized waveforms, playing back audio waveforms from selected intervals of sing1e channels, saving and retrieving waveforms from binary format disk files, and analysing audio waveforms for their temporal and spectral properties. The distinguishing characteristics of CSpeech are its support for multiple channels, minimal restrictions on sample rate and waveform duration support fur a variety of hardware configurations, fast graphics display, and its user- extensible menu- based command structure.

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The Development and Implementation of Problem-Based Learning Package in Physical Therapy (물리치료학에서의 PBL 학습교재 개발 및 적용)

  • Hwang, Hyun-Sook;Chung, Jin-Woo;Lim, Jong-Soo
    • Journal of Korean Physical Therapy Science
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    • v.9 no.4
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    • pp.83-94
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    • 2002
  • Within physical therapy education, there has been increased attention to curricula and course that emphasize problem solving, clinical reasoning, and synthesis of information across traditional discipline-specific boundaries. This article describes the development implementation, and outcomes of a problem-based learning course in Physical therapy. The course was designed to help students to integrate the various elements of a physical therapy curriculum and to enhance their abilities to respond to an ever-changing health care environment. An evaluation of the course by the first 50 students who completed it revealed both strengths and weaknesses. Students responded that the course enhanced their professional behavior, including interpersonal communication skills, team work, and follow-through with professional responsibilities. The learning package was developed by the authors and implemented to a college students during three weeks of the first semester of 2001. Most studies which conducted PBL module development were short period or temporary PBL package application and evaluation rather than a whole semester's. While, this study carried on partial integrated PBL curriculum development and application with recomposing content of the two subjects to one subject Physical therapy which includes four PBL packages. This package was developed from a simple concept to complex and partial integrated PBL curriculum application systematically variable learning methods such as discussion, practice, lecture, video. There are 2 classes, each class has 25 students, in the college. Each class has 5 small groups consisting 5 students. Two tutors proceeded discussion charging each class also, they used multiple methods and materials like tutorials, self-directed learning, lecture, and video. The package is 5 grades and 5 hours per week and the rate of discussion, lecture is 4, 1 respectively. One of the most change is the increase of interaction between students and tutors. Whenever students need information and suggestion, they can visit tutors who provide reading materials and guide for the direction of self learning. Therefore, this study describes the PBL package development process and application during one semester recomposing contents of two subjects to Physical therapy concepts. Besides, it will contribute to active application of existing each subject to tutors who intend to convert as PBL methods. The study has significant meaning to show potentiality of partially integrated PBL application, using systematic PBL package development from two subjects contents. However, when students' need of yearning is over the extent of Introduction of Physical therapy and Rehabilitation medicine, tutors should set learning extent. So, there is limitation to attain completely integrated PBL education within one subject, therefore, it is high lighted to proceed development of integrated curriculum to maximize learning effects of PBL. It is exected that partial integrated PBL package development and application will distribute to prosper excellent physiotherapist in practice.

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Effect of Bundling Strategy on Tourists' Evaluation of Tour Packages (여행 패키지의 묶음판매 전략에 관한 연구)

  • Kim, Seung Lee;Lee, Dong Hee
    • International Area Studies Review
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    • v.16 no.1
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    • pp.53-74
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    • 2012
  • The bundling of multiple products/services at a set price has become a popular marketing strategy. However, little is known on how effects of bundling strategy influence tourists' evaluation of tour packages. Tourists evaluate a tour package based on the trade-off between the perceived benefits and costs involved in purchasing the tour package. In other words, the perceived value of the tour package influenced whether tourists to purchase a tour package or not. This study tested a tour package based on the theory of bundling, taking a moderating approach with perceived value. The data for this study wascollected by subjects who live Seoul Metropolitan Area and Gyeonggi Province and 4234 respondents, potential tourists to northeastern U.S.A/Canada. Results show that bundling taken by travel agencies include how many product items to put in a tour package and what degree of discount for the tour package. Also explaining functional relationship among product items in the tour package. Result show that tourists expect a discount, large or small, from purchasing a tour package. And the larger the number of products in a tour packages, the larger the discount size, and low functional relationship among items tourists expect to get.

Board Level Reliability Evaluation for Package on Package

  • Hwang, Tae-Gyeong;Chung, Ji-Young
    • Proceedings of the International Microelectronics And Packaging Society Conference
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    • 2007.04a
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    • pp.37-47
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    • 2007
  • Factor : Structure Metal pad & SMO size Board level TC test : - Large SMO size better Board level Drop test : - Large SMO size better Factor : Structure Substrate thickness Board level TC test : - Thick substrate better Board level Drop test : - Substrate thickness is not a significant factor for drop test Factor : Material Solder alloy Board level TC test : - Not so big differences over Pb-free solder and NiAu, OSP finish Board level Drop test : - Ni/Au+SAC105, CuOSP+LF35 are better Factor : Material Pad finish Board level TC test : - NiAu/NiAu is best Board livel Drop test : - CuOSP is best Factor : Material Underfill Board level TC test - Several underfills (reworkable) are passed TCG x500 cycles Board level Drop test : - Underfill lots have better performance than non-underfill lots Factor : Process Multiple reflow Board level TC test : - Multiple reflow is not a significant actor for TC test Board level Drop test : N/A Factor : Process Peak temp Board level TC test : - Higher peak temperature is worse than STD Board level Drop test : N/A Factor : Process Stack method Board level TC test : - No big difference between pre-stack and SMT stack Board level Drop test : - Flux dipping is better than paste dipping but failure rate is more faster

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Dynamic stability and structural improvement of vibrating electrically curved composite screen subjected to spherical impactor: Finite element and analytical methods

  • Xiao, Caiyuan;Zhang, Guiju
    • Steel and Composite Structures
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    • v.43 no.5
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    • pp.533-552
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    • 2022
  • The current article deals with the dynamic stability, and structural improvement of vibrating electrically curved screen on the viscoelastic substrate. By considering optimum value for radius curvature of the electrically curved screen, the structure improvement of the system occurs. For modeling the electrically system, the Maxwell's' equation is developed. Hertz contact model in employed to obtain contact forces between impactor and structure. Moreover, variational methods and nonlinear von Kármán model are used to derive boundary conditions (BCs) and nonlinear governing equations of the vibrating electrically curved screen. Galerkin and Multiple scales solution approach are coupled to solve the nonlinear set of governing equations of the vibrating electrically curved screen. Along with the analytical solution, 3D finite element simulation via ABAQUS package is provided with the aid of a FE package for simulating the current system's response. The results are categorized in 3 different sections. First, effects of geometrical and material parameters on the vibrational performance and stability of the curves panel. Second, physical properties of the impactor are taken in to account and their effect on the absorbed energy and velocity profile of the impactor are presented. Finally, effect of the radius and initial velocity on the mode shapes of the current structure is demonstrated.