• Corrosion Science and Technology
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• v.5 no.3
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• pp.112-116
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• 2006

This study has been conducted to monitor the corrosion rate of cathodically protected structure and corrosion inhibited system using multi-line thin-film electrical resistance (TFER) sensor in various environments. The field test data of TFER sensor for the corrosion monitoring of cathodically protected underground pipeline in soil environments and of corrosion inhibited gas heaters were also presented. The sensor was found to be a powerful method to commit the sensitive pick-up of small corrosion rate which can be observed in the cathodically protected and corrosion inhibited systems.

• Proceedings of the Korean Institute of IIIuminating and Electrical Installation Engineers Conference
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• 2004.05a
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• pp.358-360
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• 2004

To reduce the earth resistance, earth electrode are installed horizontally or vertically in the earth. There are two kinds of vertical earth electrode methods, one is a deep-driven rod and another is slight-driven parallel rods. Bibliography have so far analyzed the earth resistance calcalation of a rod type electrode and parallel rods type for the multi-layered earth. Befor long, We are going to study earth resistance of deep-driven rod and slight-driven parallel rods in the multi-layered earth with reference to bibliography.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.49 no.2
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• pp.9-14
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• 2012

In this study, multi-finger RF MOSFET substrate parameters are accurately extracted by using S-parameters measured from common source-bulk and common source-gate test structures. Using this extraction method, the accuracy of an asymmetrical model with three substrate resistances is verified by observing better agreement with measured Y-parameters than a simple model with a single substrate resistance. The modeled S-parameters of the asymmetrical model also show excellent agreement with measured ones up to 20GHz.

• Proceedings of the KWS Conference
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• 2002.10a
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• pp.809-815
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• 2002

For clarifying the mechanical phenomena of thermal elasto-plastic behavior on the multi-spot welded joints, this study has tried to carry out three-dimensional thermal elasto-plastic analysis on them. However, because the shape of multi-spot welded joints is not axi-symmetric, unlike the case of single-spot welded joint, the solution domain for simulation should be three-dimensional. Therefore, in this paper, from the results analyzed using the developed the three dimensional unstationary heat conduction and thermal elasto-plastic programs by an iso-parametric finite element method, mechanical characteristics and their production mechanism on single- and multispot welded joints were clarified. Moreover, effects of pitch length on temperature, welding residual stresses and plastic strain of multi-spot welded joints were evaluated, indicating that a pitch of 30mm was advantageous compared to a pitch of 15mm.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2003.06a
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• pp.1853-1856
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• 2003

Multi-layer printed circuit board(PCB) is being used widely for the product with relatively complex circuits such as TV, VTR and FAX. With the rapid enlargement of electronic and IT industry, the hole machining technology on multi-layer PCB is increasingly required to improve. Thus, the micro drilling with ultrasonic vibration can be a good method for hole machining. Unlike conventional drilling, ultrasonic vibration applied drilling introduces less wear and fracture of not only tool but also internal surface of workpiece due to little cutting resistance, thus, machinability can be improved. The experiment is conducted through the comparison between the results of conventional drilling and ultrasonic micro drilling as well as among each results by the variation according to not only feed rate of drill but also amplitude and frequency of ultrasonic vibration. The multi-layer PCB consists of 6 layers and ${\Phi}$0.3 diameter drill was used. As a result, it was found that the state of internal surfaces of holes on multiple layer PCBs is improved by the application of ultrasonic vibration.

• Journal of Powder Materials
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• v.26 no.1
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• pp.11-15
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• 2019

In this study, a method to remove residual powder on a multi-layered graphene and a new approach to transfer multi-layered graphene at once are studied. A graphene one-step transfer (GOST) method is conducted to minimize the residual powder comparison with a layer-by-layer transfer. Furthermore, a residual powder removing process is investigated to remove residual powder at the top of a multi-layered graphene. After residual powder is removed, the sheet resistance of graphene is decreased from 393 to 340 Ohm/sq in a four-layered graphene. In addition, transmittance slightly increases after residual powder is removed from the top of the multi-layered graphene. Optical and atomic-force microscopy images are used to analyze the graphene surface, and the Ra value is reduced from 5.2 to 3.7 nm following residual powder removal. Therefore, GOST and residual powder removal resolve the limited application of graphene electrodes due to residual powder.

• Korean Chemical Engineering Research
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• v.50 no.3
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• pp.403-409
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• 2012

Polyurethane prepolymers were prepared from poly (carbonate diol), isophrone diisocyanate, and dimethylol propionic acid. Then, aniline terminated waterborne polyurethane dispersion (ATWPUD) was synthesized by capping aniline on the NCO group of the prepolymer. Subsequently, ATWPUD was mixed with multi-walled carbon nanotube (MWCNT) to yield coating solutions, and the mixture was coated on the polycarbonate substrate. The surface resistance ($10^{7.6}{\sim}10^{7.7}{\Omega}/cm^2$) of coating films from ATWPUD showed better conducting properties than that ($10^{10.9}{\Omega}/cm^2$) from pure waterborne polyurethane dispersion (WPUD) when MWCNT was mixed. Also, the surface resistance of coating films was increased, but the pencil hardness and adhesion were decreased with increasing the amount of MWCNT added in the ATWPUD.

• Korean Journal of Metals and Materials
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• v.47 no.9
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• pp.591-596
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• 2009

$TiN_xO_y/TiN_x$ multi-layer thin films with a high resistance(${\sim}k{\Omega}$) were deposited on $SiO_2/Si$ substrates at room temperature by sputtering. The $TiN_x$ thin films show island and smooth surface morphology in samples prepared by ${\alpha}$ and RF magnetron sputtering, respectively. $TiN_xO_y/TiN_x$ multi-layer in has been developed to control temperature coefficient of resistance(TCR) by the incorporation of $TiN_x$ layer(positive TCR) inserted into $TiN_xO_y$ layers(negative TCR). Electrical and structural properties of sputtered $TiN_xO_y/TiN_x$ multi-layer films were investigated as a function of annealing temperature. In order to achieve a stable high resistivity, multi-layer films were annealed at various temperatures in oxygen ambient. Samples annealed at $700^{\circ}C$ for 1 min exhibited good TCR value of approximately $-54 ppm/^{\circ}C$ and a stable high resistivity around $20k{\Omega}/sq$. with good reversibility.

• Steel and Composite Structures
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• v.47 no.2
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• pp.253-267
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• 2023

The bearing capacities resisted by the two-bay beams of multi-story planar frames with unequal spans under column removal scenarios differ considerably owing to the asymmetric stress on the left and right beams connected to the failed column and cause the potential for beams with larger span-to-depth ratios to be unable to exert effectively, which is disadvantageous for resisting the vertical load in unequal-span frame structures. To address this problem, the structural measure of adding braces to the weak bays of multi-story unequal-span frames was proposed, with the objective of achieving a coordinated stress state in two-bay beams with unequal spans, thereby improving the collapse resistance of unequal-span frame structures. Before conducting the numerical simulation, the modeling methods were verified by previous experimental results of two multi-story planar frames with and without steel braces. Thereafter, the effects of the tensile and compressive braces on the collapse behavior of the frame structures were elucidated. Then, based on the mechanical action laws of the braces throughout the collapse process, a detailed design method for improving the collapse resistance of unequal-span frame structures was proposed. Finally, the proposed design method was verified by using sufficient example models, and the results demonstrated that the design method has good application prospects and high practical value.

• Transactions of the Korean Society of Machine Tool Engineers
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• v.11 no.4
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• pp.6-11
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• 2002

Formability in deep drawing process depends not only on a drawability of workpiece material but also on process conditions such as die punch comer radius, lubricant conditions, punch-die clearance etc. For instance, bending resistance should be reduced by increasing die round appropriately, drawing load should be minimized by improving the lubricant condition between die and material, and blanking load should be increased by selecting a pertinent punch round and by augmenting the friction resistance in punch. In this study, a multi-stage deep drawing process is analyzed using ABAQUS. The effects of formability factors, such as die shoulder radius, punch-die clearance and friction coefficient are investigated, and the results are also discussed in detail.