• 조명전기설비학회논문지
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• 제29권1호
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• pp.1-8
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• 2015

To produce the white light, there are a single chip method using the blue light and phosphor coating, a multi chip method by mixing R, G, B light.. Multi chip method is proper for the smart lighting system by controling color and color temperature. And color rendering of single chip LED is good by even spectral distribution. To apply application technic like smart light system, this paper analyzed the properties of single chip LED and RGB multi chip LED, and implemented the 2 part subject evaluation for single chip LED and RGB multi chip LED. The first part is comparison of properties for single chip LED and RGB multi chip and second part is color appearance evaluation of 8 colors in each lighting environment.

• 한국시뮬레이션학회논문지
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• 제26권1호
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• pp.69-75
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• 2017

MCP(Multi-chip Package)는 두 개 이상의 Chip을 적층하여 하나의 패키지로 합친 제품이다. MCP를 만들기 위해서는 두 개 이상의 Chip이 동일한 Substrate에 적층되기 때문에 다수의 조립 공정이 필요하다. Package 공정에서는 Lot들이 동일한 특성을 가지는 Chip으로 구성되고 MCP를 구성하는 Chip의 특성은 Layer sequence에 의해 결정된다. MCP 생산 공정에서 WIP Balance 뿐만 아니라 Throughput을 달성하기 위해서는 Chip의 Layer sequence가 중요하다. 본 논문에서는 Chip들의 Layer sequence의 제약 조건을 고려한 스케쥴링 방법론을 제안한다.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2012년도 춘계학술대회 논문집
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• pp.71-72
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• 2012

• Transactions on Electrical and Electronic Materials
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• 제5권4호
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• pp.138-142
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• 2004

This paper presents the improved bum-in method for the reliability of SRAM in Multi Chip Package (MCP). Semiconductor reliability is commonly improved through the bum-in process. Reliability problem is more significant in MCP that includes over two chips in a package, because the failure of one chip (SRAM) has a large influence on the yield and quality of the other chips - Flash Memory, DRAM, etc. Therefore, the quality of SRAM must be guaranteed. To improve the quality of SRAM, we applied the improved wafer level bum-in process using multi cells selection method in addition to the previously used methods. That method is effective in detecting special failure. Finally, with the composition of some kind of methods, we could achieve the high quality of SRAM in Multi Chip Package.

• 한국전기전자재료학회논문지
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• 제18권6호
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• pp.506-509
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• 2005

This paper presents the improved burn-in method for the reliability of SRAM in Multi Chip Package (MCP). Semiconductor reliability is commonly improved by the burn-in process. Reliability Problem is very significant in the MCP which includes over two chips in a package because the failure of one SRAM chip has a large influence on the yield and quality of the other chips such as Flash Memory, DRAM, etc. Therefore the quality of SRAM must be guaranteed. To improve the qualify of SRAM, we applied the improved wafer level burn-in process using multi cell selection method in addition to the previously used methods and it is found to be effective in detecting particular failures. Finally, with the composition of some kinds of methods, we achieved the high quality of SRAM in MCP.

• 대한기계학회논문집A
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• 제28권6호
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• pp.774-782
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• 2004

This article presents a numerical and experimental investigation for the single-phase forced laminar convective heat transfer through arrays of micro-channels in micro heat exchangers to be used for cooling power-intensive semiconductor packages, especially the stacked multi-chip modules. In the numerical analysis, a parametric study was carried out for the parameters affecting the efficiency of heat transfer in the flow of coolants through parallel rectangular micro-channels. In the experimental study, the cooling performance of the micro heat exchanger was tested on prototypes of stacked multi-chip modules with difference channel dimensions. The simulation results and the experiment data were acceptably accordant within a wide range of design variations, suggesting the numerical procedure as a useful method for designing the cooling mechanism in stacked multi-chip packages and similar electronic applications.

• 대한전자공학회논문지SD
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• 제42권2호
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• pp.65-72
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• 2005

공정기술과 EDA 툴의 발전에 따라서 하나의 실리콘 다이(Die)에 많은 IP가 집적되고 멀티프로세서가 포함되는 SoC 구조가 가능해지고 있다 그러나 대부분의 기존 SoC 버스는 공유버스 구조라는 문제점으로 인해 통신의 병목현상이 발생하고 이는 전체 시스템 성능을 저하시키는 요인이 된다. 많은 경우에 멀티프로세서 시스템의 성능은 CPU 자체의 속도보다는 효율적인 통신과 균형있는 연산의 분배가 좌우하게 된다 따라서 충분한 SoC 버스 대역폭(Bandwidth)을 확보하기 위한 하나의 해결책으로 크로스바 라우터(Crossbar Router)를 이용하여 효율적인 온 칩 버스구조인 SoC Network Architecture(SNA)를 제안한다. 제안된 SNA구조는 다중 마스터(multi-master)에 대해 다중 채널(multi-channel)을 제공하여 통신의 병목현상을 크게 줄일 수 있으며 뛰어난 확장성을 지원한다. 제안된 구조에 따라 모델 시스템을 설계하고 시뮬레이션을 진행한 결과 AMBA AHB 버스에 비해 평균 $40\%$ 이상 효율이 증가했다.

• 전자공학회지
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• 제20권11호
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• pp.46-53
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• 1993

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2004년도 추계학술대회 논문집 Vol.17
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• pp.53-56
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• 2004

This paper presents the improved burn-in method for the reliability of SRAM in MCP Semiconductor reliability is commonly improved through the burn-in process. Reliability problem is more significant in the Multi Chip Package, because of including over two devices in a package. In the SRAM-based Multi Chip Package, the failure of SRAM has a large effect on the yield and quality of the other chips - Flash Memory, DRAM, etc. So, the quality of SRAM must be guaranteed. To improve the quality of SRAM, we applied the improved wafer level burn-in process using multi cell selection method in addition to the current used methods. That method is effective in detecting special failure. Finally, with the composition of some kinds of methods, we could achieve the high qualify of SRAM in Multi Chip Package.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2010년도 추계학술대회 논문집
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• pp.545-546
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• 2010