• Journal of the Institute of Electronics Engineers of Korea CI
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• v.47 no.6
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• pp.57-67
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• 2010

This paper studies thermal characteristics of a mix of CPU-intensive and memory-intensive application workloads on a multi-core processor. Especially, we focus on thermal variations during program execution because thermal variations are more critical than average temperatures and their ranges for thermal management. New metrics are proposed to quantify such thermal variations for a workload. We study the thermal variations using SPEC CPU2006 benchmarks with varying cooling conditions and frequencies on an Intel Core 2 Duo processor. The results show that applications have distinct thermal variations characteristics. Such variations are affected by cooling conditions,operating frequencies and multiprogramming workload. Also, there are distinct spatial thermal variations between cores. Our new metrics and their results from this study provide useful insight for future research on multi-core thermal management.

• The KIPS Transactions:PartA
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• v.18A no.2
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• pp.45-52
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• 2011

In the past, a patient went to the room where an ultrasound image diagnosis device was set, and then he or she was examined by a doctor. However, currently a doctor can go and examine the patient with a handheld ultrasound device who stays in a room. However, it was implemented with only fundamental functions, and can not meet the high performance required by the focusing algorithm of ultrasound beam which determines the quality of ultrasound image. In addition, low energy consumption was satisfied for the mobile ultrasound device. To satisfy these requirements, this paper proposes a high-performance and low-power single instruction, multiple data (SIMD) based multi-core processor that supports a representative beamforming algorithm out of several focusing methods of mobile ultrasound image signals. The proposed SIMD multi-core processor, which consists of 16 processing elements (PEs), satisfies the high-performance required by the beamforming algorithm by exploiting considerable data-level parallelism inherent in the echo image data of ultrasound. Experimental results showed that the proposed multi-core processor outperforms a commercial high-performance processor, TI DSP C6416, in terms of execution time (15.8 times better), energy efficiency (6.9 times better), and area efficiency (10 times better).

• Journal of Platform Technology
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• v.10 no.2
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• pp.3-9
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• 2022

In this paper, to maximize the performance of the scatter communication in multi-core and many-core processors, a technique that considers the communication situation of the processing node is applied to a multi-core processor composed of 32 processing nodes. Since the existing scatter algorithm cannot recognize the communication conditions of the processing nodes, communication is generally performed according to an initially set transmission order. In this case, scatter communication starts only after the communication currently being performed by all processing nodes inside the processor is finished. The scatter communication performance was improved by this technique, and it was confirmed that there was a performance improvement of up to 78.93% compared to the existing algorithm through BFM simulation.

• Journal of the Korea Society of Computer and Information
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• v.18 no.10
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• pp.13-21
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• 2013

Recently, although the number of cores on a chip multi-processor increases, multi-programming or multi-threaded programming techniques to utilize the whole cores are still insufficient. Therefore, there inevitably exist some idle cores which are not working. This results in a waste of the caches, so-called idle caches which are dedicated to those idle cores. In this research, we propose amethodology to exploit idle caches effectively as victimcaches of on-chip memory resource. In simulation results, we have achieved 19.4%and 10.2%IPC improvement in 4-core and 16-core respectively, compared to previous technique.

• Journal of IKEEE
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• v.21 no.3
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• pp.185-194
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• 2017

In this paper, a modular platform for wearable devices is proposed which can be easily assembled by exchanging functions according to various field and environment conditions. The proposed modular platform consists of a 32-bit RISC CPU, a 32-bit symmetric multi-core processor, and a 16-bit DSP. It also includes a plug & play features which can quickly respond to various environments. The sensing and communication modules are connected in the form of a chain. This work is implemented in a standard 130 nm CMOS technology and the proposed modular wearable platforms are verified with temperature and humidity sensors.

• Journal of the Korea Institute of Information Security & Cryptology
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• v.21 no.6
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• pp.161-169
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• 2011

Recent intelligent video surveillance system asks for development of more advanced technology for analysis and recognition of video data. Especially, machine learning algorithm such as Support Vector Machine (SVM) is used in order to recognize objects in video. Because SVM training demands massive amount of computation, parallel processing technique is necessary to reduce the execution time effectively. In this paper, we propose a parallel processing method of SVM training with a multi-core processor. The results of parallel SVM on a 4-core processor show that our proposed method can reduce the execution time of the sequential training by a factor of 2.5.

• JSTS:Journal of Semiconductor Technology and Science
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• v.3 no.4
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• pp.194-198
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• 2003

A 16-bit adiabatic low-power Micro-processor core is designed. The processor consists of control block, multi-port register file and ALU. A simplified four-phase clock generator is designed to provide supply clocks for adiabatic processor. All the clock line charge on the capacitive interconnections is recovered to recycle the energy. Adiabatic circuits are designed based on ECRL(efficient charge recovery logic) and $0.35\mu\textrm$ CMOS technology is used. Simulation results show that the power consumption of the adiabatic Microprocessor core is reduced by a factor of 2.9~3.1 compared to that of conventional CMOS Microprocessor

• The Journal of the Institute of Internet, Broadcasting and Communication
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• v.14 no.3
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• pp.163-169
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• 2014

Recently, the importance of multicore processor system is growing rapidly. Multicore processors are classified either as symmetric or asymmetric. Asymmetric multicore processors consist of a high performance complex core and number of low performance simple cores, and are known to be more efficient than symmetric multicore processors. Therefore, performance impact on various configurations of asymmetric multi-core processor needs to be studied. Using SPEC 2000 benchmarks as input, the trace-driven simulation has been performed for different asymmetric quad-core and octa-core processors and compared to the corresponding symmetric ones.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.47 no.7
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• pp.52-60
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• 2010

In this paper, we propose a dynamic power management framework for multi-core systems. We reduced the power consumption of multi-core processors such as Intel Centrino Duo and ARM11 MPCore, which have been used at the consumer electronics and personal computer market. Each processor uses a different technique to save its power usage, but there is no embedded multi-core processor which has a precise power control mechanism such as dynamic voltage scaling technique. The proposed dynamic power management framework is suitable for smart phones which have an operating system to provide multi-processing capability. Basically, our framework follows an intuitive idea that reducing the power consumption of idle cores is the most effective way to save the overall power consumption of a multi-core processor. We could minimize the energy consumption used by idle cores with application-targeted policies that reflect the characteristics of active workloads. We defined some properties of an application to analyze the performance requirement in real time and automated the management process to verify the result quickly. We tested the proposed framework with popular processors such as Intel Centrino Duo and ARM11 MPCore, and were able to find that our framework dynamically reduced the power consumption of multi-core processors and satisfied the performance requirement of each program.

• The KIPS Transactions:PartA
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• v.17A no.6
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• pp.265-274
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• 2010

As the process technology scales down and integration densities continue to increase, interconnection has become one of the most important factors in performance of recent multi-core processors. Recently, to reduce the delay due to interconnection, 3D architecture has been adopted in designing multi-core processors. In 3D multi-core processors, multiple cores are stacked vertically and each core on different layers are connected by direct vertical TSVs(through-silicon vias). Compared to 2D multi-core architecture, 3D multi-core architecture reduces wire length significantly, leading to decreased interconnection delay and lower power consumption. Despite the benefits mentioned above, 3D design technique cannot be practical without proper solutions for hotspots due to high temperature. In this paper, we propose three floorplan schemes for reducing the peak temperature in 3D multi-core processors. According to our simulation results, the proposed floorplan schemes are expected to mitigate the thermal problems of 3D multi-core processors efficiently, resulting in improved reliability. Moreover, processor performance improves by reducing the performance degradation due to DTM techniques. Power consumption also can be reduced by decreased temperature and reduced execution time.